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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]'''
=Back-end processing=
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
<BR>
<BR>
{|style="background:LightGray"}
! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.'''
<br>
Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.
|-
|}
<br clear="all">
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
== Choose an equipment ==
== Choose an equipment ==


*[[/Wire Bonder|Wire Bonder]]
* Chip/die mounting
*[[/Wafer Scriber|Wafer Scriber]] - ''writer: Yvonne''
**[[/Die Bonder|Die Bonder (eutectic metal)]]
*[[/Disco Saw|Disco Saw]]
<br>
*Wire bonding
**[[/Wire Bonder|TPT Wire Bonder]]  
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
<br>
*Wafer Dicing and Machining
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]]
**[[/Polishing machine|Polisher/Lapper machine]]
**[[/LatticeAxe|LatticeAxe]]
**[[/FlipScribe|FlipScribe]]
**[[/FlexScribe|FlexScribe]]
**Wafer Scriber
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]]
**[[/Laser Micromachining Tool|Laser Micromachining Tool]]
<br>
*Pick & place
**[[/Micro transfer printer|Micro transfer printer]]
 
<!--
* X-ray inspection system
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]]
-->
 
== Choose processing method ==
{| {{table}}
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing'''
| align="left" valign="top"  style="background:LightGray"|''' Cutting/cleaving'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling'''
| align="left" valign="top" style="background:LightGray"|''' Die bonding'''
| align="left" valign="top" style="background:LightGray"|''' Wire bonding'''
|-valign="top"
|style="background: LightGray"|
*[[/Polishing machine|Polisher/Lapper machine]]
|style="background: LightGray"|
*Diamond Pen (Wafer Scriber)
*[[/LatticeAxe|LatticeAxe]]
*[[/FlipScribe|FlipScribe]]
*[[/FlexScribe|FlexScribe]]
*[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]]
*[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]]
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
|style="background: LightGray"|
*[[/Laser Micromachining Tool|Laser Micromachining Tool]]
<!-- *[https://www.inside.dtu.dk/en/medarbejder/institutter/dtu-nanotech Nanotech milling lab] -->
|style="background: LightGray"|
*[[/Die Bonder|Die Bonder (eutectic metal)]]
<!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] -->
|style="background: LightGray"|
*[[/Wire Bonder|TPT Wire Bonder]]
*[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]]
|-
|}

Latest revision as of 15:53, 3 July 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here


Back-end processing

Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! The SupportLab (former Packlab) has been established and tools are currently relocated.


Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment





Choose processing method

Lapping/polishing Cutting/cleaving Milling Die bonding Wire bonding
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