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<center><span style="background:PaleGreen">3rd Level - Material/Methode</span></center>
{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''




== Choose material to deposit ==
== Choose material to deposit ==


=== Dielectrica ===
{| {{table}}
*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
*[[/Deposition of Silicon Oxide|Silicon Oxide]]
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
*[[/Deposition of Titanium Oxide|Titanium Oxide]]
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"


=== Metals/elements ===
|style="background: LightGray"|
{| border="2" cellspacing="1" cellpadding="8"
[[/Deposition of Silicon|Silicon]] <br/>
|-
[[/Deposition of Germanium|Germanium]] <br/>
|
Period/Group
|IVB
|VB
|VIB
|VIIIB
|IB
|IIIA
|IVA
|-
|3
|.
|.
|.
|.
|.
|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Silicon|14 Si Silicon]]
|-
|4
|[[/Deposition of Titanium|22 Ti Titanium]]
|.
|[[/Deposition of Chromium|24 Cr Chromium]]
|[[/Deposition of Nickel|28 Ni Nickel]]
|[[/Deposition of Copper|29 Cu Copper]]
|.
|[[/Deposition of Germanium|32 Ge Germanium]]
|-
|5
|.
|.
|[[/Deposition of Molybdenum|42 Mo Molybdenum]]
|[[/Deposition of Palladium|46 Pd Palladium]]
|[[/Deposition of Silver|47 Ag Silver]]
|.
|[[/Deposition of Tin|50 Sn Tin]]
|-
|6
|.
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tungsten|74 W Tungsten]]
|[[/Deposition of Platinum|78 Pt Platinum]]
|[[/Deposition of Gold|79 Au Gold]]
|.
|.
|-
|}


===Alloys===
|style="background: #DCDCDC"|
*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
*[[/Deposition of NiCr|NiCr]] alloy
[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
*[[/Deposition of AlTi|AlTi]] alloy
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>




=== Polymers ===
|style="background: LightGray"|
*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
*Antistiction coating
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
*Topas
[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
*PMMA
[[/Deposition of Niobium Nitride| Niobium Nitride (NbN)]] - ''superconductors''<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Tungsten Nitride| Tungsten Nitride (W<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Tantalum Nitride| Tantalum Nitride (Ta<sub>x</sub>N<sub>y</sub>)]]<br/>


== Choose deposition equipment ==
|style="background: #DCDCDC"|
[[/Deposition of Carbon|Carbon]] <br/>
<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>


*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Hummer|Hummer]] - ''Gold sputtering system''
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''


|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Sputter deposition of metals and alloys|Iron]]<br/>
[[/Deposition of Magnesium|Magnesium]]<br/>
[[/Deposition of Molybdenum|Molybdenum]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Niobium|Niobium]]<br/>
[[/Deposition of Palladium|Palladium]]<br/>
[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Ruthenium|Ruthenium]]<br/>
[[/Deposition of Silver|Silver]]<br/>
[[/Deposition of Tantalum|Tantalum]]<br/>
[[/Deposition of Tin|Tin]]<br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Scandium|Scandium]]<br/>




=  Section under construction [[Image:section under construction.jpg|70px]] =


Retrieved from "http://userwiki.danchip.dtu.dk/index.php?title=Under_Construction_headline&oldid=911"=
|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Deposition of NbTi|NbTi]] <br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
[[/Deposition of MoSi|MoSi]] alloy (50%/50% by At.%) <br/>


{| style="color: black;" width="100%"
And an electroceramic:
| colspan="2" |
|-


| style="width: 50%"|
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]


{| style="color: black;" width="100%"
|style="background: LightGray"|
| colspan="2" |  
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
|-
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
| style="width: 40%"|


==[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]==
|style="background: #DCDCDC"|
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
Topas <br/>
PMMA


===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
|style="background: LightGray"|
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
[[/Deposition of CrSi|CrSi bilayer]] <br/>
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
|-
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]
|}


===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.
*[[Specific Process Knowledge/Lithography/Coaters#SSE Spinner|SSE Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1 (Laurell)]]
*[[Specific Process Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]]


===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
== Choose deposition equipment ==
*[[Specific Process Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner-6inch]]
*[[Specific Process Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]
*[[Specific Process Knowledge/Lithography/UVExposure#Inclined UV lamp|Inclined UV lamp]]
| style="width: 40%"|


===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
*[[Specific Process Knowledge/Lithography/Baking#Hotplates|Hotplates]]
*[[Specific Process Knowledge/Lithography/Baking#Ovens|Ovens]]


===[[Specific Process Knowledge/Lithography/Development|Development]]===
{| {{table}}
*[[Specific Process Knowledge/Lithography/Development#Automatic Developer Bench for 4" and 6"|Developer Bench]]
| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''


===[[Specific Process Knowledge/Lithography/Strip|Strip]]===
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 1|Plasma Asher 1]]
*[[Specific Process Knowledge/Lithography/Strip#Plasma Asher 2|Plasma Asher 2]]
*[[Specific Process Knowledge/Lithography/Strip#III-V Plasma Asher|III-V Plasma Asher]]
*[[Specific Process Knowledge/Lithography/Strip#Rough Acetone Strip|Rough Acetone Strip]]
*[[Specific Process Knowledge/Lithography/Strip#Fine Acetone Strip|Fine Acetone Strip]]


===[[Specific Process Knowledge/Lithography/LiftOff|Lift-off]]===
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOffWetBench|Lift-off Wet Bench]]
*[[Specific Process Knowledge/Lithography/LiftOff#LiftOff(4",6")|Lift-off (4", 6")]]


===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
|-valign="top"
*[[Specific Process Knowledge/Lithography/WaferCleaning#Spindryers|Spin dryers]]
|style="background: LightGray"|
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/thermalevaporator|Thermal evaporator]]
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''


|}
<!--*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
| style="width: 50%"|
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
==[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]==
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|SÜSS Spinner-Stepper]]
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[Specific Process Knowledge/Lithography/DUVStepper#DUV Stepper FPA-3000EX4 from Canon|DUV Stepper FPA-3000EX4 from Canon]]
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
*[[Specific Process Knowledge/Lithography/DUVStepper#Process information|Process information]]
*[[Specific Process Knowledge/Lithography/DUVStepper#Overview of performance|Overview of performance]]
 
==[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]==
*[[Specific Process Knowledge/Lithography/EBeamLithography#Performance of the e-beam writer|Performance]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Getting started|Getting started]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#E-beam resists and Process Flows|E-beam resists and Process Flows]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Proximity Error Correction|Proximity Error Correction]]
*[[Specific Process Knowledge/Lithography/EBeamLithography#Charging of non-conductive substrates|Charging of non-conductive substrates]]
 
==[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]==
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#Molecular Vapour Deposition|Molecular Vapour Deposition]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#ObducatNIL|Obducat NIL]]
*[[Specific Process Knowledge/Lithography/NanoImprintLithography#EVG NIL|EVG NIL]]
 
==[[Specific Process Knowledge/Lithography/3DLithography|3D Lithography]]==
*[[Specific Process Knowledge/Lithography/3DLithography#2-Photon Polymerization|2-Photon Polymerization]]


|style="background: #DCDCDC"|
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
|style="background: LightGray"|
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
|style="background: #DCDCDC"|
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
|style="background: LightGray"|
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
|style="background: #DCDCDC"|
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
|-
|}
|}
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition"