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Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold click here]'''
'''All links to Labmanager Including APV and QC requires login.'''


Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.
Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec.
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10 Å to 1 µm *
|10 Å to 600 nm *
|10 Å to 200 nm  
|10 Å to 200 nm  
|10 Å to 500 nm **
|10 Å to 500 nm *
|10 Å to 500 nm **
|10 Å to 500 nm *
| very thin, few nm range
| very thin, few nm range
| very thin, few nm range
| very thin, few nm range
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|0.5-5 Å/s
|1-5 Å/s
|1 Å/s (can be adjusted to around 5 Å/s)
|1 Å/s (can be adjusted to around 5 Å/s)
|Depends on process parameters, 1-10 Å/s  
|Depends on process parameters, 1-10 Å/s  
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Heating
|to 250 C (in 10-pocket evaporator)
|no
|no
|to 600 C
|no
|no
|-style="background:WhiteSmoke; color:black"
!Allowed materials
!Allowed materials


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* All samples allowed in the SEM Supra 2 or 3
* All samples allowed in the SEM Supra 2 or 3


|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
! Comment
! Comment
|
|
* For thicknesses above 600 nm permission is required
* Pumpdown approx 20 min.
* Pumpdown approx 20 min.
|
|
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'''*'''  ''For thicknesses above 600 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.''
'''*'''  ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk as extra deposition costs a higher fee.''
 
'''**'''  ''For thicknesses above 200 nm write to metal@nanolab.dtu.dk to ensure that there will be enough material in the machine.''


== Resistive thermal evaporation of Au ==
== Resistive thermal evaporation of Au ==
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