Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions

VisualWikitext

@@ Line 1: / Line 1: @@
+{{cc-nanolab}}
-[[Image:EVG NIL.jpg|300x300px|thumb|EVG NIL: positioned in D-4]]
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Wafer_Bonder_02 click here]'''
-The EVG NIL is a system for imprinting in polymers (Hot embossing), and for bonding on wafer scale. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult.
+<br>
+<br>
-It is possible to fill bonded cavities with a desired gas. At the moment we have SF<sub>6</sub> on the system, but if you would like another one, please contact Rune Christiansen.
+=Wafer Bonder 02=
+[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]]
+The Wafer bonder 02 is a system for bonding. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces.
 '''The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager:'''
-Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=153| LabManager]
+Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=366| LabManager]
 <br clear="all" />
+==Process information==
-==Process information==
 ====Types of Bonding====
 *[[Specific Process Knowledge/Bonding/Eutectic bonding|Eutectic bonding]]
 *[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]]
 *[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]]
+<br>
+==Overview of the performance of the Wafer Bonder 02 and some process related parameters==
-====Imprint information====
-*[[Specific Process Knowledge/Imprinting|Imprinting]]
-==Overview of the performance of the EVG NIL and some process related parameters==
 {| border="2" cellspacing="0" cellpadding="10"
 |-
 !style="background:silver; color:black;" align="left"|Purpose
-|style="background:LightGrey; color:black"|Imprint and bonding
+|style="background:LightGrey; color:black"|Bonding
 |style="background:WhiteSmoke; color:black"|
 *Eutectic bonding
 *Fusion bonding
 *Anodic bonding
-*Imprinting
 |-
 !style="background:silver; color:black" align="left"|Performance
 |style="background:LightGrey; color:black"|Alignment accuracy
 |style="background:WhiteSmoke; color:black"|
-*&plusmn; 5 microns for IR alignment
+*&plusmn; 2 microns for IR alignment
-*&plusmn; 10 microns for backside alignment
+*&plusmn; 5 microns for backside alignment
 |-
 |-
@@ Line 46: / Line 44: @@
 |style="background:LightGrey; color:black"|Process pressure
 |style="background:WhiteSmoke; color:black"|
-*~5<math>\cdot</math>10<sup>-4</sup>mbar - 2000mbar
+*~5<math>\cdot</math>10<sup>-4</sup>mbar - 1000mbar
 |-
 |style="background:LightGrey; color:black"|Piston Force
 |style="background:WhiteSmoke; color:black"|
-*Depending on the area, for 4" wafers 200-20000N.
+*Depending on the area, for 4" wafers 200-6000 mbar.
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*One 4" or 6" wafer per run
+*One wafer per run
-*Pieces are only allowed with speciel permission
+*Pieces
 |-
 | style="background:LightGrey; color:black"|Substrate material allowed
@@ Line 69: / Line 67: @@
 *Silicon (oxy)nitride
 *Poly Silicon
-*Photoresist
+*Metals: Au, Sn, Ag, Al, Ti
-*PMMA
-*TOPAS
-*SU-8
-*Metals: Au, Sn, Ag, Al, Ti.
 |-
 |}