Specific Process Knowledge/Polymer Processing/Plasma Cleaners: Difference between revisions

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 ''The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.''
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Polymer_Processing/Polymer_Processing_Plasma_Cleaners click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Polymer_Processing/Plasma_Cleaners click here]'''
 =Plasma cleaner: 2 & 3=
-[[File:Plasma cleaner.jpg|400px|right|Plasma Cleaner: 2 is located in PolyFabLab, and Plasma Cleaner: 3 is located in the PDMS lab in building 347.]]
+[[File:Plasma cleaner.jpg|400px|right|Plasma Cleaner:2 is located in PolyFabLab, and Plasma Cleaner: 3 is located in the PDMS lab in building 347.]]
-'''Tool description'''<br>
+Plasma cleaner 2 : SurfacePrep(located in PolyFaLab) and Plasma cleaner 3 : PDMS (located in PDMS lab) are Diener Atto (PC control, 13.56 MHz RF) systems installed in 2026.
+'''The Plasma Cleaner 2 : SurfacePrep''' can be used for the following processes:
+*Fine cleaning/surface activation of polymer parts prior to bonding, coating, printing
+*Photoresist stripping
+*Descumming
+*Surface cleaning
+The user manual, and contact information for plasma cleaner : 2 can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=562 LabManager] - '''requires login'''
+'''The Plasma Cleaner 3 : PDMS''' can be used for the following processes:
+*Surface activation and micro-etching of cured PDMS surface
+*PDMS to glass bonding
+For further information about PDMS to glass bonding follow the link: [[Specific_Process_Knowledge/Polymer_Processing/PDMS_Casting|PDMS Casting]]
+The user manual, and contact information for plasma cleaner : 3 can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=563 LabManager] - '''requires login'''
+<br clear="all" />
+= Plasma cleaner Comparison Table =
+{| class="wikitable"
+|-
+!
+|'''Plasma Cleaner 2 : Surfaceprep'''
+|'''Plasma Cleaner 3: PDMS'''
+|-
+! scope=row style="text-align: left;" |  Purpose
+| Cleaning/Surface activation before bonding, coating and printing
+| Surface activation and micro-etching of '''cured PDMS'''
+|-
+! scope=row style="text-align: left;" | Method
+| Low-pressure RF plasma
+| Low-pressure RF plasma
+|-
+! scope=row style="text-align: left;" | Process gasses
+|
+*O<sub>2</sub>
+*N<sub>2</sub>
+*Ar (Upon request)
+|
+*O<sub>2</sub>
+*Ar (Upon request)
+|-
+! scope=row style="text-align: left;" | Process power
+| 10-300 W (10-100%)
+| 10-300 W (10-100%)
+|-
+! scope=row style="text-align: left;" | Process pressure
+| 0.35 mbar
+| 0.35 mbar
+|-
+! scope=row style="text-align: left;" | Substrate batch
+|
+*Chips: several
+*50 mm wafer: 1
+*100 mm wafer: 1
+|
+*Chips: several
+*50 mm wafer: 1
+*100 mm wafer: 1
+|-
+! scope=row style="text-align: left;" | Substrate materials
+|
+*Polymer substrates
+*Silicon substrates
+*III-V substrates
+*Glass substrates
+*Films, or patterned films, of any material except type IV (Pb, Te)
+|
+*PDMS
+*Polymer substrates
+*Silicon substrates
+*III-V substrates
+*Glass substrates
+*Films, or patterned films, of any material except type IV (Pb, Te)
+|}