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<!--Checked for updates on 2/10-2020 - ok/jmli -->
<!--Checked for updates on 2/10-2020 - ok/jmli -->
<!--Checked for updates on 5/2-2026 - ok/jmli -->


==Pegasus 3 - 150mm silicon etching==
==Pegasus 3 - 150mm silicon etching==
 
{{Contentbydryetch}}
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring. ]]
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring.{{photo1}} ]]




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'''Standard recipes'''
'''Standard recipes'''
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM | The DREM recipes compared ]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM | The DREM recipes 0.5 kW and 0.2 kW ]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM0.2kW | DREM 0.2 kW ]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM0.5kWv2.3 |DREM 0.5kW v2.3]]




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  <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->
  <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->
*[[/SiO2 etch|Etch of very thin layers of SiO2]]


=== Wafer bonding ===
=== Wafer bonding ===
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