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Specific Process Knowledge/Characterization/Lifetime scanner MDPmap: Difference between revisions

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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap click here]'''
 
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[[image:Lifetimescanner04.jpg|400x400px|right|thumb|Lifetime scanner MPDmap, positioned in cleanroom F-2.]]
[[image:Lifetimescanner04.jpg|400x400px|right|thumb|Lifetime scanner MPDmap, positioned in cleanroom D-3.]]


== Microwave Detected Photoconductivity (MDP) ==
== Microwave Detected Photoconductivity (MDP) ==
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== Performance information ==
== Performance information ==


'''Range of lifetimes''': 20 ns to several ms
'''The resistivity range for lifetime measurements''' 0.2 to 100 Ohm.cm, p/n
'''Material''': Silicon, epitaxial layers, partially or fully processed wafers, compound semiconductors and beyond.
'''Measureable properties''': Carrier lifetime (steady state or non equilibrium (µ -PCD) selectable), photoconductivity (steady state) microwave Photoconductance Decay (µ-PCD)


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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*D-3
*Cx1


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*405 nm
*405 nm
**Power 5 mW to 100 mW
**Power 5 mW to 100 mW
*978 nm
*977 nm
**Power 5 mW to 140 mW
**Power 5 mW to 190 mW
*975 nm
*975 nm
**Power 0.5 W to 4.0 W
**Power 0.5 W to 4.0 W
*977 nm
**Power up to 200 µW
*Spot diameter for all laser 0.5 µm
*Spot diameter for all laser 0.5 µm
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