Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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==TPT Wire Bonder== | ==TPT Wire Bonder== | ||
[[Image:bond head - wedge insert.jpg|100px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]] | |||
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | |||
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding. | |||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | |||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder] | |||
==Ball Wire Bonder K&S 4524== | |||
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[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]] | |||
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[[Image: | <!-- copyright issue kabi | ||
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]] | |||
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[[Image:section under construction.jpg|70px]] ''Will be moved to building 451 during the PolyFabLab construction.'' | |||
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters. | |||
[[Image:K-S 4524 wirebonder DTU.jpg|thumb|300px|K&S 4524 ball wire bonder]] | |||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):''' | |||
<!-- remember to remove the type of documents that are not present --> | |||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder] | |||
==Equipment performance and process related parameters== | |||
[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]] | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
===Ball | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
Ball bonding | |style="background:WhiteSmoke; color:black"|<b>TPT Wire Bonder</b> | ||
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b> | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
*Al and Au 25µm wire bonding | |||
*Wedge and ball wire bonding | |||
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested) | |||
|style="background:WhiteSmoke; color:black"| | |||
*Au 25µm wire bonding | |||
*Ball wire bonding | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Performance | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
*Manual operation | |||
*Wedge bonding: | |||
**recommended min. bonding area 200 µm x 200 µm | |||
*Ball bonding: | |||
**recommended min. bonding area 200 µm x 200 µm | |||
**recommended temperature 120 <sup>o</sup>C. | |||
|style="background:WhiteSmoke; color:black"| | |||
*Semi-automatic and manual operation | |||
*Bond placement laser pointer | |||
*recommended min. bonding area 100 µm x 100 µm | |||
*recommended temperature 120 <sup>o</sup>C. | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Allowed materials | |||
|colspan="2" style="background:WhiteSmoke; color:black"| | |||
*Should be able to withstand the wire bonding temperature | |||
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4) | |||
|- | |||
|} | |||
<br clear="all" /> | |||
Latest revision as of 14:08, 29 June 2023
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Unless otherwise stated, this page is written by DTU Nanolab internal
TPT Wire Bonder
Bond head with insert showing wedge capillary
Will be temporary taken out of service during the PolyFabLab construction.
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
Ball Wire Bonder K&S 4524
Will be moved to building 451 during the PolyFabLab construction.
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
| Equipment | TPT Wire Bonder | Ball Wire Bonder | |
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| Purpose |
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| Performance |
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| Substrates | Allowed materials |
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