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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Prakus (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
156 edits
No edit summary
 
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'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
<div style="border:1px solid #cccccc; padding:10px; background:#f9f9f9;">


[[/new page name| TPT HB 100 wire bonder: process details]]
'''Related Page:'''


[[/TPT HB 100 wire bonder: process details| TPT HB 100 wire bonder: process details]]
</div>
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
[https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]


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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested)
* Au ribbon (100x20µm) bonding<br />
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Au 25µm wire bonding
*Au 25µm wire bonding
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Wire_Bonder"