Specific Process Knowledge/Thin Film deposition/ALD/TiO2 deposition using ALD: Difference between revisions
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The ALD window for titanium dioxide (TiO<sub>2</sub>) ranges from 120 <sup>o</sup>C to 350 <sup>o</sup>C. | The ALD window for titanium dioxide (TiO<sub>2</sub>) ranges from 120 <sup>o</sup>C to 350 <sup>o</sup>C. | ||
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For Si wafers, amorphous TiO<sub>2</sub> is best grown on wafers with native oxide, and anatase TiO<sub>2</sub> is best grown on wafers without native oxide (removed using HF). | For Si wafers, amorphous TiO<sub>2</sub> is best grown on wafers with native oxide, and anatase TiO<sub>2</sub> is best grown on wafers without native oxide (removed using HF). | ||
===TiO<sub>2</sub> standard recipe=== | |||
====TiO<sub>2</sub> standard recipe==== | |||
<b>Recipe</b>: TiO2 | <b>Recipe</b>: TiO2 | ||
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!Purge time | !Purge time | ||
|4.0 s | |4.0 s | ||
|5.0 s | |||
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===TiO<sub>2</sub> deposition rates=== | ====TiO<sub>2</sub> deposition rates==== | ||
In the graphs below the TiO<sub>2</sub> thickness as function of the number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C can be seen. From the equations the number of cycles required for a certain thickess to be deposited can be calculated. All results have been obtained for Si wafers with native oxide. | In the graphs below the TiO<sub>2</sub> thickness as function of the number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C can be seen. From the equations the number of cycles required for a certain thickess to be deposited can be calculated. All results have been obtained for Si wafers with native oxide. | ||
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</gallery> | </gallery> | ||
===TiO<sub>2</sub> results=== | Evgeniy Shkondin, DTU Nanolab (former DTU Danchip), April-May 2014. | ||
====TiO<sub>2</sub> results==== | |||
Some some SEM images of TiO<sub>2</sub> deposited on a Si surface at different temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C are shown below. Some of samples have been treated with HF (hydrofluoric acid) to remove the native oxide layer just before the ALD deposition. | Some some SEM images of TiO<sub>2</sub> deposited on a Si surface at different temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C are shown below. Some of samples have been treated with HF (hydrofluoric acid) to remove the native oxide layer just before the ALD deposition. | ||
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image:TiO2 1000 cycles 300C Si_un.jpg| Temperature 300 <sup>o</sup>C, 1000 cycles. | image:TiO2 1000 cycles 300C Si_un.jpg| Temperature 300 <sup>o</sup>C, 1000 cycles. | ||
image:TiO2 350C 1250 cycles Si_HF_treated.jpg| Temperature 350 <sup>o</sup>C, 1250 cycles, HF treated. | image:TiO2 350C 1250 cycles Si_HF_treated.jpg| Temperature 350 <sup>o</sup>C, 1250 cycles, HF treated. | ||
</gallery> | </gallery> | ||
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[[image:XPS_TiO2.jpg|320x320px|left|thumb|XPS measurements of titanium dioxide.]] | [[image:XPS_TiO2.jpg|320x320px|left|thumb|XPS measurements of titanium dioxide.]] | ||
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Evgeniy Shkondin, DTU Nanolab (former DTU Danchip), 2014. | |||
====TiO<sub>2</sub> deposition on trenches==== | |||
For TiO<sub>2</sub> deposition on trenches more information can be found here: | |||
*[[Specific Process Knowledge/Thin Film deposition/ALD/TiO2 deposition using ALD/TiO2 deposition on trenches using ALD|TiO<sub>2</sub> deposition on trenches using ALD]] | |||