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= TPT wire bonder – Technical Feedback & Discussion =


== 1. Introduction ==
This page is intended for structured technical feedback related to DTU Nanolab
process documentation, tool pages, and characterization guidelines.
Discussions here should remain professional, concise, and data-driven.
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== 2. Purpose ==
This page supports:
* Technical corrections 
* Process clarifications 
* Documentation improvements 
* Parameter optimization suggestions 
* Data validation discussions 
It is not intended for general chat or unrelated topics.
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== 3. How to Ask Questions / Submit Comments ==
To post a message:
1. Click '''Add topic''' (top of the page)
2. Use a short and descriptive title
3. Clearly describe your observation or suggestion
4. Reference the specific page or section
5. Sign your message using: <code>[[User:Prakus|prakus]] ([[User talk:Prakus|talk]]) 14:01, 19 February 2026 (CET)</code>
When possible, include supporting data or technical reasoning.
All discussions will be reviewed and responded to in a structured manner.
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== 4. Contact Information ==
For urgent tool-related matters:
'''Email:''' your.email@dtu.dk 
'''DTU Phone:''' +45 255702 
For documentation feedback, please use this page to ensure transparency and traceability.

Latest revision as of 14:08, 19 February 2026