Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3: Difference between revisions
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<!--Checked for updates on 2/10-2020 - ok/jmli --> | <!--Checked for updates on 2/10-2020 - ok/jmli --> | ||
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==Pegasus 3 - 150mm silicon etching== | ==Pegasus 3 - 150mm silicon etching== | ||
{{Contentbydryetch}} | |||
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring. ]] | [[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring.{{photo1}} ]] | ||
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<!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] --> | <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] --> | ||
*[[/SiO2 etch|Etch of very thin layers of SiO2]] | |||
=== Wafer bonding === | === Wafer bonding === | ||