Specific Process Knowledge/Etch/Wet Platinum Etch: Difference between revisions

From LabAdviser
Kabi (talk | contribs)
No edit summary
Hvje (talk | contribs)
No edit summary
 
(23 intermediate revisions by 5 users not shown)
Line 1: Line 1:
Ething of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions.
'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Platinum_Etch click here]'''


'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
'''All measurements on this page has been made by Nanolab staff.'''
Etching of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions.
==Wet Etching of Platinum==
[[Image:Fumehood1-2.jpg |300x300px|thumb|Wet Platinum Etch can be done in Fumehood 1 or 2 positioned in cleanroom D-3]]


Platinum can be etched by the following wet etch:
Platinum can be etched by the following wet etch:


*HCl : HNO<sub>3</sub> : H<sub>2</sub>O        (7 : 1 : 8) at 85 °C
*H<sub>2</sub>O : HCl : HNO<sub>3</sub>         (8 : 7 : 1) at 85 °C (note: etching starts at 70 C, 170nm etched in 5 min 70 C-85 C)* Nisoer July 2022
'''You have to be very careful when you work with this etch. It can generate nitrous gasses which are very toxic!!'''


At this moment we do not have any information on the etch rate. You should be aware that this wet etch will also etch gold and it is not possible to use any masking material, it is used as a stripper.
At this moment we do not have any information on the etch rate. You should be aware that this wet etch will also etch gold and it is not possible to use any masking material, it is used as a stripper.


Use the fumehood in cleanroom 2 for the setup. Use a glass beaker.
Wet etching of Platinum is done by making your own setup in a glass beaker in Fumehood 01 or 02 in Cleanroom D-3. Write content on the beaker and which metals has been etched with yellow permanent pen. You can see the APV  [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].
Write content on beaker and which metals has been etched with yellow permanent pen.


===PolySi Etch data===
===Platinum Etch data===


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
Line 28: Line 39:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Link to safety APV
!Link to safety APV
|[http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here].   
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see APV/Manual here].   


|-
|-
Line 40: Line 51:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Process temperature
!Process temperature
|85 °C
|85 °C etches at 70 C* Nisoer July 2022
|-
|-


Line 51: Line 62:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Etch rate
!Etch rate
| Mainly used as stripper  
| 1-10 nm/min (Not tested. Mainly used as stripper)
|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Batch size
!Batch size
|
|1-7 4" wafers at a time
1-7 4" wafers at a time
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Size of substrate
!Size of substrate
|
|Any that fits into a carrier that can go into the glass beaker  
Any that fits into a carrier that can go into the glass beaker  
|-
|-
|-style="background:WhiteSmoke; color:black"
!Allowed materials
|No restrictions.
Make a note on the beaker of which materials have been processed.
|}
|}

Latest revision as of 10:07, 7 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV requires login.

All measurements on this page has been made by Nanolab staff.

Etching of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.

Wet Etching of Platinum

Wet Platinum Etch can be done in Fumehood 1 or 2 positioned in cleanroom D-3

Platinum can be etched by the following wet etch:

  • H2O : HCl : HNO3 (8 : 7 : 1) at 85 °C (note: etching starts at 70 C, 170nm etched in 5 min 70 C-85 C)* Nisoer July 2022

You have to be very careful when you work with this etch. It can generate nitrous gasses which are very toxic!!

At this moment we do not have any information on the etch rate. You should be aware that this wet etch will also etch gold and it is not possible to use any masking material, it is used as a stripper.

Wet etching of Platinum is done by making your own setup in a glass beaker in Fumehood 01 or 02 in Cleanroom D-3. Write content on the beaker and which metals has been etched with yellow permanent pen. You can see the APV here.

Platinum Etch data

Platinum wet etch
General description

Etch of Platinum

Link to safety APV see APV/Manual here.
Chemical solution HCl : HNO3 : H2O (7 : 1 : 8)
Process temperature 85 °C etches at 70 C* Nisoer July 2022
Possible masking materials None
Etch rate 1-10 nm/min (Not tested. Mainly used as stripper)
Batch size 1-7 4" wafers at a time
Size of substrate Any that fits into a carrier that can go into the glass beaker
Allowed materials No restrictions.

Make a note on the beaker of which materials have been processed.