Specific Process Knowledge/Etch/DRIE-Pegasus/ProcessA/PrA-2: Difference between revisions
No edit summary |
No edit summary |
||
| (4 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/ProcessA/PrA-2 click here]''' | |||
<!--Checked for updates on 30/7-2018 - ok/jmli --> | |||
<!--Checked for updates on 5/10-2020 - ok/jmli --> | |||
<!--Checked for updates on 28/6-2023 - ok/jmli --> | |||
{{contentbydryetch}} | |||
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | ||
| Line 76: | Line 81: | ||
| C04047.03 | | C04047.03 | ||
| | | | ||
[[file:C04047.03 099.jpg|150px|frameless ]] | |||
[[file:C04047.03 100.jpg|150px|frameless ]] | |||
[[file:C04047.03 101.jpg|150px|frameless ]] | |||
[[file:C04047.03 102.jpg|150px|frameless ]] | |||
[[file:C04047.03 103.jpg|150px|frameless ]] | |||
[[file:C04047.03 104.jpg|150px|frameless ]] | |||
[[file:C04047.03 105.jpg|150px|frameless ]] | |||
[[file:C04047.03 106.jpg|150px|frameless ]] | |||
[[file:C04047.03 107.jpg|150px|frameless ]] | |||
[[file:C04047.03 108.jpg|150px|frameless ]] | |||
[[file:C04047.03 109.jpg|150px|frameless ]] | |||
[[file:C04047.03 097.jpg|150px|frameless ]] | |||
[[file:C04047.03 098.jpg|150px|frameless ]] | |||
|- | |- | ||
| Line 85: | Line 103: | ||
| C04047.06 | | C04047.06 | ||
| | | | ||
[[file:C04047.06 145.jpg|150px|frameless ]] | |||
[[file:C04047.06 146.jpg|150px|frameless ]] | |||
[[file:C04047.06 147.jpg|150px|frameless ]] | |||
[[file:C04047.06 148.jpg|150px|frameless ]] | |||
[[file:C04047.06 149.jpg|150px|frameless ]] | |||
[[file:C04047.06 150.jpg|150px|frameless ]] | |||
[[file:C04047.06 151.jpg|150px|frameless ]] | |||
[[file:C04047.06 152.jpg|150px|frameless ]] | |||
[[file:C04047.06 153.jpg|150px|frameless ]] | |||
[[file:C04047.06 139.jpg|150px|frameless ]] | |||
[[file:C04047.06 140.jpg|150px|frameless ]] | |||
[[file:C04047.06 141.jpg|150px|frameless ]] | |||
[[file:C04047.06 142.jpg|150px|frameless ]] | |||
[[file:C04047.06 143.jpg|150px|frameless ]] | |||
[[file:C04047.06 144.jpg|150px|frameless ]] | |||
|- | |- | ||
|} | |} | ||
Latest revision as of 11:36, 28 June 2023
Feedback to this page: click here
Unless otherwise stated, the content of this page was created by the dry etch group at DTU Nanolab
| Date | Substrate Information | Process Information | SEM Images | |||
|---|---|---|---|---|---|---|
| Wafer info | Exposed area | Conditioning | Recipe | Wafer ID | ||
| 2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C03991.03 |
|
| 2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C03991.06 |
|
| 3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C04047.03 |
|
| 3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-2, 80 cycles or 14:40 minutes | C04047.06 |
|
