Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions

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'''Feedback to this page''': '''[mailto:wetchemistry@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Gold_Etch click here]'''
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
'''All links to Kemibrug (SDS) and Labmanager Including APV requires login.'''
'''All measurements on this page has been made by Nanolab staff.'''
[[Category: Equipment|Etch Wet Gold]]
[[Category: Etch (Wet) bath|Gold]]
Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  
Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  




==Etching of Gold==
==Etching of Gold==
[[Image:fumehoodetch-gold.jpg |300x300px|thumb|Wet Gold Etch: Done in the fumehood positioned in cleanroom 2]]
[[Image:Fumehood1-2.jpg |300x300px|thumb|Wet Gold Etch can be done in Fumehood 1 or 2 in cleanroom D-3]]
Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. You can see the APV [http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 here].
Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].


We have two different solutions:
We have two different solutions:


# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid witch will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''you have to be very carefull when you work with Aqua Regia (Kongevand) It can generate nitrous gases witch are very toxic!!'''
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!'''




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!  
!  
! Iodine based gold etch
! Iodine based gold etch
! Aqua Regia (Kongevand)
! Aqua Regia (kongevand)
! Dilute Aqua Regia (fortyndet kongevand)
|-
|-


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!General description
!General description
|
|
Etch of pure Gold with or without photoresist mask.
Etch of gold with or without photoresist mask.
|
|
Etch of pure Gold (as stripper).
Etch of gold (as stripper).
|
Etch of gold.
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Link to safety APV
!Link to safety APV
|[http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].  
|[http://labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]  
|-
|-
        
        
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|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|HCl:HNO<sub>3</sub>  (3:1)
|HCl:HNO<sub>3</sub>  (3:1)
|HCl:HNO<sub>3</sub>:H<sub>2</sub>O  (3:1:2)
|-
|-


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|-style="background:LightGrey; color:black"  
|-style="background:LightGrey; color:black"  
!Process temperature
!Process temperature
|20 <sup>o</sup>C
|20°C


|20 <sup>o</sup>C
|20°C


|20-30°C
|-
|-


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|
|
Unmasked - used as a stripper
Unmasked - used as a stripper
|
Difficult to mask. Mainly used as a stripper.
|-
|-


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|
|
~(??) nm/min - fast etch
~(??) nm/min - fast etch
|
~680 nm/min at 30°C
|-
|-


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!Batch size
!Batch size
|
|
1-5 4" wafers at a time
1-5 4" wafers at a time
|
1-5 4" wafers at a time
|
|
1-5 4" wafer at a time
1-5 4" wafers at a time
|-
|-


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|-style="background:LightGrey; color:black"  
|-style="background:LightGrey; color:black"  
!Size of substrate
!Size of substrate
|
|Any size and number that can go inside the beaker in use
2-6" wafers
|Any size and number that can go inside the beaker in use
|
|Any size and number that can go inside the beaker in use
2-6" wafers
|-
|-


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|
|
No restrictions when used in beaker.
No restrictions when used in beaker.
Make a note on the beaker of which materials have been processed.
|
No restrictions when used in beaker.
Make a note on the beaker of which materials have been processed.  
Make a note on the beaker of which materials have been processed.  
|-
|-
|}
|}

Latest revision as of 14:22, 31 January 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV requires login.

All measurements on this page has been made by Nanolab staff.

Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.


Etching of Gold

Wet Gold Etch can be done in Fumehood 1 or 2 in cleanroom D-3

Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV here.

We have two different solutions:

  1. Iodine etch: KI:I2:H2O - 100g:25g:500ml - standard at DTU Nanolab. Can be used with AZ resist as mask.
  2. Aqua Regia (Kongevand): HNO3:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!


Comparing the two solutions

Iodine based gold etch Aqua Regia (kongevand) Dilute Aqua Regia (fortyndet kongevand)
General description

Etch of gold with or without photoresist mask.

Etch of gold (as stripper).

Etch of gold.

Link to safety APV See APV here. See APV here See APV here
Chemical solution KI:I2:H2O (100g:25g:500ml) HCl:HNO3 (3:1) HCl:HNO3:H2O (3:1:2)
Process temperature 20°C 20°C 20-30°C
Possible masking materials

Photoresist (1.5 µm AZ5214E)

Unmasked - used as a stripper

Difficult to mask. Mainly used as a stripper.

Etch rate

~100 nm/min

~(??) nm/min - fast etch

~680 nm/min at 30°C

Batch size

1-5 4" wafers at a time

1-5 4" wafers at a time

1-5 4" wafers at a time

Size of substrate Any size and number that can go inside the beaker in use Any size and number that can go inside the beaker in use Any size and number that can go inside the beaker in use
Allowed materials

No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.

No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.

No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.

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