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| <center><span style="background:Yellow">2nd Level - Process Topic</span></center>
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| '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
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| | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]''' |
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| === Choose the process topic you are interested in ===
| | <span style="background:#FF2800">Currently no information on this page.</span> |
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| *[[/Back-end processing|Back-end processing]]
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| *[[/Characterization|Characterization]]
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| *[[/E-beam lithography|E-beam lithography]]
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| *[[/Etch|Etch]]
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| *[[/Imprinting|Imprinting]]
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| *[[/Lithography|Lithography]]
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| *[[/Photolithography|Photolithography]]
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| *[[/Thermal Process|Thermal Process]]
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| *[[/Thin film deposition|Thin film deposition]]
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| *[[/Wafer and sample drying|Wafer and sample drying]]
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| *[[/Bonding|Wafer Bonding]]
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| *[[/Wafer cleaning|Wafer Cleaning]]
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| *[[/Wafer Information|Wafer Information]]
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| *[[/III-V Process|III-V Process]]
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| ===This section is under construction [[Image:section under construction.jpg|70px]] === | |
| Sample processing:
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Clean the sample
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Drying Samples
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Make a layer on the sample
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| !
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| !
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| |-
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| |Thermal Oxide growth
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| |-
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| |Thin Film deposition
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| |Sputter deposition
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| |Thermal deposition
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| |E-beam evaporation
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| |CVD
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| |LPCVD
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| |PECVD
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| |Coating
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| |Spin coating
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| |Spray coating
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| |Electroplating
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| |-
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| |Epitaxial growth
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Thermal treatment of the sample
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Make a mask on the sample
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| |}
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| **Lithography
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| **Imprinting
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Transfer pattern into the sample
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| |}
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| **Wet etch
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| **Dry etch
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| **Lift-off
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Direct structure definition
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| |}
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| **Imprinting
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| **LASER machining
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| **Lithographic definition
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| **Polymer Injection molding
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Bonding samples together
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Characterize the sample
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| !Back end of the sample
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| |}
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| **Chip/die mounting
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| **Wire bonding
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| **Dicing
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