Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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'''Feedback to this page''': '''[mailto:wetchemistry@ | '''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Chrominum_Etch click here]''' | ||
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | |||
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.''' | |||
'''All measurements on this page has been made by Nanolab staff.''' | |||
==Wet etching of Chromium== | ==Wet etching of Chromium== | ||
[[ | [[File:Si etch 3.png|300x300px |thumb| Work space in Fume Hood 06 in cleanroom D-3 can be used for wet chromium etching - workspace should be booked.]] | ||
We use the following solution to etch chromium: | |||
# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login to kemibrug) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here] | |||
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min. | |||
'''Etch in Fume hood''' | |||
Wet etching of chromium in fume hood at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably fume hood 6 for Si etch 3 in D-3 | |||
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=4748&mach=368&chpr=0 here]. | |||
PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured) | |||
Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste. | |||
=== | '''Etching of Chromium in Acid 1 wetbench 11''' | ||
[[File:Wetbench 11.png|300x300px|thumb|Acid 1 Wetbench 11 in cleanroom D-3 can be used for wet chromium etching of 6" and 8" wafers, after agreement with wetchemistry group.]] | |||
Always make an agreement with Wetchemistry group before training | |||
The bath is for 6" and 8" wafers. | |||
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 here]. | |||
===Overview of the chromium etch process=== | |||
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | ||
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! Chromium etch | ! Chromium etch in Fume hood | ||
! Chromium etch | ! Chromium etch Acid 1 wetbench 11 | ||
|- | |- | ||
| Line 37: | Line 51: | ||
Etch of chromium | Etch of chromium | ||
| | | | ||
Etch of | Etch of Chromium 6" and 8" wafers | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Link to safety APV and KBA | !Link to safety APV and KBA | ||
|[http://labmanager | |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here]. | ||
[ | [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here] | ||
|[ | |[https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 see Wetbench 11 APV/manual here]. | ||
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here] | |||
|- | |- | ||
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!Chemical solution | !Chemical solution | ||
|Chrome Etch 18 | |Chrome Etch 18 | ||
| | |Chrome Etch 18 | ||
|- | |- | ||
| Line 56: | Line 71: | ||
!Process temperature | !Process temperature | ||
|Room temperature | |Room temperature | ||
|Room temperature | |||
|Room | |||
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| Line 69: | Line 82: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Etch rate | !Etch rate | ||
|~ | |~ 150 nm/min at 22°C | ||
|~ | |~ 150 nm/min at 22°C | ||
|- | |- | ||
| Line 76: | Line 89: | ||
!Batch size | !Batch size | ||
|1-7 4" wafers at a time | |1-7 4" wafers at a time | ||
| | |Up to 5 6" or 8" wafers at a time | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Size of substrate | !Size of substrate | ||
|Any size and number that can go inside the beaker in use | |Any size and number that can go inside the beaker in use | ||
| | |6" and 8" | ||
|- | |- | ||
| Line 89: | Line 102: | ||
|No restrictions. | |No restrictions. | ||
Make a note on the beaker of which materials have been processed. | Make a note on the beaker of which materials have been processed. | ||
| | | | ||
See the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=580 Cross Contamination Sheet] for Acid 1 | |||
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|} | |} | ||