Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions
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== Polisher/Lapper == | == Polisher/Lapper == | ||
[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | <!-- copyright issue rkc --> | ||
<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | |||
Training is required before using th machine. The machine is equipped with a LabManager lock.--> | |||
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | ||
'''The user manual, user APV, technical information and contact information can be found in LabManager:''' | '''The user manual, user APV, technical information and contact information can be found in LabManager:''' | ||
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==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]] | |||
{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
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*Performance range --> | *Performance range --> | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range | ||
|style="background:LightGrey; color:black"|Polishing liquid | |style="background:LightGrey; color:black"|Polishing liquid | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Al2O3 (alumina) powder: 3, 9 or 20 µm | *Al2O3 (alumina) powder: 3, 9 or 20 µm | ||
*Chemlox (for polishing) | *Chemlox (for polishing) | ||
*SF1 Polishing Fluid (for polishing e.g. SiO2) | |||
|- | |||
|style="background:LightGrey; color:black"|Polishing cloths | |||
|style="background:WhiteSmoke; color:black"| | |||
*Chemcloth Polishing Cloths (for use with SF1 liquid) | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Rotation speed | |style="background:LightGrey; color:black"|Rotation speed | ||
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*Allowed material 3 --> | *Allowed material 3 --> | ||
|- | |- | ||
|} | |} | ||
[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]] | |||
[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]] | |||
<br clear="all" /> | <br clear="all" /> |
Latest revision as of 14:24, 28 February 2023
Feedback to this page: click here
Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links Labmanager requires login.
Polisher/Lapper
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
The user manual, user APV, technical information and contact information can be found in LabManager:
The Logitech PM5 Polisher/Lapper in LabManager
Equipment | Polisher/Lapper | |
---|---|---|
Purpose |
Thinning of substrates of |
|
Performance | Thinning |
|
Polishing |
| |
Process parameter range | Polishing liquid |
|
Polishing cloths |
| |
Rotation speed |
| |
Arm sweep |
| |
Substrates | Batch size |
|
Allowed materials |
|