Specific Process Knowledge/Etch/III-V ICP/GaN: Difference between revisions
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<!--Checked for updates on 11/2-2019 - ok/jmli --> | |||
===GaN etching=== | ===GaN etching using III-V ICP=== | ||
{| border="1" cellspacing="2" cellpadding="3" | {| border="1" cellspacing="2" cellpadding="3" | ||
|'''Recipe''' | |'''Recipe''' | ||
|'''GaN Etch''' | |'''GaN Etch''' | ||
|'''GaN Etch for Si check''' | |||
|- | |- | ||
|Cl<sub>2</sub> flow | |Cl<sub>2</sub> flow | ||
|30 sccm | |30 sccm | ||
|27 sccm | |||
|- | |- | ||
|Ar flow | |Ar flow | ||
|10 sccm | |10 sccm | ||
|3 sccm | |||
|- | |||
|BCl3 flow | |||
|0 sccm | |||
|3 sccm | |||
|- | |- | ||
|Platen power | |Platen power | ||
|200 W | |200 W | ||
|75 W | |||
|- | |- | ||
|Coil power | |Coil power | ||
|600 W | |600 W | ||
|400 W | |||
|- | |- | ||
|Pressure | |Pressure | ||
|2 mTorr | |2 mTorr | ||
|4 mTorr | |||
|- | |- | ||
|Platen chiller temperature | |Platen chiller temperature | ||
|20 <sup>o</sup>C | |||
|20 <sup>o</sup>C | |20 <sup>o</sup>C | ||
|- | |- | ||
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|~ 90 <sup>o</sup> | |~ 90 <sup>o</sup> | ||
|- | |- | ||
|} | |||
{| border="1" cellspacing="2" cellpadding="3" align="left" | |||
|colspan="2" align="center"| '''Results (GaN Etch for Si check)''' | |||
|- | |||
|Si etch rate | |||
|~200 nm/min (bghe 2017-01-17) full 4" wafer | |||
|} | |} | ||
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{| border="1" cellspacing="2" cellpadding="3" | {| border="1" cellspacing="2" cellpadding="3" |
Latest revision as of 14:43, 18 August 2021
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GaN etching using III-V ICP
Recipe | GaN Etch | GaN Etch for Si check |
Cl2 flow | 30 sccm | 27 sccm |
Ar flow | 10 sccm | 3 sccm |
BCl3 flow | 0 sccm | 3 sccm |
Platen power | 200 W | 75 W |
Coil power | 600 W | 400 W |
Pressure | 2 mTorr | 4 mTorr |
Platen chiller temperature | 20 oC | 20 oC |
Results (GaN Etch) | |
GaN etch rate | 550-580 nm/min |
SiO2 etch rate | 110-120 nm/min |
Sidewall angle | ~ 90 o |
Results (GaN Etch for Si check) | |
Si etch rate | ~200 nm/min (bghe 2017-01-17) full 4" wafer |