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This is a micrometer-screw.
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[[image:SEM-Leo.jpg|200x200px|right|thumb|The Leo SEM has its own dedicated room: Cleanroom 9]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''
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==Thickness Measurer==
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]]


It measures with an accurracy within a few µm.
There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
Measure the wafer in the box next to the meter.If ok other wafers can be measured.
 
There is a calibration by the DEKTAK.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.  
It is calibrated at about 750µ
 
 
The user manual, technical information and contact information can be found in
[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 LabManager].
 
==Quality Control - Recipe Parameters and Limits==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|-
|
The measured standard thickness is 0.1 mm. The measured result has to be within &plusmn; 0.005 mm. The QC is preformed once a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br>
|}
<br> <br>
 
==Equipment performance and process related parameters==
 
{| border="2" cellspacing="2" cellpadding="3"
 
|-
!style="background:silver; color:black;" align="center"|
Purpose
|style="background:LightGrey; color:black"|
Thickness measurer
|style="background:WhiteSmoke; color:black"|
*Wafer thickness
*Depths of larger grooves
*Heigth of larger samples
|-
!style="background:silver; color:black" align="center"|
Performance
|style="background:LightGrey; color:black"|
Thickness resolution
|style="background:WhiteSmoke; color:black"|
*< 1 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
Substrates
|style="background:LightGrey; color:black"|
Batch size
|style="background:WhiteSmoke; color:black"|
*One sample
|-
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
*No restrictions
|-
|}
<br>
{| border="2" cellspacing="2" cellpadding="3"
 
|-
!style="background:silver; color:black;" align="center"|
Purpose
|style="background:LightGrey; color:black"|
Thickness measurer (wafers)
|style="background:WhiteSmoke; color:black"|
*Wafer thickness
*Depths of larger grooves
|-
!style="background:silver; color:black" align="center"|
Performance
|style="background:LightGrey; color:black"|
Thickness resolution
|style="background:WhiteSmoke; color:black"|
*< 1 µm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
Substrates
|style="background:LightGrey; color:black"|
Batch size
|style="background:WhiteSmoke; color:black"|
*One sample
|-
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
*Only wafers
|-
|}

Latest revision as of 15:16, 2 June 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Thickness Measurer

Thickness Measurer. Positioned in cleanroom D-3

There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


The user manual, technical information and contact information can be found in LabManager.

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.



Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger samples

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions


Purpose

Thickness measurer (wafers)

  • Wafer thickness
  • Depths of larger grooves

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • Only wafers
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