Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

Latest revision as of 14:08, 29 June 2023

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TPT Wire Bonder

Will be temporary taken out of service during the PolyFabLab construction.

The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT Wire Bonder

Ball Wire Bonder K&S 4524

Will be moved to building 451 during the PolyFabLab construction.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Equipment		TPT Wire Bonder	Ball Wire Bonder
Purpose		Al and Au 25µm wire bonding Wedge and ball wire bonding Au ribbon (100x20µm) bonding (we have tools and wire but it has not been tested)	Au 25µm wire bonding Ball wire bonding
Performance		Manual operation Wedge bonding: recommended min. bonding area 200 µm x 200 µm Ball bonding: recommended min. bonding area 200 µm x 200 µm recommended temperature 120 ^oC.	Semi-automatic and manual operation Bond placement laser pointer recommended min. bonding area 100 µm x 100 µm recommended temperature 120 ^oC.
Substrates	Allowed materials	Should be able to withstand the wire bonding temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)

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 '''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
 <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
+{{CC1}}
 ==TPT Wire Bonder==
-[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 1st floor]]
+[[Image:bond head - wedge insert.jpg|100px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]]
+[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''
 The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
-'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:'''
+'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
 <!-- remember to remove the type of documents that are not present -->
@@ Line 14: / Line 18: @@
 ==Ball Wire Bonder K&S 4524==
+<!-- copyright issue kabi
 [[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
+-->
+<!-- copyright issue kabi
 [[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
+-->
+[[Image:section under construction.jpg|70px]] ''Will be moved to building 451 during the PolyFabLab construction.''
 The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
+[[Image:K-S 4524 wirebonder DTU.jpg|thumb|300px|K&S 4524 ball wire bonder]]
-'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
+'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''
 <!-- remember to remove the type of documents that are not present -->
@@ Line 25: / Line 37: @@
 [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
-<!-- == Process information ==
+==Equipment performance and process related parameters==
-*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
+[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]]
--->
-==Equipment performance and process related parameters==
 {| border="2" cellspacing="0" cellpadding="2"
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 *Manual operation
 *Wedge bonding:
-**recommended min. bonding area 200 µm
+**recommended min. bonding area 200 µm x 200 µm
 *Ball bonding:
-**recommended min. bonding area 200 µm
+**recommended min. bonding area 200 µm x 200 µm
 **recommended temperature 120 <sup>o</sup>C.
 |style="background:WhiteSmoke; color:black"|
 *Semi-automatic and manual operation
 *Bond placement laser pointer
-*recommended min. bonding area 100 µm
+*recommended min. bonding area 100 µm x 100 µm
 *recommended temperature 120 <sup>o</sup>C.
 |-