Specific Process Knowledge/Etch/ICP Metal Etcher/Barc Etch: Difference between revisions

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==Barc Etch==


==Barc Etch==
Etching barc with a CF4 recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need. Here is an example of a barc etch I have started testing. I have also tried with and O2 descum process for comparison.
 
{| border="1" cellspacing="1" cellpadding="2"  align="left"
! Parameter
! Barc etch with CF4
! Barc etch with O2
|-
|Coil power||800W||120w
|-
|Platen power||100W||15W
|-
|Pressure||3 mTorr||5mTorr
|-
|Flow rate CF4||4 sccm||
|-
|Flow rate H2||20sccm||
|-
|Flow rate O2||||10sccm
|-
|T||0 degrees||0 degrees
|-
|}
<br/>
{| border="1" cellspacing="1" cellpadding="2"  align="left"
! Parameter
! Results with 'Barc etch with CF'
! Results with 'Barc etch with O2'
|-
|Etch rate in barc||'''52 nm in 30s''' ''[bghe 20150519]''||'''62 nm in 50s''' ''[bghe 20150521]''


Etching barc with a dedicated recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need.Here is an example of a barc etch I have started testing.
|-
|Etch rate in KRF resist||'''27 nm in 30s''' ''[bghe 20150519]''||'''73 nm in 50s''' ''[bghe 20150521]''
|-
|Selectivity KRF:Barc||'''1:2''' ||'''1:0.8'''
|-
|Etch 65nm barc||'''Use 40-45s'''||'''Use 55-60s'''
|-
|}
<br/>

Latest revision as of 15:54, 6 February 2023

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Barc Etch

Etching barc with a CF4 recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need. Here is an example of a barc etch I have started testing. I have also tried with and O2 descum process for comparison.

Parameter Barc etch with CF4 Barc etch with O2
Coil power 800W 120w
Platen power 100W 15W
Pressure 3 mTorr 5mTorr
Flow rate CF4 4 sccm
Flow rate H2 20sccm
Flow rate O2 10sccm
T 0 degrees 0 degrees


Parameter Results with 'Barc etch with CF' Results with 'Barc etch with O2'
Etch rate in barc 52 nm in 30s [bghe 20150519] 62 nm in 50s [bghe 20150521]
Etch rate in KRF resist 27 nm in 30s [bghe 20150519] 73 nm in 50s [bghe 20150521]
Selectivity KRF:Barc 1:2 1:0.8
Etch 65nm barc Use 40-45s Use 55-60s


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