|
|
| (286 intermediate revisions by 9 users not shown) |
| Line 1: |
Line 1: |
| <center><span style="background:Yellow">2nd Level - Process Topic</span></center>
| | {{cc-nanolab}} |
| '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
| |
|
| |
|
| | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge click here]''' |
| | <br> |
|
| |
|
| === Choose the process topic you are interested in === | | <span style="background:#FF2800">Currently no information on this page.</span> |
| | |
| *[[/Back-end processing|Back-end processing]]
| |
| | |
| *[[/Characterization|Characterization]]
| |
| | |
| *[[/E-beam lithography|E-beam lithography]]
| |
| | |
| *[[/Etch|Etch]]
| |
| | |
| *[[/Imprinting|Imprinting]]
| |
| | |
| *[[/Lithography|Lithography]] - '''New entry by the 18th of September - take a look'''
| |
| | |
| *[[/Photolithography|Photolithography]]
| |
| | |
| *[[/Thermal Process|Thermal Process]]
| |
| | |
| *[[/Thin film deposition|Thin film deposition]]
| |
| | |
| *[[/Wafer and sample drying|Wafer and sample drying]]
| |
| | |
| *[[/Bonding|Wafer Bonding]]
| |
| | |
| *[[/Wafer cleaning|Wafer Cleaning]]
| |
| | |
| *[[/Wafer Information|Wafer Information]]
| |
| | |
| *[[/III-V Process|III-V Process]]
| |
| | |
| ===This section is under construction [[Image:section under construction.jpg|70px]] ===
| |
| Sample processing:
| |
| *Clean the sample
| |
| *Drying Samples
| |
| *Make a layer on the sample
| |
| **Thermal Oxide growth
| |
| **Thin Film deposition
| |
| ***PVD
| |
| ****Sputter deposition
| |
| ****Thermal deposition
| |
| ****E-beam evaporation
| |
| ***CVD
| |
| ****LPCVD
| |
| ****PECVD
| |
| ***Coating
| |
| ****Spin coating
| |
| ****Spray coating
| |
| ****Electroplating
| |
| **Epitaxial growth
| |
| *Thermal treatment of the sample
| |
| *Make a mask on the sample
| |
| **Lithography
| |
| **Imprinting
| |
| *Transfer pattern into the sample
| |
| **Wet etch
| |
| **Dry etch
| |
| **Lift-off
| |
| *Direct structure definition
| |
| **Imprinting
| |
| **LASER machining
| |
| **Lithographic definition
| |
| **Polymer Injection molding
| |
| *Bonding samples together
| |
| *Characterize the sample
| |
| *Back end of the sample
| |
| **Chip/die mounting
| |
| **Wire bonding
| |
| **Dicing
| |
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
Feedback to this page: click here
Currently no information on this page.
