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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/DUVetch click here]'''
<!--Checked for updates on 14/5-2018 - ok/jmli -->
<!--Checked for updates on 24/8-2021. ok/ jmli-->
<!--Checked for updates on 4/4-2025 - ok/jmli -->
== Etch processes designed for stepper resists ==  
== Etch processes designed for stepper resists ==  


Line 141: Line 146:
| -      <!-- hardware setting -->
| -      <!-- hardware setting -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
| very stable, excellent and extensive track record    <!-- keywords -->
| Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record    <!-- keywords -->
|-
 
|}
 
 
 
= With units =
 
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Process parameters'''
|-
! rowspan="4" width="100"| Recipe
! rowspan="4" width="20"| Step
! rowspan="3" width="20"| Temp.
! colspan="6" | Deposition step
! colspan="14" | Etch step
! colspan="3" | Process
|-
! width="40" rowspan="2"| Time
! width="40" rowspan="2"| Pressure
! width="40" rowspan="2"| C<sub>4</sub>F<sub>8</sub>
! width="40" rowspan="2"| SF<sub>6</sub>
! width="40" rowspan="2"| O<sub>2</sub>
! width="40" rowspan="2"| Coil
! width="40" colspan="2"| Time
! width="40" colspan="2"| Pressure
! width="40" colspan="2"| C<sub>4</sub>F<sub>8</sub>
! width="40" colspan="2"| SF<sub>6</sub>
! width="40" colspan="2"| O<sub>2</sub>
! width="40" colspan="2"| Coil
! width="40" colspan="2"| Platen
! width="40" rowspan="3"| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]
! width="40" rowspan="3"| Runs
! width="300" rowspan="3"| Keywords
|-
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
|-
| degs
| s
| mt
| sccm
| sccm
| sccm
| W
| s
| s
| %
| mt
| sccm
| sccm
| sccm
| sccm
| sccm
| sccm
| W
| W
| W
| W
|-
! NBoost04  <!--recipe name  -->
| A  <!-- step -->
| 20  <!-- chiller temperature -->
! 2.8  <!-- dep time -->
| 5  <!-- dep pressure -->
| 60  <!-- dep C4F8 flow -->
| 0    <!-- dep SF6 flow -->
| 0  <!-- dep O2 flow -->
| 500  <!-- dep coil power -->
| 1.5  <!-- etch:boost time-->
| 3.5  <!-- etch:main time -->
| 30%  <!-- etch:boost pressure-->
| 5  <!-- etch:main pressure -->
| 0  <!-- etch:boost C4F8 flow-->
| 20  <!-- etch:main C4F8 flow -->
| 100  <!-- etch:boost SF6 flow-->
| 100  <!-- etch:main SF6 flow -->
| 0  <!-- etch:boost O2 flow-->
| 0  <!-- etch:main O2 flow -->
| 500    <!-- etch:boost coil power-->
| 500  <!-- etch:main coil power -->
| 50    <!-- etch:boost platen power-->
| 10    <!-- etch:main platen power -->
| LF+B100    <!-- etch:boost -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/nBoost04 | 2]]      <!-- link processes -->
|width="120"|  VERY nice: scallops, straight sidewalls <!-- key words -->
|-
|}
 
 
{| border="1" cellpadding="1" cellspacing="1" style="text-align:center;"
|+ '''Process parameters'''
|-
! rowspan="3" width="100"| Recipe
! rowspan="3" width="20"| Step
! rowspan="2" width="20"| Temp.
! colspan="6" | Deposition step
! colspan="7" | Etch step
! colspan="3" | Process observations
 
|-
! width="40" | Time
! width="40" | Pressure
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
! width="40" | Time
! width="40" | Pressure
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Platen power|Platen]]
| rowspan="2" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]
! width="40" rowspan="2" | Runs
! width="300" rowspan="2" | Key words
|-
| degs
| s
| mt
| sccm
| sccm
| sccm
| W
| s
| mt
| sccm
| sccm
| sccm
| W
| W
|-
! polySOI-10    <!-- recipe name -->
| etch      <!-- step -->
| 20      <!-- chiller temp -->
| 2.5      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
|  0      <!-- SF6 flow -->
|  0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5      <!-- etch time -->
| 10      <!-- etch pressure -->
| 20      <!-- C4F8 flow -->
| 60      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
|  40      <!-- platen power -->
| -      <!-- hardware setting -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10 | 5]]      <!-- link processes -->
| very nice, blurred scallops    <!-- keywords -->
|-
! polySOI-10a    <!-- recipe name -->
| etch      <!-- step -->
| 20      <!-- chiller temp -->
| 2.5      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
|  0      <!-- SF6 flow -->
|  0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5      <!-- etch time -->
| 10      <!-- etch pressure -->
| 10      <!-- C4F8 flow -->
| 70      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
|  40      <!-- platen power -->
| -      <!-- hardware setting -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
| Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record    <!-- keywords -->
|-
|-


|}
|}
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