Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions

Latest revision as of 12:14, 13 June 2023

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Tin deposition

Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.

	E-beam evaporation (Temescal)
General description	E-beam deposition of Sn (line-of-sight deposition)
Pre-clean	Ar ion clean
Layer thickness	10Å to 1µm*
Deposition rate	1Å/s to 10Å/s
Pre-clean	Ar ion bombardment
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) small pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet
Comment	Tin has not yet been deposited in the Temescal to date (May 2022). Please contact the Thin Film group if you would like us to develop the process.

* For thicknesses above 600 nm permission is required.

@@ Line 1: / Line 1: @@
-'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin&action=edit click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tin click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
+== Tin deposition ==
-Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
+Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.
 {| border="1" cellspacing="0" cellpadding="3"
 |-style="background:silver; color:black"
 !
-! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+| E-beam deposition of Sn
-*Up to 1x4" wafers
+(line-of-sight deposition)
-*smaller pieces
 |-
 |-style="background:LightGrey; color:black"
 !Pre-clean
-|RF Ar clean
+|Ar ion  clean
 |-
 |-style="background:WhiteSmoke; color:black"
@@ Line 27: / Line 27: @@
 |-style="background:LightGrey; color:black"
 ! Deposition rate
-|2Å/s to 15Å/s
+|1Å/s to 10Å/s
+|-
+|-style="background:WhiteSmoke; color:black"
+!Pre-clean
+|Ar ion bombardment
+|-style="background:LightGrey; color:black"
+! Batch size
+|
+*Up to 4x6" wafers
+*Up to 3x8" wafers (ask for holder)
+*small pieces
 |-
 |-style="background:WhiteSmoke; color:black"
 !Allowed materials
@@ Line 34: / Line 48: @@
 |
 * Silicon
-* Silicon oxide
+*Silicon oxide
-* Silicon (oxy)nitride
+*Silicon (oxy)nitride
-* Photoresist
+*Photoresist
-* PMMA
+*PMMA
-* Mylar
+*Mylar
-* SU-8
+*Metals
-* Metals
+*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
 |-style="background:LightGrey; color:black"
 ! Comment
-|
+| Tin has not yet been deposited in the Temescal to date (May 2022).
+Please contact the Thin Film group if you would like us to develop the process.
 |}
-'''*''' ''For thicknesses above 200 nm permission is required.''
+'''*''' ''For thicknesses above 600 nm permission is required.''