Specific Process Knowledge/Back-end processing: Difference between revisions

Latest revision as of 11:43, 8 September 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.

Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Stylus profilometer measurements
- Stylus Profiler:Dektak150
Chip/die mounting
- Die Bonder (eutectic metal) Will be temporary taken out of service during the PolyFabLab construction.
Wire bonding
- TPT Wire Bonder Will be temporary taken out of service during the PolyFabLab construction.
- Ball Wire Bonder
Wafer dicing/machining
Molding
- Polymer Injection Molder
- Hot Embosser
Pick & place
- Micro transfer printer

Choose processing method

Lapping/polishing	Cutting/cleaving	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber LatticeAxe FlipScribe FlexScribe Dicing Saw Disco DAD 321 (old saw) Dicing Saw Disco DAD 3241 (new saw 2021) Laser Micromachining Tool	Laser Micromachining Tool	Die Bonder (eutectic metal)	TPT Wire Bonder Ball Wire Bonder

@@ Line 1: / Line 1: @@
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+<!-- Under construction [[Image:section under construction.jpg|70px]] -->
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
-These processes are usually carried out a number of different places at DTU Danchip. At Danchip we also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
+[[Image:section under construction.jpg|70px|left]]
+{| {{table} style="background:LightGray"}
+! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
+|-
+| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
+|-
+|}
-Below you can see a list of equipment for back-end processing that is available at DTU Danchip.
+<br clear="all">
+Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
 == Choose an equipment ==
+* Stylus profilometer measurements
+**[[Specific Process Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
 * Chip/die mounting
-**[[/Die Bonder|Die Bonder (eutectic metal)]]
+**[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
-**[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
 *Wire bonding
-**[[/Wire Bonder|TPT Wire Bonder]]
+**[[/Wire Bonder|TPT Wire Bonder]]  [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.'''
 **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
 *Wafer dicing/machining
+**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
 **[[/Polishing machine|Polisher/Lapper machine]]
+**[[/LatticeAxe|LatticeAxe]]
+**[[/FlipScribe|FlipScribe]]
+**[[/FlexScribe|FlexScribe]]
 **[[/Wafer Scriber|Wafer Scriber]]
-**[[/Disco Saw|Disco Saw]]
+**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
+**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
 **[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]
 *Molding
 **[[/Polymer Injection Molder|Polymer Injection Molder]]
+**[[/Hot Embosser|Hot Embosser]]
+<!--
 * X-ray inspection system
 **[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
+ -->
+*Pick & place
+**[[/Micro transfer printer|Micro transfer printer]]
 == Choose processing method ==
 {| {{table}}
 | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
-| align="left" valign="top"  style="background:LightGray"|''' Cutting'''
+| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
 | align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
 | align="left" valign="top" style="background:LightGray"|''' Die bonding'''
@@ Line 37: / Line 60: @@
 *[[/Polishing machine|Polisher/Lapper machine]]
 |style="background: LightGray"|
 *[[/Wafer Scriber|Wafer Scriber]]
-*[[/Disco Saw|Disco Saw]]
+*[[/LatticeAxe|LatticeAxe]]
+*[[/FlipScribe|FlipScribe]]
+*[[/FlexScribe|FlexScribe]]
+*[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
+*[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
 |style="background: LightGray"|
 *[[/Laser Micromachining Tool|Laser Micromachining Tool]]
-*[http://portalen.dtu.dk/Institutter/DTU_Nanotech.aspx Nanotech milling lab]
+<!-- *[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab] -->
 |style="background: LightGray"|
 *[[/Die Bonder|Die Bonder (eutectic metal)]]
-*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]]
+<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
 |style="background: LightGray"|
 *[[/Wire Bonder|TPT Wire Bonder]]