Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/isotropic/isoslow1: Difference between revisions
Created page with " {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" |+ '''Process runs''' |- ! rowspan="2" width="40"| Date ! colspan="4" width="120"| Substrate Informat..." |
No edit summary |
||
| (3 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
<!--Checked for updates on 11/2-2019 - ok/jmli --> | |||
<!--Checked for updates on 15/10-2021 - ok/jmli --> | |||
<!--Checked for updates on 4/4-2025 - ok/jmli --> | |||
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | ||
| Line 23: | Line 26: | ||
| ICP Metal Etch / jmli | | ICP Metal Etch / jmli | ||
| 2*30 sec barc etch using 'slow etch with carrier' | | 2*30 sec barc etch using 'slow etch with carrier' | ||
| isoslow1 , 2:00 minutes | | danchip/jmlli/Si/isotropice/isoslow1 , 2:00 minutes | ||
| S005292 | | S005292 | ||
| | | | ||