Specific Process Knowledge/Lithography/EBeamLithographyManual: Difference between revisions

To request for an e-beam training session, contact e-beam@danchip.dtu.dk; a DTU Danchip personnel will hereafter provide a time slot. For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes but not authorized to load the cassettes into the autoloader.

To use the e-beam writer, book the machine via LabManager, and ask help from DTU Danchip staff to load your cassette into the robot loader (autoloader).

After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and re-load an empty cassette into the autoloader.

If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.

The computer controlling the e-beam (EWS/9500) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.

There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a BEAMER manual. They can both be accessed from LabManager under Technical documents.

Technical Specification

*The e-beam writer can pattern structures with a minimum resolution of 12 nm.

*The maximum field-size without stitching is 1000µm x 1000µm.

[[File:currentbeamsize.jpg|400px|right]]

*From the EBX menu on workspace 1, open the calibration window ‘Clb’. From this window, a previously used condition file (calibration file) dedicated to a certain aperture setting and current setting is loaded, re-calibrated, and saved again.

== Load and restore a condition file ==

*Load and restore a condition file, click ‘Select condition file...’, choose the file from the list, e.g. ‘0.2nA_ap7’ and click OK. Restore the file by clicking ‘RESTOR/Edit Parameter...’. From the RESTOR window, click ‘Excecute’; the machine will now restore the conditions of the colum, this will take a few minutes. Exit the RESTOR window by clicking ‘Cancel’.

== Execute INITAE and INITB ==  

*Execute  INITAE; click 'INITAE/Execute'.

== Execute 'daily' ==

1 Open the exposure program, ‘Exp’, from the EBX Menu.

 

 

2 Find and load your magazine file: click ‘File/Magazine File’ and choose the magazine file from the location ‘/home/eb0/jeoleb/job/danchip’.

 

 

3 Check that the name of the desired magazine-file appears in the Magazine filename field, then click ‘Execute’.

 

 

4 Click ‘YES’ if you agree on the information in the ‘Pattern Writing Execution Check’-window.

[[File:AGCRG1.png|400px]][[File:AGCRG2.png|400px]]

*Enter the measured (from pre-aligner output) P mark position

*Click 'RG mark detect condition: Setting' and adjust scan width and position. Use a large scan width (200-600 microns). In 'Scan type' choose 'fine scan', 'box scan' and choose the correct mark (cross or L-shaped). Start with an 'X only' scan.

If the program does not find the mark you can find it manually using the SEM. Remember to minimise the use of SEM:

'Move stage to mark position (setting/movement)

    No EBX Menu is open in any of the desktops: Open a console (click on arrow above the text ‘CPU’ on bottom menu bar) and from location (DTU)/ type ‘ebxmenu’.

    The ACHK or WRTEST programs are nowhere visible: Open Analysis form EBX Menu; from here you can find ACHK and WRTEST.  

    I forgot to tick the EXCH EVAC before transferring my cassette from the e-beam writer to the autoloader: Transfer your cassette back into the e-beam ('Carry in'), then tick 'EXCH EVAC' on, and click 'Carry out' to transfer the cassette to the autoloader and pump down the exchange chamber

Basic unix operations

 

cd job

Change directory to 'job'

cd ..

Go one directory up (parent directory)

dir List the directories and folders

CTRL+p (CTRL+n) Scroll to previous (next) command

Click on middle mouse button

Copy highlighted text, or paste copied text

Tripple-click on left mouse button

Highlights all text in a window (works in some windows only)

    No current can be detected when executing CURRNT: Call one of the contact persons to get help.

    The DISTBE subprogram runs for more than 15 minutes: Stop the subprogram from the calibration window (Command/Subprogram Stop). Click 'DISTBE/Edit Parameter'. Click 'Settings'. Change the scan position by 0.2 microns, both in X and Y. Save and execute DISTBE again. If DISTBE runs successfully, acknowledge the write to memory request, and run the last subprogram of the 'daily' batch manually. If it does not help, call one of the contact persons for help.

    The detection of AE/BE or wafer marks gives an either too saturated or too noisy signal: Edit the AGCAE/AGCBE or AGCRG programs by entering the position of your AE/BE or wafer mark and execute the program. When the program finish successfully, apply the settings to other relevant subprograms; see 'the INITAE or INITBE mark cannot be detected' section.

    The INITAE or INITBE mark cannot be detected: The system has probably drifted too far away from the mark to be able to detect the mark. Increase the scan width by doing this:

        Highlight INITAE and click 'Edit parameter'

        From the INITAE window, click 'AE mark detection condition Setting'

        Increase the scan width to around 40 µm, click apply, and execute INITAE again

        If the mark has been detected, click Update in the INITAE-window when the subprogram has finished

        Decrease the scan width to its original value, click apply and execute INITAE again

    The same procedure applies to INITBE; here, the scan width can be increased to more than 40 µm, though. If the marks still cannot be detected, call one of the contact persons to get help.  

 

    The same procedure applies to the BE mark detection. Test whether subprograms can be executed by running e.g. SFOCUS and PDEFBE (quite short programs).

    SETWFR cannot detect my P and Q marks: Unload your wafer/chip, remove the resist from your wafer marks and repeat your exposure with manual alignment:

 

 

 

 

        Move the target position (stage position) by clicking 'Setting...' and edit the X and Y parameters to the values found from the pre-alignment. Click 'Movement' to execute the movement.

        From the sspvideo (can be opened by 'Image' from the EBX Menu), start the SEM from 'Change/SEM'. Adjust the Brightness/Contrast and scan width by opening the Image Setting and Image Adjustment windows ('Setting...' and 'Adjustment...' buttons).

        Find the P-mark by adjusting the stage position using the step movement from the stage controller. When the mark is centered, click 'Pattern writing continuation' and repeat the procedure for the Q-mark. Finish the global alignment by clicking 'Pattern writing continuation', and the exposure will start.