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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip click here]'''
{{cc-nanolab}}


= Strip Comparison Table =
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Strip click here]'''
{| border="2" cellspacing="0" cellpadding="2"
 
[[Category: Equipment|Lithography strip]]
[[Category: Lithography|Strip]]


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
__TOC__
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma asher|Plasma asher]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Strip#Acetone Strip|Acetone Strip]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]</b>


= Strip Comparison Table =
{| class="wikitable"
|-
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
!
|style="background:LightGrey; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 3: Descum|Plasma Asher 3: Descum]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Plasma Asher 4 (Clean)]]
All purposes
! [[Specific_Process_Knowledge/Lithography/Strip#Plasma Asher 5|Plasma Asher 5 (Dirty)]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Strip#Resist Strip|Resist strip]]
Clean wafers only, no metal
! [[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]
|style="background:WhiteSmoke; color:black"|
|-
III-V materials only
! scope=row style="text-align: left;" | Purpose
|style="background:WhiteSmoke; color:black"|
| Resist descum
Resist strip, no metal
|
|style="background:WhiteSmoke; color:black"|
*Resist stripping
Resist strip or lift-off
*Resist descum
 
|
*Resist stripping
*Resist descum
| Resist stripping
| Metal lift-off
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|
| Plasma ashing
|style="background:WhiteSmoke; color:black"|
| Plasma ashing
Plasma ashing
| Plasma ashing
|style="background:WhiteSmoke; color:black"|
| Solvent & ultrasonication
Plasma ashing
| Solvent & ultrasonication
|style="background:WhiteSmoke; color:black"|
Plasma ashing
|style="background:WhiteSmoke; color:black"|
Solvent and ultra sound
|style="background:WhiteSmoke; color:black"|
Solvent and ultra sound
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process gasses
|style="background:LightGrey; color:black"|Process gasses
| O<sub>2</sub> (50 sccm)
|style="background:WhiteSmoke; color:black"|
|
*O<sub>2</sub> (0 - 400 sccm)
*O<sub>2</sub> (0-500 sccm)
*N<sub>2</sub>
*N<sub>2</sub> (0-500 sccm)
*CF<sub>4</sub>
|
|style="background:WhiteSmoke; color:black"|
*O<sub>2</sub> (0-500 sccm)
*O<sub>2</sub> (0 - 400 sccm)
*N<sub>2</sub> (0-500 sccm)
*N<sub>2</sub>
*CF<sub>4</sub> (0-200 sccm)
|style="background:WhiteSmoke; color:black"|
| NA
*O<sub>2</sub> (flow unknown)
| NA
|style="background:WhiteSmoke; color:black"|
*NA
|style="background:WhiteSmoke; color:black"|
*NA
 
|-
|-
|style="background:LightGrey; color:black"|Max. process power
! scope=row style="text-align: left;" | Process power
|style="background:WhiteSmoke; color:black"|
| 10-100 W (10-100%)
*1000 W
| 150-1000 W
|style="background:WhiteSmoke; color:black"|
| 150-1000 W
*1000 W
| NA
|style="background:WhiteSmoke; color:black"|
| NA
*100% (power unknown)
|style="background:WhiteSmoke; color:black"|
*NA
|style="background:WhiteSmoke; color:black"|
*NA
 
|-
|-
|style="background:LightGrey; color:black"|Solvent
! scope=row style="text-align: left;" | Process solvent
|style="background:WhiteSmoke; color:black"|
| NA
*NA
| NA
|style="background:WhiteSmoke; color:black"|
| NA
*NA
|
|style="background:WhiteSmoke; color:black"|
*NMP (Remover 1165)
*NA
*IPA (rinsing agent)
|style="background:WhiteSmoke; color:black"|
|
*Acetone
|style="background:WhiteSmoke; color:black"|
*Acetone
*NMP (Remover 1165)
*NMP (Remover 1165)
 
*IPA (rinsing agent)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate batch
|style="background:LightGrey; color:black"|Batch size
|
|style="background:WhiteSmoke; color:black"|
*Chips: several
*1 small sample
*50 mm wafer: several
*1 50 mm wafer
*100 mm wafer: 1
*1 - 30 100 mm wafers
|
*1 - 25 150 mm wafers
*Chips: several
|style="background:WhiteSmoke; color:black"|
*50 mm wafer: several
*1 small sample
*100 mm wafer: 1-25
*1 50 mm wafer
*150 mm wafer: 1-25
*1 - 30 100 mm wafers
*200 mm wafer: 1-25
*1 - 25 150 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*Chips: several
*1 small sample
*50 mm wafer: several
*1 50 mm wafer
*100 mm wafer: 1-25
*1 100 mm wafer
*150 mm wafer: 1-25
|style="background:WhiteSmoke; color:black"|
*200 mm wafer: 1-25
*1 - 25 100 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*100 mm wafer: 1-25
*1 - 25 100 mm wafers
*150 mm wafer: 1-25
 
|
*100 mm wafer: 1-25
*150 mm wafer: 1-25
|-
|-
|style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Substrate materials
|style="background:WhiteSmoke; color:black"|
|
Silicon, glass, and polymer substrates
*<span style="color:red">'''No polymer substrates'''</span><br>
 
*Silicon substrates
Film or pattern of all but Type IV
*III-V substrates
|style="background:WhiteSmoke; color:black"|
*Glass substrates
No metal!
*Films, or patterned films, of any material except type IV (Pb, Te)
 
|
Silicon, glass, and polymer substrates
*<span style="color:red">'''No metals'''</span><br>
 
*<span style="color:red">'''No metal oxides'''</span><br>
Film or pattern of photoresist/polymer
*<span style="color:red">'''No III-V materials'''</span><br>
|style="background:WhiteSmoke; color:black"|
*Silicon substrates
Silicon, III-V, and glass substrates
*Glass substrates
 
*Polymer substrates
Film or pattern of all but Type IV
*Films, or patterned films, of resists/polymers
|style="background:WhiteSmoke; color:black"|
|
No metal!
*Silicon substrates
 
*III-V substrates
Silicon, glass, and polymer substrates
*Glass substrates
 
*Polymer substrates
Film or pattern of photoresist/polymer
*Films, or patterned films, of any material except type IV (Pb, Te)
|style="background:WhiteSmoke; color:black"|
|
Silicon and glass substrates
*<span style="color:red">'''No metals'''</span><br>
 
*<span style="color:red">'''No metal oxides'''</span><br>
Film or pattern of all but Type IV
*Silicon substrates
|-
*III-V substrates
*Glass substrates
*Polymer substrates
*Films, or patterned films, of resists/polymers
|
*Silicon substrates
*III-V substrates (only if clean)
*Glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|}
|}
<br clear="all" />
<br clear="all" />


= Plasma ashing =
= Plasma Ashing process parameters=


 
{| class="wikitable"
{| border="2" cellspacing="0" cellpadding="4" align="left"
|-
!  
!  !! [[Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_4|Resist stripping]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_3:_Descum|Descum]] !! [[Specific_Process_Knowledge/Lithography/Descum#Plasma_Asher_4|Descum]] !! Surface treatment !! Other ashing of organic material
! Photoresist stripping
|-
! Descum after lithography
! scope=row style="text-align: left;" | Tool
! Surface treatment of plastic, ceramic and metal
| Plasma asher 4 & 5 || Plasma asher 3: Descum || Plasma asher 4 & 5 || Plasma asher 4 & 5 || Plasma asher 4 & 5
! Ashing of organic material
|-
|-  
! scope=row style="text-align: left;" | Process pressure
|'''Process pressure'''
| 1.3 mbar || 0.8 mbar || 1.3 mbar || 0.5-1.5 mbar || 0.5-1.5 mbar
|0.8- 1.2mbar
|0.5- 1.0mbar
|0.5- 1.0mbar
|0.8-1.5mbar
|-
|-
|'''Process gases'''
! scope=row style="text-align: left;" | Process gasses
|
*O<sub>2</sub> (100 sccm)
*N<sub>2</sub> (100 sccm)
|
*O<sub>2</sub> (45 sccm)
|
*O<sub>2</sub> (100 sccm)
*N<sub>2</sub> (100 sccm)
|
|
*O<sub>2</sub> (400 sccm)
*O<sub>2</sub>
*N<sub>2</sub> (0-70 sccm)
*N<sub>2</sub>
*CF<sub>4</sub>
|
|
*O<sub>2</sub> (70-201 sccm)
*O<sub>2</sub>
*N<sub>2</sub> (0-70 sccm)
|O<sub>2</sub>, CF<sub>4</sub>, N<sub>2</sub> or their mixtures
|O<sub>2</sub>
|-
|'''Process  power'''
|600-1000W
|150-300W
|150-300W
|1000W or less for heat- sensitive materials
|-
|-
|'''Process time'''
! scope=row style="text-align: left;" | Process power
|5-60 minutes
| 1000 W || 100 W || 200 W || 150-1000 W || 150-1000 W
|1-5 minutes
|a few seconds to a few minutes
|Between 0.5 and 20 hours, depending on the material
|-
|-
|'''Batch size'''
! scope=row style="text-align: left;" | Process time
|1-30
| 20-90 minutes || 1-10 minutes || 5-15 minutes || Seconds to minutes || Many hours, material dependent
|1-10
|1 wafer at a time
|1 wafer at a time, use a container, e.g Petri dish
|-
|-
! scope=row style="text-align: left;" | Substrate batch
| 1-25 || 1-2 || 1-25 || 1-25 || 1-25
|}
|}


<br clear="all" />
<br clear="all" />


A typical process time for stripping of 1.5 µm AZ5214e resist is 15-25 min and for stripping of 9.5 µm AZ4562 resist is 20-35 min with the process parameters: 210ml O<math>_2</math>/min or mixture of 210ml O<math>_2</math>/min and 70ml N<math>_2</math>/min, power 1000W.
{{:Specific Process Knowledge/Lithography/Strip/plasmaAsher03}}
 
A Descum process in manuel mode: O2: 70sccm, N2: 70sccm, power: 150W, time: 10min. Be sure to wait for cooling if the machine has been used at 1000W right before.
At a load at 2 Fused silica wafers resist removed 0.01-01,5um
 
==Plasma asher==
[[Image:plasmaasher2.JPG|300x300px|thumb|The Plasma asher is placed in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_asher click here]'''
 
The Plasma asher (300 auto load model) can be used for the following process:
 
*Photoresist stripping
*Surface cleaning after storage
*Surface cleaning after processes using oil pump or diffusion pump vacuum
*Surface cleaning as part of photolithography after wet developing of lacquer structures prior to wet or plasma etching
*Stripping of photoresist layers after etching, including after being exposed to high temperatures as after implantation, ion etching, sputter etching, RIE
*Removal of organic passivating layers and masks
*Etching of glass and ceramic
*Etching of SiO<math>_2</math>, Si<math>_3</math>N<math>_4</math>, Si
*Removal of polyimide layers
 
The machine can be used for almost every materials, but if you have any doubt about your materials are compatible with the plasma process it is better to ask photolithography group at Danchip.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=55 LabManager]'''
 
===Process Information===
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using Plasma Asher |SiO2 etch using Plasma Asher 1]]
 
==Plasma Asher 2==
[[Image:Plasma_Asher_6inch.jpg|300x300px|thumb|Plasma asher for removing AZ resist on 6" wafers: positioned in E-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#Plasma_Asher_2 click here]'''
 
The Plasma Asher 2 is the same as Plasma Asher 1 but has another loading system which is more convenient for batch loading of 6inch substrates.
 
In this machine, only O2 and N2 gases are used for processes (in PlasmaAsher1, CF4 is used as well).
 
The typical process parameters when operating the equipment:
*Photeresist stripping
Pressure: 0.8 - 1.0 mbar
 
Gas: O2
 
Power: 600 - 1000 watts
 
Time: 5 -30 min., depending on photoresist type and thickness
 
A typical process time for stripping of 1.5 um AZ5214e resist is 25 min for 6 wafers load in a boat, recipe 1.
 
A Descum process in manuel mode:O2:70, N2:70, power:150W, time:10min Be sure to wait for cooling if the mashine has been used at 1000W right before.
At a load at 2 Fused silicawafers resist removed 0.01-01,5um
 
The other materials have not been tested yet.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=200 LabManager]'''
 
<br clear="all" />
 
==III-V Plasma Asher==
[[Image:III-V_asher.jpg|300x300px|thumb|Plasma asher for removing resist on III-V samples: positioned in A-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Strip#III-V_Plasma_Asher click here]'''


Diener Pico Plasma Asher for III-V materials.
{{:Specific Process Knowledge/Lithography/Strip/plasmaAsher04}}


'''The user manual and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=186 LabManager]'''
{{:Specific Process Knowledge/Lithography/Strip/plasmaAsher05}}


<br clear="all" />
{{:Specific Process Knowledge/Lithography/Strip/resistStrip}}


=Acetone Strip=
{{:Specific Process Knowledge/Lithography/Strip/wetBench06and07}}


[[Image:Lift-off wet bench.JPG|300x300px|thumb|Acetone strip bench in D-3]]
=Decommisioned tools=
<span style="color:red">Plasma asher 1 was decommissioned 2024-12-02.</span>


{| border="1" cellspacing="0" cellpadding="4" align="left"
[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher1|Information about decommissioned tool can be found here.]]
|[[Image:Acetone_rough.jpg|150x150px|thumb|Acetone bath "rough" for removing most of the resist]]
|[[Image:Acetone_fine.jpg|150x150px|thumb|Acetone bath "fine" for removing the rest of the resist incl. ultrasound]]
|-
|}


This acetone strip is only for wafers without metal and SU-8.


There are two acetone bath: one rough for stripping the most of the resist from the surface and one fine with a ultrasound for cleaning the  resists remains.
<span style="color:red">Plasma asher 2 was decommissioned 2024-12-02.</span>
 
 
'''Here are the main rules for acetone strip use:'''
*Place the wafers in a wafer holder and put them in the first bath for 2-5 min, this time is depending how much resist you have on the surface.
*After the rough strip place your wafers directly in the final bath, switch on for the ultra sound  and strip them for 2-3 min.
*Rinse your wafers for 4-5 min. in running water after stripping .


[[Specific Process Knowledge/Lithography/Strip/PlasmaAsher2|Information about decommissioned tool can be found here.]]
<br clear="all" />
<br clear="all" />
==Overview of acetone benches==
{| border="2" cellspacing="0" cellpadding="4" align="left"
!
! Acetone strip
! Lift-off
|-
|'''General description'''
|
wet stripping of resist
|
lift-off process
|-
|'''Chemical solution'''
|CH<sub>3</sub>COCH<sub>3</sub>
|CH<sub>3</sub>COCH<sub>3</sub>
|-
|'''Process temperature'''
|20 <sup>o</sup>C
|20 <sup>o</sup>C
|-
|'''Batch size'''
|
1-25 wafers at a time
|
1-25 wafer at a time
|-
|'''Size of substrate'''
|
4" wafers
|
4" wafers
|-
|'''Allowed materials'''
|
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
|
*All metals
|-
|}
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