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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''


==Disco Automatic dicing saw, model DAD321==
==Disco Automatic dicing saw, model DAD321 (old) and DAD3241 (new 2021)==
The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.
The dicers feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.


The dicer at DANCHIP is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.
The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty.  
<!--
[[Image:Disco_DAD_321_Dicer.jpg|thumb|Dicer positioned on 1. floor bldg 346 room 157]]
[[Image:DAD_3241_picture.jpg|thumb|Dicer positioned on 1. floor bldg 346 room 157]]
-->


In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.


'''The user manual, user APV, technical information and contact information can be found in LabManager:'''  
[[File:IMG_20230228_112922.jpg|thumb|800px|Dicers positioned on 1. floor bldg 346 room 157]]
<!-- remember to remove the type of documents that are not present -->
 
Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer.
Please see the illustrations for a good and a bad design.
 
{| cellpadding="2" style="border: 2px solid darkgray;"
! width="300" |
! width="300" |
! width="300" |
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|- border="1" align="center"
|[[Image:Good design 2.jpg|300x300px|Good design]] || [[Image:Good design 3.jpg|300x300px|Good design]] || [[Image:Bad design 1b.jpg|300x300px|BAD design]]
|
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|-
| || drawings by Jesper Hanberg, DTU Nanolab ||
|}


[[Image:Disco_DAD_321_Dicer.jpg|300x300px|thumb|Dicer positioned on 1. floor bldg 346 room 157|right]]
== Process information ==


*'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=168 Saw in LabManager]
**[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
 
**[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]


== Process information ==
*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials |Comparing dicing parameters for different materials]]
*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples |Images of diced samples]]
*Dicing work sheet: [[Media:Dicing Work Sheet v2.docx |Dicing Work Sheet v2.docx]] Fill out before requesting dicing.


*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials |bla bla]]


===Overview of the performance Disco DAD 321 and DAD 3241 Dicer===


===Overview of the performance Disco DAD321 Dicer===
[[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]]


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left" rowspan="2"|Machine
|style="background:LightGrey; color:black"|Equipment for dicing out samples
|style="background:LightGrey; color:black"|Name
|style="background:WhiteSmoke; color:black"|
DAD 321 (old)
|style="background:WhiteSmoke; color:black"|
DAD 3241 (new 2021)
|-
|style="background:LightGrey; color:black"|Operation
|style="background:WhiteSmoke; color:black"|
*Keyboard
*F-key menu driven
*BW screen
|style="background:WhiteSmoke; color:black"|
*Touch screen
*Guided menu
*Color screen
|-
!style="background:silver; color:black;" align="left" rowspan="2"|Purpose  
|style="background:LightGrey; color:black"|Main usage
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Dicing Borofloat and Fused Silica wafers
|style="background:WhiteSmoke; color:black"|
Dicing Silicon wafers
|-
|style="background:LightGrey; color:black"|Wafer type
|style="background:WhiteSmoke; color:black"|
*'''Pyrex/Borofloat'''
*'''Fused Silica'''
*'''Silicon bonded to Pyrex/Borofloat'''
*'''Silicon bonded to Silicon'''
* Other materials - ask
*Pure Silicon samples
*Pure Silicon samples
|style="background:WhiteSmoke; color:black"|
*'''Pure Silicon samples'''
*Pyrex/Borofloat
*Silicon bonded to Silicon
*Silicon bonded to Silicon
*Silicon bonded to Pyrex/Borofloat
*Silicon bonded to Pyrex/Borofloat
*Pyrex/Borofloat
* Other materials - ask
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
Line 37: Line 94:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
192 mm
192 mm
|style="background:WhiteSmoke; color:black"|
210 mm
|-
|-
|style="background:LightGrey; color:black"|X-axis cut speed
|style="background:LightGrey; color:black"|X-axis cut speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.1 - 300 mm/sec
0.1 - 300 mm/sec
|style="background:WhiteSmoke; color:black"|
0.1 - 800 mm/sec
|-
|-
|style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
162 mm
162 mm
|style="background:WhiteSmoke; color:black"|
210 mm
|-
|-
|style="background:LightGrey; color:black"|Y-axis index step
|style="background:LightGrey; color:black"|Y-axis index step
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.0002 mm
0.0002 mm
|style="background:WhiteSmoke; color:black"|
0.0001 mm
|-
|-
|style="background:LightGrey; color:black"|Y-axis single error
|style="background:LightGrey; color:black"|Y-axis single error
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
0.003 or less
0.003 or less
|style="background:WhiteSmoke; color:black"|
0.002 or less
|-
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
|style="background:LightGrey; color:black"|Maximum blade size
|style="background:WhiteSmoke; color:black"|
ø76.2 mm
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
Line 64: Line 126:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
up to 6"
up to 6"
|style="background:WhiteSmoke; color:black"|
up to 8"
|-
|-
| style="background:LightGrey; color:black"|Layers that can't be diced
| style="background:LightGrey; color:black"|Layers that can't be diced
Line 69: Line 133:
*Thick metal (>0.75 mm)
*Thick metal (>0.75 mm)
*III-V samples
*III-V samples
|style="background:WhiteSmoke; color:black"|
*Thick metal (>0.75 mm)
*III-V samples
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Accessories
| style="background:LightGrey; color:black"|Accessories for wafer handling
|style="background:WhiteSmoke; color:black"|
*Manual wafer mounter for blue tape
|style="background:WhiteSmoke; color:black"|
*Manual wafer mounter for tape with backside foil (Powatec P200)
*Automatic Wafer cleaning station (Disco DCS 1441)
*UV curing station (Powatec U200)
|-  
|-  
|}
|}


[[Image:IMG 20230228 113101.jpg|thumb|600px|left|Wafer mounting table for DAD 321]]
[[Image:IMG 20230228 113035.jpg|thumb|600px|UV curing/Tape release]]
<br clear="all" />


===Comparing dicing parameters for different materials '''DAD 321'''===


<br clear="all" />
[[Image:IMG 20230228 113045.jpg|300px|thumb|Wafer cleaning station DCS 1441]]


===Comparing dicing parameters for different materials===
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters


{| border="2" cellspacing="0" cellpadding="4" align="center"
{| border="2" cellspacing="0" cellpadding="4"  
!
!
!Silicon
!Silicon
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|-valign="top"
|-valign="top"
|'''Recommended feed speed'''
|'''Recommended feed speed'''
|Up to 5 mm/sec
|Up to 20 mm/sec
|Up to 2 mm/sec (0.5 mm/sec)
|Up to 2 mm/sec (0.5 mm/sec)
|-valign="top"
|-valign="top"
|'''Recommended dice depth'''
|'''Recommended dice depth'''
|Leave 200 µm uncut(preferred).<br> It is possible to cut through the sample.
|Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample.
|Leave 200 µm uncut (preferred). <br> It is possible to cut through the sample.
|Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). <br>
If you have thicker wafers then use several passes decreasing the blade height for each pass.<br>
For 500 µm thick wafers set blade height to 200µm (preferred).<br>
This leaves 125µm uncut since blue tape is 75µm.<br>
It is possible to cut through the sample.
|-valign="top"
|-valign="top"
|'''Max. sample thickness'''
|'''Max. sample thickness'''
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|-  
|-  
|}
|}
===Comparing dicing parameters for different materials '''DAD 3241'''===
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
{| border="2" cellspacing="0" cellpadding="4"
!
!Silicon
!Other materials
|- valign="top"
|'''Bladetype'''
|HUB Blade
|Ask! (HUBless)
|-valign="top"
|'''Blade width'''
|50 µm
|ask
|-valign="top"
|'''Cutlinewidth'''
|50 µm
|ask
|-valign="top"
|'''Recommended feed speed'''
|Up to 40 mm/sec
|ask
|-valign="top"
|'''Recommended dice depth'''
|We usually cut all way through the wafer with a blade height of 50µm (preferred).<br>
|ask!
|-valign="top"
|'''Max. sample thickness'''
|1.5 mm
|2.0 mm
|-
|}
<!--
This is not a typical dice line!


===Images of diced samples===
===Images of diced samples===
[[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]]
[[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]]
-->
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