Specific Process Knowledge/Lithography/EBeamLithography/High resolution patterning with HSQ: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/EBeamLithography/High_resolution_patterning_with_HSQ click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/EBeamLithography/High_resolution_patterning_with_HSQ click here]''' | ||
* ''This work was done by Bingdong Chang and Xiaoli Zhu in 2016 | * ''This work was done by Bingdong Chang and Xiaoli Zhu in 2016.'' | ||
* ''This page was edited by Bingdong Chang 23 October 2017.'' | * ''This page was edited by Bingdong Chang 23 October 2017.'' | ||
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In most cases the time from taking HSQ out of the fridge to spin coat, and between spin coat and exposure as well as the time between exposure and development impacts on the resolution achieved. | In most cases the time from taking HSQ out of the fridge to spin coat, and between spin coat and exposure as well as the time between exposure and development impacts on the resolution achieved. | ||
It is therefore not recommended to use HSQ as a trainings resist. | It is therefore not recommended to use HSQ as a trainings resist. | ||
The details of the process is shown below in the table: | The details of the process is shown below in the table: | ||
<gallery caption="Processing parameters for high resolution HSQ patterning" widths="600" heights="300" perrow="1"> | <gallery caption="Processing parameters for high resolution HSQ patterning" widths="600" heights="300" perrow="1"> | ||