Specific Process Knowledge/Lithography: Difference between revisions
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=Lithography= | =Lithography= | ||
[[ | [[file:DUV_wafers.jpg|400px|thumb|right|Waveguides created using DUV lithography.]] | ||
__TOC__ | __TOC__ | ||
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'''Nanoimprint lithography'''<br> | '''Nanoimprint lithography'''<br> | ||
Nanoimprint lithography is a patterning technique that relies on mechanically imprinting or stamping nanoscale features onto a surface without the need for irradiation. By pressing a mold into a resist layer, it can replicate fine structures with high fidelity and at relatively low cost. This method is particularly attractive for large-area and high-throughput applications, offering a straightforward alternative to more complex lithographic processes. | Nanoimprint lithography is a patterning technique that relies on mechanically imprinting or stamping nanoscale features onto a surface without the need for irradiation. By pressing a mold into a resist layer, it can replicate fine structures with high fidelity and at relatively low cost. This method is particularly attractive for large-area and high-throughput applications, offering a straightforward alternative to more complex lithographic processes. | ||
=Comparing lithography methods at DTU Nanolab= | =Comparing lithography methods at DTU Nanolab= | ||
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Throughput is up to 60 wafers/hour | Throughput is up to 60 wafers/hour | ||
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Process dependent: | Process dependent: | ||
*Dose [µC/cm<sup>2</sup>]: <math>Q</math> | *Dose [µC/cm<sup>2</sup>]: <math>Q</math> | ||
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*Pattern area [cm<sup>2</sup>]: <math>a</math> | *Pattern area [cm<sup>2</sup>]: <math>a</math> | ||
Process time [s]: <math>t = \frac{Q \sdot a}{I}</math> | Process time [s]: <math>t = \frac{Q \sdot a}{I}</math> | ||
| Process dependent, including heating/cooling rates | | Process dependent, including heating/cooling rates | ||
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<br> | <br> | ||
'''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Automatic spin coating]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Coaters | *[[Specific_Process_Knowledge/Lithography/Coaters/GammaUV|Spin Coater: Gamma UV]] | ||
*[[Specific Process Knowledge/Lithography/ | *[[Specific Process Knowledge/Lithography/Coaters/GammaDUV|Spin Coater: Süss Stepper]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters | *[[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam|Spin Coater: Gamma e-beam & UV]] | ||
'''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Manual spin coating]]''' | ||
*[[Specific Process Knowledge/Lithography/Coaters | *[[Specific Process Knowledge/Lithography/Coaters/RCD8|Spin Coater: RCD8]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters | *[[Specific_Process_Knowledge/Lithography/Coaters/labspin|Spin Coater: Labspin 02/03]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/labspin05|Spin Coater: Labspin 05 (PFL)]] | |||
'''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]''' | '''[[Specific Process Knowledge/Lithography/Coaters|Spray coating]]''' | ||
*[[Specific_Process_Knowledge/Lithography/Coaters | *[[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater|Spray Coater]] | ||
'''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]''' | '''[[Specific Process Knowledge/Lithography/Baking|Soft & hard baking]]''' | ||
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<br> | <br> | ||
'''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]''' | '''[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure Tools]]''' | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-1|Aligner: MA6-1]] | *[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-1|Aligner: MA6-1 (PFL)]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-2|Aligner: MA6-2]] | *[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-2|Aligner: MA6-2]] | ||
*[[Specific Process Knowledge/Lithography/UVExposure/aligner_MLA1|Aligner: Maskless 01]] | *[[Specific Process Knowledge/Lithography/UVExposure/aligner_MLA1|Aligner: Maskless 01]] | ||
*[[Specific Process Knowledge/Lithography/UVExposure/aligner_MLA2|Aligner: Maskless 02]] | *[[Specific Process Knowledge/Lithography/UVExposure/aligner_MLA2|Aligner: Maskless 02]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]] | *[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]] | ||
*[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]] | *[[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04 (PFL)]] | ||
*[[Specific_Process_Knowledge/Lithography/Aligners/MAvsMLA|Mask Aligner vs Maskless Aligner]] | *[[Specific_Process_Knowledge/Lithography/Aligners/MAvsMLA|Mask Aligner vs Maskless Aligner]] | ||