Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links Labmanager requires login.

Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing) SF1 Polishing Fluid (for polishing e.g. SiO2)
	Polishing cloths	Chemcloth Polishing Cloths (for use with SF1 liquid)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

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 <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
-== Polisher/Lapper [[Image:section under construction.jpg|70px]] ==
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
-[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+'''All links Labmanager requires login.'''
+== Polisher/Lapper ==
+<!-- copyright issue rkc -->
+<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+Training is required before using th machine. The machine is equipped with a LabManager lock.-->
 The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
-'''The user manual, user APV(s), technical information and contact information can be found in LabManager:'''
+'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
 <!-- remember to remove the type of documents that are not present -->
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 ==Equipment performance and process related parameters==
+[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
 {| border="2" cellspacing="0" cellpadding="2"
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 *Performance range -->
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
 |style="background:LightGrey; color:black"|Polishing liquid
 |style="background:WhiteSmoke; color:black"|
 *Al2O3 (alumina) powder: 3, 9 or 20 µm
 *Chemlox (for polishing)
+*SF1 Polishing Fluid (for polishing e.g. SiO2)
+|-
+|style="background:LightGrey; color:black"|Polishing cloths
+|style="background:WhiteSmoke; color:black"|
+*Chemcloth Polishing Cloths (for use with SF1 liquid)
 |-
 |style="background:LightGrey; color:black"|Rotation speed
@@ Line 97: / Line 109: @@
 *Allowed material 3 -->
 |-
 |}
+[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
+[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
 <br clear="all" />