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==Coaters: Comparison Table==
{{cc-nanolab}}


[[Category: Equipment |Lithography coaters]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Coaters click here]'''
 
[[Category: Equipment|Lithography coaters]]
[[Category: Lithography|Coaters]]
[[Category: Lithography|Coaters]]
[[Category: Thin Film Deposition|Coaters]]


__TOC__


=Coater Comparison Table=


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Spin Coater: Gamma UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper|Spin Coater: Süss Stepper]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spinner_.28Polymers.29|Manual Spinner (Polymers)]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Labspin|Spin Coater: LabSpin 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_LabSpin_04|Spin Coater: LabSpin 04]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin coater: Manual Labspin|Spin coater: Manual labspin]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater|Spray Coater]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]</b>
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
!style="background:silver; width:100px; color:black;" align="center"|Purpose  
|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps)
**AZ nLOF 2020
**AZ 5214E
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
*Coating and baking of
**AZ5214E resist
**BARC (DUV42S-6)
**AZ4562 resist
**KRF M230Y
**E-beam resist
**KRF M35G
|style="background:WhiteSmoke; color:black"|
**UVN2300-0.8
*Coating of
**SU-8 resist
**AZ 5214E resist
**AZ 4562 resist
**AZ MiR resist
**AZ nLOF resist
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*In-line substrate HMDS priming
*Coating and baking of  
*Coating and baking of  
**AZ MiR 701 (29cps) resist
**AR-P 6200 (CSAR)
**AZ nLOF 2020 resist
**AZ 5214E
*Post-exposure baking at 110°C
**AZ MiR 701 (29cps)
**AZ 4562
*Edge bead removal on novolac-based resist and SU-8
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating of all resists
*Coating of
|style="background:WhiteSmoke; color:black"|
**SU-8
*Coating of all resist
**AZ 5214E
**AZ 4562
**AZ MiR
**AZ nLOF
*Edge bead removal
|colspan="2" style="background:WhiteSmoke; color:black"|
*Coating of E-beam resists
** CSAR, ZEP, PMMA/MMA, HSQ(FOx)
*Coating of UV resists
**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8
*Coating of imprint resists
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating of
*Coating of
** UV sensetive resist
**SU-8
** E-beam resist
**mr-DWL
**other resists
OBS: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spraying imprint resist
*Spraying imprint resist
Line 51: Line 70:
*Spraying of other solutions
*Spraying of other solutions
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette  
* Cassette-to-cassette
* Edge handling chuck
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Vacuum handling and detection
* Vacuum spin chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Vacuum chuck for 4" and 6"
* 4" non-vacuum chuck for fragile substrates
|colspan="2" style="background:WhiteSmoke; color:black"|
* Single substrate
* Single substrate
* Non-vacuum chuck for fragile substrates
* Vacuum chucks for chips, 2", 4", and 6"
* 4" edge handling chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Single substrate
|colspan="3" align="center"|Single substrate
* Vacuum chucks for chips, 4", and 6"
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Can handle almost any sample size and shape
Can handle almost any sample size and shape
|-
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* AZ MiR 701 (29cps) resist
* AZ4562 resist
* AZ nLOF 2020 resist
* Acetone for chuck cleaning
* AZ 5214E resist
* Acetone for drip pan
* PGMEA solvent for backside rinse and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
* DUV42S-6 (BARC)
* KRF M230Y resist
* KRF M35G resist
* PGMEA solvent for edge bead removal and backside rinse
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AR-P 6200.09 (CSAR) for 2", 4", and 6"
* AZ nLOF 2020 resist
* AZ5214E for 2", 4", and 6"
* PGMEA for backside rinse and edge-bead removal
* AZ MiR 701 (29cps) for 4", and 6"
* PGMEA for spinner bowl cleaning and vapor tip bath
* AZ4562 for 4", and 6"
|colspan="3" rowspan="2" align="center"|Only manual dispense
* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning
|style="background:WhiteSmoke; color:black"|
No permanent media
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* No permanent media
No permanent media
|-


|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
* no manual dispense
* syringe dispense (60cc) of PGMEA-based resist
|style="background:WhiteSmoke; color:black"|
* no manual dispense
* syringe dispense (60cc) of PGMEA and anisole-based resist
|style="background:WhiteSmoke; color:black"|
* no manual dispense
* syringe dispense (30cc) of PGMEA and anisole-based resist (2" only)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* yes
* yes
* pneumatic dispense for SU-8 resist
* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span>
|colspan="2" style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|Only manual dispense
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no
Two syringe pumps
|style="background:WhiteSmoke; color:black"|
|-
* Two syringe pumps


|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 5000 rpm (3000 rpm with non-vacuum chuck)
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
10 - 6000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
10 - 5000 rpm (3000 rpm with non-vacuum chuck)
|colspan="2" style="background:WhiteSmoke; color:black"|
100 - 8000 rpm (3000 rpm with edge handling chuck)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 - 5000 rpm
100 - 8000 rpm
|style="background:WhiteSmoke; color:black"|
*100 - 7000 rpm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:LightGrey; color:black"|Gyrset
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*optional
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*optional (max. speed 3000 rpm)
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*optional
optional (max. speed 3000 rpm)
|colspan="2" style="background:WhiteSmoke; color:black"|
no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*no
no
|style="background:WhiteSmoke; color:black"|
*no
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:LightGrey; color:black"|Substrate  size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*50 mm wafers (tool change required)
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
|style="background:WhiteSmoke; color:black"|
*200 mm wafers (tool change required)
*100 mm wafer
*150 mm wafer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*100 mm wafers
*150 mm wafers (tool change required)
*150 mm wafers
*200 mm wafers (may require tool change)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*2" or 50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*100 mm wafer
*150 mm wafer
|colspan="2" style="background:WhiteSmoke; color:black"|
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafer
*150 mm wafer
*small pieces down to 10x10 mm2
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafer
*150 mm wafer
*small pieces down to 3x3 mm2
*small pieces down to 5x5 mm2
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Any sample(s) that fit inside machine
Any sample(s) that fit inside machine
|-
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-24
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-25
1 - 25
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|colspan="2" style="background:WhiteSmoke; color:black"|
1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1
1
|style="background:WhiteSmoke; color:black"|
*1
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
*Silicon
|style="background:WhiteSmoke; color:black"|
*Glass
*All cleanroom materials except III-V materials
 
'''No resist or crystalbond allowed in the HMDS module'''
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon  
*Silicon  
*Glass
*Glass
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
*Silicon
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
*III-V materials
*III-V materials
*Si, SiO2, SOI
*Glass
|style="background:WhiteSmoke; color:black"|
*All chemicals to be spray coated must be approved specifically for spray coating
*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved
|-
|}
 
<br clear="all" />
 
==SSE Spinner==
[[Image:SSEspinner2.jpg|300x300px|thumb|right|The SSE spinner MAXIMUS: positioned in E-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#SSE_Spinner click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
 
The system is equipped with 2 different resists lines:
*AZ 5214E
*AZ 4562
and
*2 syringe lines, which can be used for spinning of e-beam resist.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=188 LabManager]'''
 
===Process information===
 
The typical flow for resist spinning is divided in 3 steps: video, spinning and soft bake.
You need to create a separate recipe for each station and then collect the recipes in a flow. For the video station we have 3 standard recipes for 3 different wafer sizes: 2inch, 4inch, 6inch. To create a recipe for the coater station you need to describe spinning sequence using the predefined functions. Then you create recipe for the hotplates. After all recipes are created they can be set together in the different flows. It is why we are not recommending the user just change some parameters in the recipe, this change can effect some other flows.
 
*[[Specific Process Knowledge/Lithography/Coaters/General SSE spinner process information|General SSE spinner process information]]
*[[Specific Process Knowledge/Lithography/Coaters/SSE Spinner AZ5214e coating|AZ5214E coating on SSE Spinner]]
 
''Flow names, process parameters, and test results:''
*'''DCH 100mm 1,5µm AZ5214E'''
Spin-off: xx s at yyyy rpm.
 
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
|-
 
|-
|-style="background:silver; color:black"
!Substrate
!Thickness
!Uniformity (+/-)
!Test date
!Tester initials
!Comments
|-
 
 
 
|-
|-style="background:WhiteSmoke; color:black"
|Silicon with native oxide
|1,415
|3,7%
|1/4 2015
|chasil
|with HMDS. Average of 3 wafers
 
 
|-
|-style="background:WhiteSmoke; color:black"
|Silicon with native oxide
|1,367
|3,1%
|10/7 2015
|chasil
|with HMDS. Average of 3 wafers
 
|}
 
<br clear="all" />
 
<br clear="all" />
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"


 
'''No resist or crystalbond allowed in the HMDS module'''
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating and soft baking E-beam resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E
* AZ4562
* E-beam resists
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ4526 6,2-25 µm
* E-beam resits 0,1-1 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* 90°C for softbaking of AZ5214E resist
* 100°C for softbaking of AZ4562 resist
* 110°C for reverse baking of AZ5214E resits
* 180°C for softbaking of e-beam resits
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
All cleanroom materials except III-V materials
|-
|colspan="2" style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Batch
*Silicon
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*III-V materials
1 - 24
*Glass
|-
|}
 
<br clear="all" />
 
==Spin Track 1 + 2==
 
[[image:SpinTrack.jpg|300x257px|right|thumb|Spin Track 1 + 2 in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
 
The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]'''
 
===Process information===
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#Post-exposure baking (PEB)|Post-exposure baking on Spin Track 2]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Spin Track
|style="background:WhiteSmoke; color:black" align="center"|<b>1</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
All PolyFabLab materials
*Spin coating and soft baking
*Priming, coating, and baking
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*All chemicals to be spray coated must be approved specifically for spray coating
*Spin coating and soft baking
*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved
*Priming, coating, and baking
*Post-exposure baking
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ MiR 701 (29cps)
 
positive tone
|style="background:WhiteSmoke; color:black" align="center"|
AZ nLOF 2020
 
negative tone
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
1 - 3 µm
|style="background:WhiteSmoke; color:black" align="center"|
1 - 4 µm
|-
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
60° - 90°; standard recipe 82° (on SiO2)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 9990 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1000 - 50000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
90°C
|style="background:WhiteSmoke; color:black" align="center"|
110°C
|-
|style="background:LightGrey; color:black"|HMDS priming temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
50°C
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Silicon and glass wafers
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 25
|-
|}
 
<br clear="all" />
 
==Spin Coater: Gamma UV==
 
===This section is under construction [[Image:section under construction.jpg|70px]]===
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
...
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''
 
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]===
 
[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes:]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#HMDS_priming_2|HMDS]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_MiR_701_.2829cps.29_coating|AZ MiR 701]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_nLOF_2020_coating|AZ nLOF 2020]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#AZ_5214E_coating|AZ 5214E]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*Spin coating of PGMEA based UV resists
*Spin coating of E-beam resists <sup>1)</sup>
*Soft baking
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps)
* AZ nLOF 2020
* AZ 5214E
* 100cc syringe dispense
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center"|
60 - 80°
|-
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701: 1.5-4 µm
* AZ nLOF 2020: 1.5-5 µm
* AZ 5214E: 1.5-5 µm
* AZ 4562: 5-15 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
|style="background:LightGrey; color:black"|Priming temperature
|style="background:WhiteSmoke; color:black" align="center"|
25 - 120 °C
|-
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
10 - 7000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
10 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
25 - 200 °C
|-
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:WhiteSmoke; color:black" align="center"|
21 °C
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers <sup>1)</sup>
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers <sup>1)</sup>
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon and glass
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1-25
|-
|}
 
<sup>1)</sup> Requires tool change.
 
<br clear="all" />
 
==Spin Coater: RCD8==
[[Image:Spinner_RCD8_C-1.jpg|300x300px|thumb|Spin coater: RCD8 is located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8 click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. However, due to the possibility of using a non-vacuum chuck, the spin coater can also be used for coating of substrates with e.g. textured backsides or membranes.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager]'''
 
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]===
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Automatic dispense|Automatic dispense]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Standard recipes|Standard recipes]]
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Template recipes|Template recipes]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating of SU-8 resists
*Spin coating of PGMEA based AZ resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* manual dispense
* automatic dispense from syringe
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black"|
* SU-8 resits: 0.1-200+ µm
* AZ 5214E: 1.5-3 µm
* AZ 4562: 8-15 µm
* AZ MiR 701: 1.5-3 µm
* AZ nLOF 2020: 2-3.5 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
Vacuum chuck: 10 - 5000 rpm <br>
Non-vacuum chuck: Max. 3000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
10 - 3000 rpm/s <br>
Max. 1500 rpm/s with Gyrset
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
All cleanroom materials ?
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-  
|}
 
<br clear="all" />
 
==KS Spinner==
[[Image:KSspinner.JPG|300x300px|right|thumb|The KS spinner is placed in C-1]]
 
In April 2015, the KS Spinner was decommissioned and replaced by '''[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]'''
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#KS_Spinner click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
At Danchip we have RC8-THP system which is one of the SUSS MicroTech spinners.
 
The main purpose of this equipment is experimental spinning the different resist.The spinner has one resist line, AZ5214E, for automatic dispense. All other resist dispenses manually from syringe or disposable pipettes. All SU8 spinning are done on this machine.
 
The machine can be also used for spinning on the "difficult" surfaces like the substrates with holes, backside structures and unusual shapes.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=43 LabManager]'''
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating SU8 resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E permanent line
* AZ4562 manual dispense
* SU8 resists manual dispense
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* AZ5214E 1-4,2 µm
* AZ4526 6,2-10 µm
* SU8 resits 0,1-100 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20° to 200°
* SU8 must be bake out on SU8 dedicated hotplates
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1
|-
|}
 
<br clear="all" />
 
==Manual Spinner (Polymers)==
 
[[Image:IMG 1179.JPG|300x300px|thumb|right|The Manual Spinner (Polymers): positioned in fumehood in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Manual_Spinner_(Polymers) click here]'''
 
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
 
Manual Spinner (Polymers), OPTIcoat SB20+, from ATMSSE is a resist spinning coater at Danchip which is dedicated for single wafers spinning of e-beam resist, the hot embossing/UV imprint polymers and SU8 resit mixed with color/nano particals.
 
All polymers must be validated manually during the use. On this spinner you can spin whole 2", 4" and 6" substrates and also a small pieces.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]'''
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating of hot embossing polymers
*Spin coating of UV imprinting polymers
*Spin coating of e-beam resists
*Spin coating of SU8 resists mixed with color/nano particles
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* PMMA
* Topas
* e-beam resits
* SU8 resists mixed with color/nano particles
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* resist depended
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20° to 200°
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* down to 10x10mm pieces
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials except III-V materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1
|-  
|-  
|}
|}
Line 739: Line 256:
<br clear="all" />
<br clear="all" />


==Manual Spinner 1==
=Spin coating=
 
The typical spin coating process consists of the following steps:
[[Image:IMG 1175.JPG|300x300px|thumb|right|The Manual Spinner 1: positioned in fumehood in E-5]]
#Priming (typically HMDS) followed by cooling to room temperature
 
#Resist dispense (rotation: static or dynamic rotation)(arm: stationary or moving)
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Manual_Spinner_1 click here]'''
#*Optional: Acceleration to a low spin speed if dynamic dispense is used
 
#*Optional: Resist spreading at low spin speed for spreading thicker resists
''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
#Spin-off
 
#Backside rinse (typically during spin-off)
Manual Spinner 1, WS-650 model, from Laurell is a resist spinning coater at Danchip which can be used for spinning on whole 2", 4" and 6" substrates and also a small pieces.
#Optional: Edge-bead removal
 
#Softbake (contact or proximity)
The system can be used for spinning all resists, but remember to clean the spinner with an appropriate solvents, which can remove the resist residues.
#Cooling to room temperature


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=315 LabManager]'''


=== Equipment performance and process related parameters ===
After priming, the wafer is cooled to room temperature and then transferred to the spin coater. If static dispense is used, the wafer is not rotating during the resist dispense. In the case of dynamic dispense, the wafer rotates at low spin speed during the dispense. The dispense arm is normally stationary during dispense, but some substrates may require the arm to move slowly across the substrate area while dispensing. Moving arm dispensing is usually only done with a rotating substrate.


{| border="2" cellspacing="0" cellpadding="2"
Using too high spin speed during dispense can cause surface wetting issues, while a too low spin speed causes the resist to flow onto the backside of the wafer. After dispense, a short spin at low spin speed may be used in order to spread the resist over the wafer surface before spin-off.


==Spin-off==
The spin-off cycle determines the thickness of the resist coating. For a given resist, the thickness is primarily a function of the spin-off speed and the spin-off time, both following an inverse power-law:


!style="background:silver; color:black;" align="center" width="60"|Purpose
<math>y = k \sdot x^{-a}</math>
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating all resists
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* all approved resists
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
* resist depended
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20° to 200°
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* down to 10x10mm pieces
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1
|-
|}


<br clear="all" />
The acceleration to the spin-off speed also influences the thickness, but the effect is dependent on previous steps. The spin-off is usually a simple spin at one speed, but it may be comprised of several steps at different spin speeds. After spin-off, the wafer is decelerated.


==Spin coater: Manual Labspin==
The coated thickness, <math>t</math>, as a function of the spin-off speed, <math>w</math>, follows an inverse power-law:


[[Image:Spin coater Manual Labspin in A-5.jpg|300x300px|thumb|Spin coater: Manual Labspin positioned in A-5]]
<math>t=k \sdot w^{-a}</math>


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_coater:_Manual_labspin click here]'''
The constant, <math>k</math>, is a function of the resist viscosity and solid content, as well as the spin-off time. The exponent, <math>a</math>, is dependent on solvent evaporation, and is typically ~½ for UV resists. This means that from the thickness <math>t_1</math> achieved at spin speed <math>w_1</math>, one can estimate the spin speed <math>w_2</math> needed to achieve thickness <math>t_2</math> using the relation:


''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
<math>t_1 \sdot w_1^{1/2} = t_2 \sdot w_2^{1/2} \rArr w_2 = w_1 \sdot \frac{t_1^2}{t_2^2}</math>


The Spin coater: Manual Labspin is a SÜSS Labspin6 coater intended for processing of III-V compound semiconductors and CMOS compatible materals. The spinner is mounted in a flow hood located in the A-5 room (yellow room). The extra exhaust should always be turned on while spinning.


Please note, that there are different spinnings bowls for different resist, the first step before processing is choosing the proper bowl to use.  
For thick SU-8, however, <math>a</math> is observed to be ~1 (probably due to the low solvent content and/or the formation of skin). In this case, the relation simply becomes:


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=331 LabManager]'''
<math>t_1 \sdot w_1 = t_2 \sdot w_2 \rArr w_2 = w_1 \sdot \frac{t_1}{t_2}</math>


===Process information===
==Backside rinse==
'''Positive tone resists:'''
If the spin speed is too low during resist dispense, resist may creep over the edge of the wafer and onto the backside. Some resist tend to leave fine strings of resist protruding from the edge of the wafer, or folded onto the backside, an effect sometimes referred to as "cotton candy".


'''AZ 5214E'''
Any resist on the edge and backside of the wafer will contaminate the end effector, softbake hotplate, and subsequent wafers.


Spinning curve for[[media:AZ5214E_spin_curve.pdf‎| AZ5214E‎]].
In a backside rinse step, solvent administered through a nozzle to the backside of the wafer, while spinning at low or medium spin speed, dissolves the resist and washes it away. After the rinse, a short spin at medium spin speed dries the wafer before the softbake.
Process parameters making the recipe:
'''Spinning'''
speed: xxxprm
acceleration: 1000rpm/s
time: 60s
'''Baking'''
60sec on 90C hot plate


'''ZEP520A'''
During the backside rinse solvent inevitably creeps onto the front side of the wafer. This effect may be used to dissolve and subsequently remove an edge-bead, but it may also leave the rim of the wafer exposed. As an alternative to backside rinse, a wafer, which is contaminated on the backside, may be softbaked in proximity, in order to protect the hotplate from contamination. This leaves front side coating intact, but also leaves the backside dirty.


Spinning curve for[[media:Spin_curve_ZEP520A.pdf‎| ZEP520A‎]].
==Edge bead==
Process parameters making the recipe:
During spin coating, resist builds up at the edge of the wafer due to the change in surface tension at the edge, as well as extra drying from turbulence created by the wafer edge.
'''Spinning'''
speed: xxxprm
acceleration: 1000rpm/s
time: 60s
'''Baking'''
120sec on 180C hot plate


This phenomenon is called edge-bead. Dependent on spin coating parameters, the coating may be several times thicker at the edge than in the central area. In a subsequent hard contact exposure step (mask aligner), this edge-bead introduces an undesired proximity gap, which reduces the lateral resolution, and may even cause the wafer to stick to the mask.


In an edge-bead removal step, solvent administered through a nozzle positioned at the edge of the wafer, while spinning at low or medium spin speed, dissolves the resist and washes it away. After the removal, a short spin at medium spin speed dries the wafer before the softbake. Dependent on the viscosity (solvent content) of the resist after the edge-bead removal, this drying spin may cause the resist to re-flow and create a secondary edge-bead. In some cases, it may be necessary to (partially) softbake the resist before edge-bead removal.


'''Negative tone resists'''
==Softbake==
After spin coating, the solvent in the resist must be evaporated in a baking step, in order to solidify the resist. This softbake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface, either in direct contact on the manual hotlpates or by resting on shallow bumps 150 µm above the hotplate in the Gamma tools. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake.


''' AZ nLoF 2020'''
=Spin coaters at DTU Nanolab=


Spinning curve for[[media:Spin_curve_nLoF2020.pdf‎| AZ nLoF 2020]].
{{:Specific Process Knowledge/Lithography/Coaters/GammaUV}}
Process parameters making the recipe:
'''Spinning'''
speed: xxxprm
acceleration: 1000rpm/s
time: 30s
'''Baking'''
60sec on 110C hot plate


''' HSQ: FOX-15'''
{{:Specific Process Knowledge/Lithography/Coaters/GammaDUV}}


Spinning curve for[[media:Spin_curve_Fox-15.pdf| FOX-15]].
{{:Specific Process Knowledge/Lithography/Coaters/GammaEbeam}}
Process parameters making the recipe:
'''Prebaking'''
300sec on 220C hot plate
'''Spinning'''
speed: xxxprm
acceleration: 4000rpm/s
time: 60s
'''Baking'''
120sec on 120C hot plate
120sec on 220C hot plate. (Spinning curve made by Alexandra Lupi <allu@fotonik.dtu.dk>)


=== Equipment performance and process related parameters ===
{{:Specific Process Knowledge/Lithography/Coaters/RCD8}}


{| border="2" cellspacing="0" cellpadding="2"
{{:Specific Process Knowledge/Lithography/Coaters/labspin}}


{{:Specific Process Knowledge/Lithography/Coaters/labspin04}}


!style="background:silver; color:black;" align="center" width="60"|Purpose
{{:Specific Process Knowledge/Lithography/Coaters/sprayCoater}}
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating UV sensative resists
*Spin coating E-beam resits
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
* UV sensative resist: AZ5214E, AZMiR701, AZ nLoF 2020
* E-beam resits: ZEP520A, PMMA, HSQ
* BCB (bisbenzocyclobutene)
* Diblock copolymer Poly(styrene-b-methyl methacrylate) P(S-b-PMMA)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
Resist depended see spinning curves for differnt resist
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
Max. speed: 8000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 5000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
* changeable temperature from 20°-200° for III-V materials
* changeable temperature from 20°-200° for other materials
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* small pieces down to 3x3 mm2
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
All cleanroom materials


|-
=Decommisioned tools=
|style="background:LightGrey; color:black"|Batch
<span style="color:red">The spin track was decommissioned 2018-02-01.</span>
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1
|-  
|}


<br clear="all" />
[[Specific Process Knowledge/Lithography/Coaters/Spin_Track_1_%2B_2_processing|Information about decommissioned tool can be found here.]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters"