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= Resist coating =
= Resist coating =
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.
<p style="color:red;">Contrary to most UV resist it is in general not advisable to use HMDS priming when coating with EBL resists. There can of course be exceptions to this but we do not recommend HMDS priming when using the DTU Nanolab supplied EBL resists.</p>


We recommend all groups or users to have their own bottle of e-beam resist inside the cleanroom. Please follow the [[Specific Process Knowledge/Lithography/EBeamLithography/ResistBottles|user resist bottles in the cleanroom guide.]]
We recommend all groups or users to have their own bottle of e-beam resist inside the cleanroom. Please follow the [[Specific Process Knowledge/Lithography/EBeamLithography/ResistBottles|user resist bottles in the cleanroom guide.]]
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==User supplied resists==
==User supplied resists==
It is possible to obtain permission to user other resists at DTU Nanolab, users must however provide these resists and possibly developers themselves. A non-exhaustive list of user supplied EBL resist used at DTU Nanolab and some process guidelines can be found in the table below.
It is possible to obtain permission to user other resists at DTU Nanolab, users must however provide these resists and possibly developers themselves. A non-exhaustive list of user supplied EBL resist used at DTU Nanolab and some process guidelines can be found in the table below.
 
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
|'''[[Specific_Process_Knowledge/Lithography/ARP617|Copolymer AR-P 617]]'''
|'''[[Specific Process Knowledge/Lithography/EBeamLithography/AR-P 617|Copolymer AR-P 617]]'''
|Positive
|Positive
|[http://www.allresist.com AllResist]
|[http://www.allresist.com AllResist]
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
|'''[[Specific_Process_Knowledge/Lithography/mrEBL6000|mr EBL 6000.1]]'''
|'''mr EBL 6000.1'''
|Negative
|Negative
|[http://http://www.microresist.de/home_en.htm MicroResist]
|[http://http://www.microresist.de/home_en.htm MicroResist]
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|[[media:Process Flow HSQ.docx|process flow HSQ]]
|[[media:Process Flow HSQ.docx|process flow HSQ]]
[[Specific_Process_Knowledge/Lithography/EBeamLithography/High_resolution_patterning_with_HSQ|High resolution patterning with HSQ]]
 


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