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| <center><span style="background:Yellow">2nd Level - Process Topic</span></center>
| | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]''' |
| '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]''' | |
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| === Choose the process topic you are interested in === | | === Choose the process topic you are interested in: === |
| | *[[/Pattern Design|Pattern Design and Mask Fabrication]] |
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| *[[/Back-end processing|Back-end processing]] | | *[[/Back-end processing|Back-end processing]] |
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| | *[[/Bonding|Bonding]] |
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| *[[/Characterization|Characterization]] | | *[[/Characterization|Characterization]] |
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| *[[/Lithography|Lithography]] | | *[[/Lithography|Lithography]] |
| <!--
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| *[[/Photolithography|Photolithography]]
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| -->
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| *[[/Thermal Process|Thermal Process]] | | *[[/Thermal Process|Thermal Process]] |
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| *[[/Wafer and sample drying|Wafer and sample drying]] | | *[[/Wafer and sample drying|Wafer and sample drying]] |
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| *[[/Bonding|Wafer Bonding]]
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| *[[/Wafer cleaning|Wafer Cleaning]] | | *[[/Wafer cleaning|Wafer Cleaning]] |
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| *[[/Wafer Information|Wafer Information]] | | *[[/Wafer Information|Wafer Information]] |
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| *[[/III-V Process|III-V Process]] | | *[[/Overview of Fume Hoods|Overview of Fume Hoods]] |
| | |
| ===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
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| <!--
| |
| ==Overview of sample processing 3==
| |
| | |
| {| {{Table}}
| |
| |- valign="top"
| |
| | |
| | |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Clean your sample.png|x100px|Clean your sample]] <br/> Clean your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
| |
| |Soap Sonic
| |
| |Removes dust and particles
| |
| |-
| |
| |
| |
| |7-up & Piranha
| |
| |Removes organics and alkali ions
| |
| |-
| |
| |
| |
| |RCA
| |
| |Two step process to remove organics and metals
| |
| |-
| |
| |
| |
| |5% HF
| |
| |Removes native oxide
| |
| |-
| |
| |
| |
| |IMEC
| |
| |Removing dust, organics and alkali ions and slightly polish the surface.
| |
| Make the surface hydrophillic
| |
| |-
| |
| |}
| |
| |
| |
| {| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2" align="right"
| |
| ! [[image:Dry your sample.png|x100px|Dry your sample]] <br/> Dry your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
| |
| |Spin dryers
| |
| |Whole wafers
| |
| |-
| |
| | | |
| |Critial point dryer
| |
| |Sensitive wafers
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Create a film on your sample.png|thumb|100px|Create a layer/film on your sample]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
| |
| |Thermal oxidation
| |
| |Thermal SiO2
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Sputter deposition
| |
| |Si,SiO2,Si3N3,TiO2, metals
| |
| |-
| |
| |
| |
| |Thermal evaporation
| |
| |Al, ?
| |
| |-
| |
| |
| |
| |E-beam evaporation
| |
| |Metals
| |
| |-
| |
| |
| |
| |LPCVD
| |
| |Si3N4, SRN, SiO2, Si (poly and amorph)
| |
| |-
| |
| |
| |
| |PECVD
| |
| |Si3N4, SiO2, PBSG
| |
| |-
| |
| |
| |
| |Electroplating
| |
| |Ni
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Spin coating
| |
| |resists, polymers
| |
| |-
| |
| |
| |
| |Spray coating
| |
| |resists, polymers
| |
| |-
| |
| |Epitaxial growth
| |
| |MOCVD
| |
| |?
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Dope your sample.png|thumb|100px|Dope your sample]]
| |
| |-
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
| |
| |PECVD
| |
| |Deposition of SiO2 or Si3N4 doped with P,B and Ge
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
| |
| |LPCVD
| |
| |Deposition of PolySi doped with B or P
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
| |
| |Predeposition and drive-in
| |
| |Doping Silicon wafers with boron
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
| |
| |Predeposition and drive-in
| |
| |Doping Silicon wafers with phosphorus
| |
| | |
| |-
| |
| |[[Specific Process Knowledge/Doping|Doping]]
| |
| |Ion implant
| |
| |?
| |
| |-
| |
| |}
| |
| |-
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Thermal treat your sample.png|thumb|100px|Thermal treatment of your sample]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process|Thermal Process]]
| |
| |Annealing
| |
| |Si, PECVD layers
| |
| |-
| |
| |
| |
| |Oxidation
| |
| |Si wafers
| |
| |-
| |
| |
| |
| |Doping with B/P
| |
| |Si wafers
| |
| |-
| |
| |
| |
| |Pyrolysis
| |
| |Resists?
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Make a mask on your sample.png|thumb|100px|Make a mask on your sample]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography| Lithography]]
| |
| |
| |
| |-
| |
| |
| |
| |Photolithography
| |
| |-
| |
| |
| |
| |Deep UV lithography
| |
| |-
| |
| |
| |
| |E-beam lithography
| |
| |-
| |
| |
| |
| |Imprinting
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Transfer mask pattern to your sample]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Etch| Etch]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Wet etch
| |
| |Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
| |
| |-
| |
| |
| |
| |Dry etch
| |
| |Any material
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]]
| |
| |
| |
| |?
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Define your structure directly.png|thumb|100px|Define your structure directly to your sample]]
| |
| |-
| |
| |Imprinting
| |
| |-
| |
| |LASER machining
| |
| |-
| |
| |Lithographic definition
| |
| |-
| |
| |Polymer Injection molding
| |
| |-
| |
| |}
| |
| |-
| |
| |
| |
| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Bond your samples together.png|thumb|100px|Bond your samples together]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Characterize your sample.png|thumb|100px|Characterize your sample]]
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |
| |
| |
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| |
| ! [[image:Pack your sample (back-end).png|thumb|100px|Pack your sample (back-end)]]
| |
| |-
| |
| |Chip/die mounting
| |
| |-
| |
| |Wire bonding
| |
| |-
| |
| |Dicing
| |
| |-
| |
| |}
| |
| |
| |
| |-
| |
| |}
| |
| -->
| |
| | |
| == Overview of sample processing ==
| |
| {| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"
| |
| | colspan="2" |
| |
| |-
| |
| | style="width: 50%; vertical-align:top"|
| |
| {| id="linkTable" border="1" cellpadding="0" cellspacing="0" style="text-align:center;"
| |
| |-
| |
| ! class="hideImage" width="150" height="180px"| Clean your sample[[file:jehanClean.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Dry your sample [[file:jehanDry.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Create a thin film on your sample [[file:jehanfilm.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Dope your sample [[file:jehanDope.png|130px|frameless ]]
| |
| |-
| |
| ! class="hideImage" width="150" height="180px"| Thermal treatment of your sample [[file:jehanThermal.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Make a mask on your sample[[file:jehanmask.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
| |
| |-
| |
| ! class="hideImage" width="150" height="180px"| Bond your samples together [[file:jehanBond.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Characterize your sample [[file:jehanCharacterize.png|130px|frameless ]]
| |
| ! class="hideImage" width="150" | Pack your sample [[file:jehanPack.png|130px|frameless ]]
| |
| ! |
| |
| |-
| |
| |}
| |
| | |
| | |
| | style="width: 50%; vertical-align: top"|
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| ! colspan="3" style="text-align:left;" | [[image:Clean your sample.png|x100px|Clean your sample]] Clean your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
| |
| |Soap Sonic
| |
| |Removes dust and particles
| |
| |-
| |
| |
| |
| |7-up & Piranha
| |
| |Removes organics and alkali ions
| |
| |-
| |
| |
| |
| |RCA
| |
| |Two step process to remove organics and metals
| |
| |-
| |
| |
| |
| |5% HF
| |
| |Removes native oxide
| |
| |-
| |
| |
| |
| |IMEC
| |
| |Removing dust, organics and alkali ions and slightly polish the surface.
| |
| Make the surface hydrophillic
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x100px|Dry your sample]] Dry your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
| |
| |Spin dryers
| |
| |Whole wafers
| |
| |-
| |
| |
| |
| |Critial point dryer
| |
| |Sensitive wafers
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
| |
| |Thermal oxidation
| |
| |Thermal SiO2
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Sputter deposition
| |
| |Si,SiO2,Si3N3,TiO2, metals
| |
| |-
| |
| |
| |
| |Thermal evaporation
| |
| |Al, ?
| |
| |-
| |
| |
| |
| |E-beam evaporation
| |
| |Metals
| |
| |-
| |
| |
| |
| |LPCVD
| |
| |Si3N4, SRN, SiO2, Si (poly and amorph)
| |
| |-
| |
| |
| |
| |PECVD
| |
| |Si3N4, SiO2, PBSG
| |
| |-
| |
| |
| |
| |Electroplating
| |
| |Ni
| |
| |-
| |
| |
| |
| |Epitaxial growth /MOCVD
| |
| |?
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Spin coating
| |
| |resists, polymers
| |
| |-
| |
| |
| |
| |Spray coating
| |
| |resists, polymers
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Dope your sample.png|x100px|Dope your sample]] Dope your sample
| |
| |-
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
| |
| |PECVD
| |
| |Deposition of SiO2 or Si3N4 doped with P,B and Ge
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
| |
| |LPCVD
| |
| |Deposition of PolySi doped with B or P
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
| |
| |Predeposition and drive-in
| |
| |Doping Silicon wafers with boron
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
| |
| |Predeposition and drive-in
| |
| |Doping Silicon wafers with phosphorus
| |
| | |
| |-
| |
| |[[Specific Process Knowledge/Doping|Doping]]
| |
| |Ion implant
| |
| |?
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process|Thermal Process]]
| |
| |Annealing
| |
| |Si, PECVD layers
| |
| |-
| |
| |
| |
| |Oxidation
| |
| |Si wafers
| |
| |-
| |
| |
| |
| |Doping with B/P
| |
| |Si wafers
| |
| |-
| |
| |
| |
| |Pyrolysis
| |
| |Resists?
| |
| |-
| |
| |
| |
| |Rapid Thermal Anneal (RTP)
| |
| |?
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography| Lithography]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Photolithography
| |
| |UV resists
| |
| |-
| |
| |
| |
| |Deep UV lithography
| |
| |DUV resists
| |
| |-
| |
| |
| |
| |E-beam lithography
| |
| |E-beam resists
| |
| |-
| |
| |
| |
| |Imprinting
| |
| |Polymers
| |
| |-
| |
| |
| |
| |Lift-off
| |
| |mostly used for making metal masks
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Transfer mask pattrn to your sample.png|x100px|Transfer mask pattern to your sample]] Transfer mask pattern to your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Etch| Etch]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Wet etch
| |
| |Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
| |
| |-
| |
| |
| |
| |Dry etch
| |
| |Any material
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/LiftOff| Lithography/Lift-off]]
| |
| |
| |
| |?
| |
| |-
| |
| |}
| |
| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
| |
| |-
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| !Entry page in LabAdviser
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| !Techniques
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| !Materials
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| |-
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| |[[Specific Process Knowledge/Imprinting|Imprinting]]
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| |Imprinting
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| |Polymers
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| |-
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| |[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
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| |LASER machining
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| |-
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| |[[Specific Process Knowledge/Lithography|Lithography]]
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| |Lithographic definition
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| |Resists
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| |-
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| |[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
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| |Polymer Injection molding
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| |Polymers
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| |-
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| |}
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| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
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| |-
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| !Entry page in LabAdviser
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| !Techniques
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| !Materials
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| |-
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| |[[Specific Process Knowledge/Bonding|Bonding]]
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| |Eutectic bonding
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| |-
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| |Fusion bonding
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| |-
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| |Anodic bonding
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| |-
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| |}
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| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Characterize your sample.png|x100px|Characterize your sample]] Characterize your sample
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| |-
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| !Entry page in LabAdviser
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| !What do you need to measure?
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| !Technique/Method
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| |-
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| |[[Specific Process Knowledge/Characterization|Characterization]]
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| |Sample Imaging, XY dimensions
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| |Microscopy: optical,SEM,AFM
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| |-
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| |Sample Topography
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| |AFM,Profiling with stylus or optical
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| |-
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| |Film thickness and optical constants
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| |Ellipsometry,Reflectometry,Prism Coupling
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| |-
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| |Film Stress
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| |Profiling with stylus or optical
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| |-
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| |Wafer thickness
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| |-
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| |Element analysis
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| |XPS,EDX,SIMS
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| |-
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| |Contact Angle
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| |-
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| |Resistivity
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| |Four point probe
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| |-
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| |Doping level/Carrier density
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| |
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| |-
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| |Photoluminescence
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| |
| |
| |-
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| |}
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| {| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Pack your sample (back-end).png|x100px|Pack your sample (back-end)]] Pack your sample (back-end)
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| |-
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| !Entry page in LabAdviser
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| !Techniques
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| !Materials
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| |-
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| |[[Specific Process Knowledge/Back-end processing|Back-end processing]]
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| |Chip/die mounting
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| |-
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| |Wire bonding
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| |-
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| |Dicing
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| |
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| |-
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| |}
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| |
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| |-
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| |}
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| | |
| <!--
| |
| ==Overview of sample processing 5==
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| | |
| {| {{Table}}
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| |- valign="top"
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| | |
| | |
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" width="430px"
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| ! colspan="3" style="text-align:left;" | [[image:Clean your sample.png|x100px|Clean your sample]] Clean your sample
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| |-
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| !Techniques
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| !Materials
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| !Entry page in LabAdviser
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| |-
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| |Soap Sonic
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| |Removes dust and particles
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| |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
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| |-
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| |7-up & Piranha
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| |Removes organics and alkali ions
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| |
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| |-
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| |RCA
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| |Two step process to remove organics and metals
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| |
| |
| |-
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| |5% HF
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| |Removes native oxide
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| |
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| |-
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| |IMEC
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| |Removing dust, organics and alkali ions and slightly polish the surface.
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| Make the surface hydrophillic
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| |
| |
| |-
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| |}
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| |
| |
| {| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x100px|Dry your sample]] Dry your sample
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| |-
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| !Techniques
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| !Materials
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| !Entry page in LabAdviser
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| |-
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| |Spin dryers
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| |Whole wafers
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| |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
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| |-
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| |Critial point dryer
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| |Sensitive wafers
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| |
| |
| |-
| |
| |}
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| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample
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| |-
| |
| !Techniques
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| !Materials
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| !Entry page in LabAdviser
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| |-
| |
| |Thermal oxidation
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| |Thermal SiO2
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| |[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
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| |-
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| |Sputter deposition
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| |Si,SiO2,Si3N3,TiO2, metals
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| |[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
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| |-
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| |Thermal evaporation
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| |Al, ?
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| |-
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| |E-beam evaporation
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| |Metals
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| |-
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| |LPCVD
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| |Si3N4, SRN, SiO2, Si (poly and amorph)
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| |
| |
| |-
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| |PECVD
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| |Si3N4, SiO2, PBSG
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| |
| |
| |-
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| |Electroplating
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| |Ni
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| |
| |
| |-
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| |Epitaxial growth /MOCVD
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| |?
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| |
| |
| |-
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| |Spin coating
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| |resists, polymers
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| |[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
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| |-
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| |Spray coating
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| |resists, polymers
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| |[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
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| |-
| |
| |}
| |
| |- valign="top"
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
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| !colspan="3" style="text-align:left;" | [[image:Dope your sample.png|x100px|Dope your sample]] Dope your sample
| |
| |-
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
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| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
| |
| |PECVD
| |
| |Deposition of SiO2 or Si3N4 doped with P,B and Ge
| |
| |-
| |
| |[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
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| |LPCVD
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| |Deposition of PolySi doped with B or P
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| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
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| |Predeposition and drive-in
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| |Doping Silicon wafers with boron
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| |-
| |
| |[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
| |
| |Predeposition and drive-in
| |
| |Doping Silicon wafers with phosphorus
| |
| | |
| |-
| |
| |[[Specific Process Knowledge/Doping|Doping]]
| |
| |Ion implant
| |
| |?
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Thermal Process|Thermal Process]]
| |
| |Annealing
| |
| |Si, PECVD layers
| |
| |-
| |
| |
| |
| |Oxidation
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| |Si wafers
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| |-
| |
| |
| |
| |Doping with B/P
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| |Si wafers
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| |-
| |
| |
| |
| |Pyrolysis
| |
| |Resists?
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| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography| Lithography]]
| |
| |
| |
| |-
| |
| |
| |
| |Photolithography
| |
| |-
| |
| |
| |
| |Deep UV lithography
| |
| |-
| |
| |
| |
| |E-beam lithography
| |
| |-
| |
| |
| |
| |Imprinting
| |
| |-
| |
| |}
| |
| |- valign="top"
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Transfer mask pattrn to your sample.png|x100px|Transfer mask pattern to your sample]] Transfer mask pattern to your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Etch| Etch]]
| |
| |
| |
| |
| |
| |-
| |
| |
| |
| |Wet etch
| |
| |Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
| |
| |-
| |
| |
| |
| |Dry etch
| |
| |Any material
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography/LiftOff| Lithography/Lift-off]]
| |
| |
| |
| |?
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Imprinting|Imprinting]]
| |
| |Imprinting
| |
| |Polymers
| |
| |-
| |
| |[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
| |
| |LASER machining
| |
| |
| |
| |-
| |
| |[[Specific Process Knowledge/Lithography|Lithography]]
| |
| |Lithographic definition
| |
| |Resists
| |
| |-
| |
| |[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
| |
| |Polymer Injection molding
| |
| |Polymers
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Bonding|Bonding]]
| |
| |Eutectic bonding
| |
| |
| |
| |-
| |
| |
| |
| |Fusion bonding
| |
| |
| |
| |-
| |
| |
| |
| |Anodic bonding
| |
| |
| |
| |-
| |
| |}
| |
| |- valign="top"
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Characterize your sample.png|x100px|Characterize your sample]] Characterize your sample
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !What do you need to measure?
| |
| !Technique/Method
| |
| |-
| |
| |[[Specific Process Knowledge/Characterization|Characterization]]
| |
| |Sample Imaging, XY dimensions
| |
| |Microscopy: optical,SEM,AFM
| |
| |-
| |
| |
| |
| |Sample Topography
| |
| |AFM,Profiling with stylus or optical
| |
| |-
| |
| |
| |
| |Film thickness and optical constants
| |
| |Ellipsometry,Reflectometry,Prism Coupling
| |
| |-
| |
| |
| |
| |Film Stress
| |
| |Profiling with stylus or optical
| |
| |-
| |
| |
| |
| |Wafer thickness
| |
| |
| |
| |-
| |
| |
| |
| |Element analysis
| |
| |XPS,EDX,SIMS
| |
| |-
| |
| |
| |
| |Contact Angle
| |
| |
| |
| |-
| |
| |
| |
| |Resistivity
| |
| |Four point probe
| |
| |-
| |
| |
| |
| |Doping level/Carrier density
| |
| |
| |
| |-
| |
| |
| |
| |Photoluminescence
| |
| |
| |
| |-
| |
| |}
| |
| |
| |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" width="430px"
| |
| !colspan="3" style="text-align:left;" | [[image:Pack your sample (back-end).png|x100px|Pack your sample (back-end)]] Pack your sample (back-end)
| |
| |-
| |
| !Entry page in LabAdviser
| |
| !Techniques
| |
| !Materials
| |
| |-
| |
| |[[Specific Process Knowledge/Back-end processing|Back-end processing]]
| |
| |Chip/die mounting
| |
| |
| |
| |-
| |
| |
| |
| |Wire bonding
| |
| |
| |
| |-
| |
| |
| |
| |Dicing
| |
| |
| |
| |-
| |
| |}
| |
| |
| |
| |-
| |
| |}
| |
|
| |
|
| | *[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]] |
|
| |
|
| -->
| |
|
| |
|
| [[/temp| jmli test ]]
| | <!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> --> |