Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions

Latest revision as of 13:53, 10 May 2023

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this section: Imprinter 01 click here

Imprinter 01

The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

The user manual, user APV, and contact information can be found in LabManager

Imprint information

Imprinting

Imprint resist information and flows

Imprinting

Overview of the performance of the Imprinter 01 and some process related parameters

Purpose		Imprinting
Performance	Alignment accuracy	Only by eye
Process parameter range	Process Temperature	Room temperature to 200°C
	Process pressure	~5 $\cdot$ 1mbar - atm
	Imprint Pressure	0-6 bar
Substrates	Batch size	Pieces to 4" wafers
	Substrate material allowed	Silicon Quartz Pyrex
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Poly Silicon Photoresist PMMA TOPAS SU-8 Metals: Au, Sn, Ag, Al, Ti.

@@ Line 1: / Line 1: @@
-==EVG NIL==
+{{cc-nanolab}}
-[[Image:EVG NIL.jpg|200 × 200px|thumb|right|The EVG NIL is positioned in Cleanroom 4.]]
-'''Feedback to this section''':
+'''Feedback to this section''': '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''
-'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# EVG NIL click here]'''
-The EVG NIL is a system for imprinting in polymers (Hot Embossing), and for bonding on wafer scale. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. In principle it is also possible to align the substrate and stamp before imprint, but it is much more difficult.
+==Imprinter 01==
-It is possible to fill bonded cavities with a desired gas. At the moment we have SF6 on the system, but if you would like another one, please contact Rune Christiansen.
+[[Image:imprinterfig1.jpg|300x300px|thumb|Imprinter 01: Positioned in cleanroom A-5]]
+The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).
-'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=153 LabManager]'''
+'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=391 LabManager]'''
 <br clear="all" />
-==Process information==
-====Types of Bonding====
-*[[Specific Process Knowledge/Bonding/Eutectic bonding|Eutectic bonding]]
-*[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]]
-*[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]]
 ====Imprint information====
@@ Line 24: / Line 18: @@
 <br clear="all" />
-==Overview of the performance of the EVG NIL and some process related parameters==
+<br clear="all" />
+====Imprint resist information and flows====
+*[[Specific Process Knowledge/Imprinting|Imprinting]]
+<br clear="all" />
+==Overview of the performance of the Imprinter 01 and some process related parameters==
 {| border="2" cellspacing="0" cellpadding="10"
 |-
 !style="background:silver; color:black;" align="left"|Purpose
-|style="background:LightGrey; color:black"|Imprint and bonding
+|style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*Eutectic bonding
-*Fusion bonding
-*Anodic bonding
 *Imprinting
 |-
@@ Line 39: / Line 38: @@
 |style="background:LightGrey; color:black"|Alignment accuracy
 |style="background:WhiteSmoke; color:black"|
-*&plusmn; 5 microns for IR alignment
+*Only by eye
-*&plusmn; 10 microns for backside alignment
 |-
 |-
@@ Line 46: / Line 45: @@
 |style="background:LightGrey; color:black"|Process Temperature
 |style="background:WhiteSmoke; color:black"|
-*Room temperature to 500<math>\rm{^o}</math>C
+*Room temperature to 200°C
 |-
 |style="background:LightGrey; color:black"|Process pressure
 |style="background:WhiteSmoke; color:black"|
-*~5<math>\cdot</math>10<sup>-4</sup>mbar - 2000mbar
+*~5<math>\cdot</math>1mbar - atm
 |-
-|style="background:LightGrey; color:black"|Piston Force
+|style="background:LightGrey; color:black"|Imprint Pressure
 |style="background:WhiteSmoke; color:black"|
-*Depending on the area, for 4" wafers 200-20000N.
+*0-6 bar
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*One 4" or 6" wafer per run
+*Pieces to 4" wafers
-*Pieces are only allowed with speciel permission
 |-
 | style="background:LightGrey; color:black"|Substrate material allowed
 |style="background:WhiteSmoke; color:black"|
-*Silicon wafers
+*Silicon
-*Quartz wafers
+*Quartz
-*Pyrex wafers
+*Pyrex
 |-
 | style="background:LightGrey; color:black"|Material allowed on the substrate