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In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.  
In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.  


== Process information ==
'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]


===Dicing layout===
==Comparison of Disco DAD 321 and DAD 3241 Dicing tools==
The dicer is only capable of cutting straight, uninterrupted lines across the entire substrate. Therefore each the position of each individual die must be carefully considered to maximize yield.
Please see the below illustrations for a good and a bad design.
 
{| cellpadding="2" style="border: 2px solid darkgray;"
! width="300" |
! width="300" |
! width="300" |
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|- border="1" align="center"
|[[Image:Good design 2.jpg|300x300px|Good design]] || [[Image:Good design 3.jpg|300x300px|Good design]] || [[Image:Bad design 1b.jpg|300x300px|BAD design]]
|
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|-
| || drawings by Jesper Hanberg, DTU Nanolab ||
|}
 
The simplest design consists of identically sized chips placed at constant pitch across an entire wafer. While it is possible to cut at varying pitches, it requires a more complex program and leaves more room for user errors.
 
===Overview of the performance Disco DAD 321 and DAD 3241 Dicer===


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
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|}
|}


{|
|-
|[[Image:IMG 20230228 113101.jpg|thumb|Wafer mounting table for DAD 321]]
|rowspan="2"|[[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]]
|rowspan="2"|[[Image:IMG 20230228 113045.jpg|thumb|Wafer cleaning station DCS 1441]]
|-
|[[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release for DAD 3241]]
|
|}
== Process information ==
'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]
===Dicing layout===
The dicer is only capable of cutting straight, uninterrupted lines across the entire substrate. Therefore each the position of each individual die must be carefully considered to maximize yield.
Please see the below illustrations for a good and a bad design.
{| cellpadding="2" style="border: 2px solid darkgray;"
! width="300" |
! width="300" |
! width="300" |
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|- border="1" align="center"
|[[Image:Good design 2.jpg|300x300px|Good design]] || [[Image:Good design 3.jpg|300x300px|Good design]] || [[Image:Bad design 1b.jpg|300x300px|BAD design]]
|
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|-
| || drawings by Jesper Hanberg, DTU Nanolab ||
|}
The simplest design consists of identically sized chips placed at constant pitch across an entire wafer. While it is possible to cut at varying pitches, it requires a more complex program and leaves more room for user errors.
It is not possible to interrupt a cut and continuing further down a line, in order to cut out a large chip surrounded by smaller chips, several mounting-dicing-remounting operations must be done.




=== Recommended dicing parameters ===
WIP
DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.


For other materials/blades consult tool responsible.


{|
{| border="2" cellspacing="1" cellpadding="4"
| [[Image:IMG 20230228 113101.jpg|thumb|left|Wafer mounting table for DAD 321]]|| [[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release]]|| [[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]]
! style="background:silver; color:black!| Material
! style="background:silver; color:black!| Tool
! style="background:silver; color:black!| Blade
! style="background:silver; color:black!| Feed speed
! style="background:silver; color:black!| Blade RPM
! style="background:silver; color:black!| Max removal per cut*
|-
|Si ||DAD3241 ||ZH05 ||10-40 mm/s ||30'000 ||1mm
|-
|Pyrex||DAD321 ||B1A862 ||1.5 mm/s ||15'000 ||0.5mm
|-
|Fused Silica||DAD321 ||B1A862 ||1.0 mm/s ||15'000 ||0.3mm
|-
|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm
|}
|}
(*) Multiple cuts at the same location can be done if deeper cuts are needed
=== Available blades ===
WIP
Table, max sample thickness, expected cut line width, images of cut


<br clear="all" />


===Comparing dicing parameters for different materials '''DAD 321'''===
===Comparing dicing parameters for different materials '''DAD 321'''===
[[Image:IMG 20230228 113045.jpg|300px|thumb|Wafer cleaning station DCS 1441]]


Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw"