Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions

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==EVG NIL==
{{cc-nanolab}}
[[Image:EVG NIL.jpg|200 × 200px|thumb|right|The EVG NIL is positioned in Cleanroom 4.]]


'''Feedback to this section''':  
'''Feedback to this section''': '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]'''
'''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography#EVG NIL click here]'''


==Imprinter 01==


[[Image:imprinterfig1.jpg|300x300px|thumb|Imprinter 01: Positioned in cleanroom A-5]]


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 LabManager]'''
The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).  


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=391 LabManager]'''
<br clear="all" />
====Imprint information====
*[[Specific Process Knowledge/Imprinting|Imprinting]]
<br clear="all" />
<br clear="all" />
====Imprint resist information and flows====
*[[Specific Process Knowledge/Imprinting|Imprinting]]


<br clear="all" />
<br clear="all" />
==Overview of the performance of the Imprinter 01 and some process related parameters==
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Imprinting
|-
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Alignment accuracy
|style="background:WhiteSmoke; color:black"|
*Only by eye
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
*Room temperature to 200°C
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*~5<math>\cdot</math>1mbar - atm
|-
|style="background:LightGrey; color:black"|Imprint Pressure
|style="background:WhiteSmoke; color:black"|
*0-6 bar
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*Pieces to 4" wafers 
|-
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*Silicon
*Quartz
*Pyrex
|-
| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:WhiteSmoke; color:black"|
*Silicon oxide
*Silicon (oxy)nitride
*Poly Silicon
*Photoresist
*PMMA
*TOPAS
*SU-8
*Metals: Au, Sn, Ag, Al, Ti.
|-
|}

Latest revision as of 13:53, 10 May 2023

The contents on this page, including all images and pictures, was created by DTU Nanolab staff unless otherwise stated.

Feedback to this section: Imprinter 01 click here

Imprinter 01

Imprinter 01: Positioned in cleanroom A-5

The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).

The user manual, user APV, and contact information can be found in LabManager



Imprint information



Imprint resist information and flows


Overview of the performance of the Imprinter 01 and some process related parameters

Purpose
  • Imprinting
Performance Alignment accuracy
  • Only by eye
Process parameter range Process Temperature
  • Room temperature to 200°C
Process pressure
  • ~51mbar - atm
Imprint Pressure
  • 0-6 bar
Substrates Batch size
  • Pieces to 4" wafers
Substrate material allowed
  • Silicon
  • Quartz
  • Pyrex
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Poly Silicon
  • Photoresist
  • PMMA
  • TOPAS
  • SU-8
  • Metals: Au, Sn, Ag, Al, Ti.
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