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| <center><span style="background:Yellow">2nd Level - Process Topic</span></center>
| | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]''' |
| '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]''' | |
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| === Choose the process topic you are interested in === | | === Choose the process topic you are interested in: === |
| | *[[/Pattern Design|Pattern Design and Mask Fabrication]] |
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| *[[/Back-end processing|Back-end processing]] | | *[[/Back-end processing|Back-end processing]] |
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| | *[[/Bonding|Bonding]] |
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| *[[/Characterization|Characterization]] | | *[[/Characterization|Characterization]] |
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| *[[/E-beam lithography|E-beam lithography]] | | *[[/Direct Structure Definition|Direct Structure Definition]] |
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| | *[[/Doping|Doping]] |
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| *[[/Etch|Etch]] | | *[[/Etch|Etch]] |
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| *[[/Lithography|Lithography]] | | *[[/Lithography|Lithography]] |
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| *[[/Photolithography|Photolithography]]
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| *[[/Thermal Process|Thermal Process]] | | *[[/Thermal Process|Thermal Process]] |
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| *[[/Wafer and sample drying|Wafer and sample drying]] | | *[[/Wafer and sample drying|Wafer and sample drying]] |
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| *[[/Bonding|Wafer Bonding]]
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| *[[/Wafer cleaning|Wafer Cleaning]] | | *[[/Wafer cleaning|Wafer Cleaning]] |
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| *[[/Wafer Information|Wafer Information]] | | *[[/Wafer Information|Wafer Information]] |
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| *[[/III-V Process|III-V Process]] | | *[[/Overview of Fume Hoods|Overview of Fume Hoods]] |
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| ===The section beneath is under construction [[Image:section under construction.jpg|70px]] ===
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| ==Overview of sample processing==
| | *[[/Cleanroom Chemicals|List of chemicals available in the cleanroom]] |
| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Clean the sample
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Drying Samples
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Make a layer on the sample
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| !
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| |-
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| |Thermal Oxide growth
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| |Thin Film deposition
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| |Sputter deposition
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| |Thermal deposition
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| |E-beam evaporation
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| |CVD
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| |LPCVD
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| |PECVD
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| |Coating
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| |Spin coating
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| |Spray coating
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| |Electroplating
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| |Epitaxial growth
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| |-
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
| | <!-- <HTML5video width="520" height="320" autoplay="true" loop="true">bunny</HTML5video> --> |
| !Thermal treatment of the sample | |
| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Make a mask on the sample
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| !
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| |Lithography
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| |Imprinting
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Transfer pattern into the sample
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| |Wet etch
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| |Dry etch
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| |Lift-off
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Direct structure definition
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| |Imprinting
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| |LASER machining
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| |Lithographic definition
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| |Polymer Injection molding
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Bonding samples together
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Characterize the sample
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Back end of the sample
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| |Chip/die mounting
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| |Wire bonding
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| |Dicing
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| |}
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