Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
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==TPT Wire Bonder==
==TPT Wire Bonder==
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 2nd floor]]
[[Image:bond head - wedge insert.jpg|100px|thumb|TPT wire bonder<br/>Bond head with insert showing wedge capillary]]


The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.  
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.
 
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
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<!-- give the link to the equipment info page in LabManager: -->
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=238 TPT Wire Bonder]
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==Ball Wire Bonder K&S 4524==
==Ball Wire Bonder K&S 4524==
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 2nd floor]]
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[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
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[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
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[[Image:section under construction.jpg|70px]] ''Will be moved to building 451 during the PolyFabLab construction.''


The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.  
 
[[Image:K-S 4524 wirebonder DTU.jpg|thumb|300px|K&S 4524 ball wire bonder]]
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''  
 
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]


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==Equipment performance and process related parameters==


*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]]
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==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
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*Manual operation
*Manual operation
*Wedge bonding:  
*Wedge bonding:  
**recommended min. bonding area 200 µm
**recommended min. bonding area 200 µm x 200 µm
*Ball bonding:   
*Ball bonding:   
**recommended min. bonding area 200 µm
**recommended min. bonding area 200 µm x 200 µm
**recommended temperature 120 <sup>o</sup>C.
**recommended temperature 120 <sup>o</sup>C.
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Semi-automatic and manual operation
*Semi-automatic and manual operation
*Bond placement laser pointer
*Bond placement laser pointer
*recommended min. bonding area 100 µm
*recommended min. bonding area 100 µm x 100 µm
*recommended temperature 120 <sup>o</sup>C.
*recommended temperature 120 <sup>o</sup>C.
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Latest revision as of 14:08, 29 June 2023

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

TPT Wire Bonder

TPT wire bonder
Bond head with insert showing wedge capillary

Will be temporary taken out of service during the PolyFabLab construction.

The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT Wire Bonder

Ball Wire Bonder K&S 4524

Will be moved to building 451 during the PolyFabLab construction.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

K&S 4524 ball wire bonder

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond
Equipment TPT Wire Bonder Ball Wire Bonder
Purpose
  • Al and Au 25µm wire bonding
  • Wedge and ball wire bonding
  • Au ribbon (100x20µm) bonding
    (we have tools and wire but it has not been tested)
  • Au 25µm wire bonding
  • Ball wire bonding
Performance
  • Manual operation
  • Wedge bonding:
    • recommended min. bonding area 200 µm x 200 µm
  • Ball bonding:
    • recommended min. bonding area 200 µm x 200 µm
    • recommended temperature 120 oC.
  • Semi-automatic and manual operation
  • Bond placement laser pointer
  • recommended min. bonding area 100 µm x 100 µm
  • recommended temperature 120 oC.
Substrates Allowed materials
  • Should be able to withstand the wire bonding temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)


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