Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
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'''Feedback to this page''': '''[mailto: | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/IMEC click here]''' | ||
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | |||
'''The | '''All links to Labmanager requires login.''' | ||
<br \> | |||
==Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Nanolab an '[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and do the cleaning and bonding very early in the morning with few people and thus lower particle level in the cleanroom) gives the best results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Nanolab to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use.== | |||
<br> | |||
===The IMEC process: Cleaning of wafers prior to fusion bonding=== | |||
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' Has been slightly modified by Karen Birkelund. | |||
'''Information about equipment relevant to this procedure can be found in LabManager:'''<br> | |||
<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
=== | Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=368 Fume hood 01: Acids/bases]'<br> | ||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=369 Fume hood 02: Acids/bases]'<br> | |||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=411 Wet bench 03: Wafer and mask cleaning]'<br> | |||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=413 Wet bench 05: Al etch]'<br> | |||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=383 Wafer Cleaning]'<br> | |||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=380 <i>Optional Bath</i> <b>(Currently not in operation!)</b>]'<br> | |||
{| border="1" cellspacing="0" cellpadding="5" align="center" | {| border="1" cellspacing="0" cellpadding="5" align="center" | ||
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|. | |. | ||
| | | | ||
*Takes | *Takes approximately 1,5 hours | ||
*Orient flat to minimize handling | *Orient flat to minimize handling | ||
* | *Preferably do the cleaning just before bonding to maintain cleanliness! | ||
|Get CLEAN box for wafers!!! | |Get CLEAN box for wafers!!! | ||
|- | |- | ||
|2 | |2 | ||
|Piranha | |Piranha | ||
|Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1) | |Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1)<br> | ||
Temp: 80 <sup>o</sup>C | Temp: 80<sup>o</sup>C<br> | ||
Time: 5 min | Time: 5 min | ||
|You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). <b>However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes!</b> Alternatively use a very clean glass beaker. The recommended procedure is: | |||
|Clean | *Pour H<sub>2</sub>SO<sub>4</sub> into bath/beaker | ||
Pour | *Place wafers in clean carrier (USE this in steps 2-7) | ||
*Add H<sub>2</sub>O<sub>2</sub> to the beaker that already contains H<sub>2</sub>SO<sub>4</sub> | |||
*Wait 30 sec to ensure mixing of chemicals, then dip wafers. | |||
|Maybe clean the tank the day before! | |Maybe clean the tank the day before! | ||
|- | |- | ||
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|Rinse | |Rinse | ||
|2 min. rinse | |2 min. rinse | ||
|. | |Rinse you wafers with DI-water. | ||
|Put into dedicated wet box for IMEC | |Put into dedicated wet box for IMEC | ||
|- | |- | ||
|4 | |4 | ||
|IMEC | |IMEC | ||
|DI water:5% HF: | |Mixture: DI water:5% HF:Isopropanol (100:10:1)<br> | ||
Temp: 25 <sup>o</sup>C | Temp: 25<sup>o</sup>C<br> | ||
Time: 100 sec | Time: 100 sec | ||
|<b>Make an appointment some days in advance with a Nanolab employee to help you with this step!</b> | |||
*Clean tank (Cleanroom D-3, the 'Optional Bath' inside Wet Bench 05: Al etch) | |||
*Mix your IMEC solution in dedicated bottle (IMEC) inside a fume hood | |||
*Ask a Nanolab employee to help you filling the solution into the 'Optional Bath' tank! | |||
| | | | ||
. | . | ||
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|Not nitride wafers! | |Not nitride wafers! | ||
Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1) | Mixture: H<sub>2</sub>SO<sub>4</sub>:H<sub>2</sub>O<sub>2</sub> (4:1) | ||
Temp: 80 <sup>o</sup>C | Temp: 80<sup>o</sup>C<br> | ||
Time: 20 min | Time: 20 min<br> | ||
|Re-use | |Re-use piranha previously made in step 2 | ||
Makes wafers hydrophilic | Makes wafers hydrophilic |
Latest revision as of 11:07, 1 February 2023
Feedback to this page: click here
Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Labmanager requires login.
Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Nanolab an 'RCA clean' prior to bonding (and do the cleaning and bonding very early in the morning with few people and thus lower particle level in the cleanroom) gives the best results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Nanolab to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use.
The IMEC process: Cleaning of wafers prior to fusion bonding
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995. Has been slightly modified by Karen Birkelund.
Information about equipment relevant to this procedure can be found in LabManager:
Info page for 'Fume hood 01: Acids/bases'
Info page for 'Fume hood 02: Acids/bases'
Info page for 'Wet bench 03: Wafer and mask cleaning'
Info page for 'Wet bench 05: Al etch'
Info page for 'Wafer Cleaning'
Info page for 'Optional Bath (Currently not in operation!)'
Step | Process | Details | Comments | Comments |
---|---|---|---|---|
1 | Pre-bond cleaning of Si wafers prior to fusion bonding. | . |
|
Get CLEAN box for wafers!!! |
2 | Piranha | Mixture: H2SO4:H2O2 (4:1) Temp: 80oC |
You can use the 'Mask Clean' bath in Wet Bench 04 (in cleanroom D-3). However, this requires planning at least a couple of days in advance, since the bath is primarily used for other purposes! Alternatively use a very clean glass beaker. The recommended procedure is:
|
Maybe clean the tank the day before! |
3 | Rinse | 2 min. rinse | Rinse you wafers with DI-water. | Put into dedicated wet box for IMEC |
4 | IMEC | Mixture: DI water:5% HF:Isopropanol (100:10:1) Temp: 25oC |
Make an appointment some days in advance with a Nanolab employee to help you with this step!
|
. |
5 | Rinse | 2 min. rinse | Put into dedicated wet box for IMEC | . |
6 | Piranha | Not nitride wafers!
Mixture: H2SO4:H2O2 (4:1)
Temp: 80oC |
Re-use piranha previously made in step 2
Makes wafers hydrophilic |
. |
7 | Rinse & spin dry | 5 min rinse | . | . |
8 | Put wafers in new clean carrier box | . | . | . |