File:Air bubble.jpg: Difference between revisions

Revision as of 11:19, 26 June 2015 view source Lynhen (talk \| contribs) DCH-Employees-701 52 edits While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.		Latest revision as of 11:20, 26 June 2015 view source Lynhen (talk \| contribs) DCH-Employees-701 52 edits No edit summary
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	While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape.		While electroplating in the 0-degree tilt position, air bubbles were caught in the system and were not able to escape. Consequently some areas on the wafer were not deposited with copper.