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==Disco Automatic dicing saw, model DAD321==
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''


[[Image:Disco_DAD_321_Dicer.jpg|300x300px|thumb|Dicer positioned on 1. floor bldg 346 room|right]]
=Disco Automatic dicing saw, model DAD321 and DAD3241=
DTU nanolab have 2 saws available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.  


The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.


The dicer feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.
[[File:IMG_20230228_112922.jpg|thumb||Dicers positioned on 1. floor bldg 346 room 157]]


The dicer at DANCHIP is placed in room ?? on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicingproces is very dirty. Think about how to clean your samples if you want to bring them back in the cleanroom.
In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.  




 
==Comparison of Disco DAD 321 and DAD 3241 Dicing tools==
<br clear="all" />
===A rough overview of the performance Disco DAD321 Dicer===


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left" rowspan="2"|Machine
|style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Name
*Pure Silicon samples
|style="background:WhiteSmoke; color:black"|
DAD 321 (old)
|style="background:WhiteSmoke; color:black"|
DAD 3241 (new 2021)
|-
|style="background:LightGrey; color:black"|Operation
|style="background:WhiteSmoke; color:black"|
*Keyboard
*F-key menu driven
*BW screen
|style="background:WhiteSmoke; color:black"|
*Touch screen
*Guided menu
*Color screen
|-
!style="background:silver; color:black;" align="left" rowspan="3"|Purpose  
|style="background:LightGrey; color:black"|Main usage
|style="background:WhiteSmoke; color:black"|
*Borofloat
*Fused Silica
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
|-
|style="background:LightGrey; color:black" rowspan="2"|Substrate type
|style="background:WhiteSmoke; color:black"|
 
*'''Pyrex/Borofloat'''
*'''Silicon bonded to Silicon'''
*'''Silicon bonded to Pyrex/Borofloat'''
*Silicon
|style="background:WhiteSmoke; color:black"|
*'''Silicon'''
*Pyrex/Borofloat
*Silicon bonded to Silicon
*Silicon bonded to Silicon
*Silicon bonded to Pyrex/Borofloat
*Silicon bonded to Pyrex/Borofloat
*Pyrex/Borofloat
|-
|style="background:WhiteSmoke; color:black" colspan="2"|
For other materials, contact tool responsible
(See Labmanager)
|-
|-
!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
|style="background:LightGrey; color:black"|X-axis cutting range||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|X-axis cutting range
|style="background:WhiteSmoke; color:black"|
192 mm
192 mm
|style="background:WhiteSmoke; color:black"|
210 mm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|.
|style="background:LightGrey; color:black"|X-axis cut speed
|style="background:WhiteSmoke; color:black"|
0.1 - 300 mm/sec
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
50 Å to 262 µm
0.1 - 800 mm/sec
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution xy
|style="background:LightGrey; color:black"|Y-axis cutting range
|style="background:WhiteSmoke; color:black"|
162 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
down to 0.067 µm
210 mm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution z
|style="background:LightGrey; color:black"|Y-axis index step
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1Å, 10Å or 20Å
0.0002 mm
|style="background:WhiteSmoke; color:black"|
0.0001 mm
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W
|style="background:LightGrey; color:black"|Y-axis single error
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1.2(W[µm]-5µm)
0.003 or less
|style="background:WhiteSmoke; color:black"|
0.002 or less
|-
|-
|-
|-
!style="background:silver; color:black" align="left"|Hardware settings
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Tip radius
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
up to 6"
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*5 µm 45<sup>o</sup> cone
up to 8"
|-
|-
!style="background:silver; color:black" align="left"|Substrates
| style="background:LightGrey; color:black"|Layers that can't be diced
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*Thick metal (>0.75 mm)
*III-V samples
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*up to 6"
*Thick metal (>0.75 mm)
*III-V samples
|-
|-
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Accessories
| style="background:LightGrey; color:black"|Accessories for wafer handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In principle all materials
*Manual wafer mounter for blue tape
|style="background:WhiteSmoke; color:black"|
*Manual wafer mounter for tape with backside foil (Powatec P200)
*Automatic Wafer cleaning station (Disco DCS 1441)
*UV curing station (Powatec U200)
|-  
|-  
|}
|}




{|
|-
|[[Image:IMG 20230228 113101.jpg|thumb|Wafer mounting table for DAD 321]]
|rowspan="2"|[[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]]
|rowspan="2"|[[Image:IMG 20230228 113045.jpg|thumb|Wafer cleaning station DCS 1441]]
|-
|[[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release for DAD 3241]]
|
|}


<br clear="all" />


==Comparing dicing parameters for different materials==
== Process information ==


{| border="2" cellspacing="0" cellpadding="4" align="center"
'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager]
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager]
 
===Dicing layout===
The dicer is only capable of cutting straight, uninterrupted lines across the entire substrate. Therefore each the position of each individual die must be carefully considered to maximize yield.
Please see the below illustrations for a good and a bad design.
 
{| cellpadding="2" style="border: 2px solid darkgray;"
! width="300" |
! width="300" |
! width="300" |
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|- border="1" align="center"
|[[Image:Good design 2.jpg|300x300px|Good design]] || [[Image:Good design 3.jpg|300x300px|Good design]] || [[Image:Bad design 1b.jpg|300x300px|BAD design]]
|
|- align="center"
| '''GOOD design - simple''' ||  '''GOOD design - complex''' || <span style="color:red">'''BAD design'''</span>
|-
| || drawings by Jesper Hanberg, DTU Nanolab ||
|}
 
The simplest design consists of identically sized chips placed at constant pitch across an entire wafer. While it is possible to cut at varying pitches, it requires a more complex program and leaves more room for user errors.
 
It is not possible to interrupt a cut and continuing further down a line, in order to cut out a large chip surrounded by smaller chips, several mounting-dicing-remounting operations must be done.
 
 
=== Recommended dicing parameters ===
WIP
DTU Nanolab offers 2 different blades for different use cases. See recommended parameters below.
 
For other materials/blades consult tool responsible.
 
{| border="2" cellspacing="1" cellpadding="4"
! style="background:silver; color:black!| Material
! style="background:silver; color:black!| Tool
! style="background:silver; color:black!| Blade
! style="background:silver; color:black!| Feed speed
! style="background:silver; color:black!| Blade RPM
! style="background:silver; color:black!| Max removal per cut*
|-
|Si ||DAD3241 ||ZH05 ||10-40 mm/s ||30'000 ||1mm
|-
|Pyrex||DAD321 ||B1A862 ||1.5 mm/s ||15'000 ||0.5mm
|-
|Fused Silica||DAD321 ||B1A862 ||1.0 mm/s ||15'000 ||0.3mm
|-
|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm
|}
(*) Multiple cuts at the same location can be done if deeper cuts are needed
 
=== Available blades ===
 
WIP
 
Table, max sample thickness, expected cut line width, images of cut
 
 
===Comparing dicing parameters for different materials '''DAD 321'''===
 
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
 
{| border="2" cellspacing="0" cellpadding="4"  
!
!
!Silicon
!Silicon
Line 73: Line 202:
|HUB Blade ZH05 (27HEEF)
|HUB Blade ZH05 (27HEEF)
|HUBless Blade B1A862
|HUBless Blade B1A862
|-valign="top"
|'''Blade width'''
|50 µm
|150 µm
|-valign="top"
|-valign="top"
|'''Cutlinewidth'''
|'''Cutlinewidth'''
|60 µm
|60 µm
|150 µm
|180 - 200 µm
|-valign="top"
|-valign="top"
|'''Recommended feed speed'''
|'''Recommended feed speed'''
|Up to 5 mm/sec
|Up to 20 mm/sec
|Up to 2 mm/sec
|Up to 2 mm/sec (0.5 mm/sec)
|-valign="top"
|-valign="top"
|'''Recommended dice depth'''
|'''Recommended dice depth'''
|Leave 200 µm uncut. It's possible to cut through the sample.
|Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample.
|Leave 200 µm uncut. It's possible to cut through the sample.
|Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). <br>
If you have thicker wafers then use several passes decreasing the blade height for each pass.<br>
For 500 µm thick wafers set blade height to 200µm (preferred).<br>
This leaves 125µm uncut since blue tape is 75µm.<br>
It is possible to cut through the sample.
|-valign="top"
|-valign="top"
|'''Max. sample thichness'''
|'''Max. sample thickness'''
|not any limits
|1.5 mm
|not any limits
|2.0 mm
|-
|}
 
===Comparing dicing parameters for different materials '''DAD 3241'''===
 
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
 
{| border="2" cellspacing="0" cellpadding="4"
!
!Silicon
!Other materials
|- valign="top"
|'''Bladetype'''
|HUB Blade
|Ask! (HUBless)
|-valign="top"
|'''Blade width'''
|50 µm
|ask
|-valign="top"
|'''Cutlinewidth'''
|50 µm
|ask
|-valign="top"
|-valign="top"
|'''Index accuracy'''
|'''Recommended feed speed'''
|not known
|Up to 40 mm/sec
|not known
|ask
|- valign="top"
|-valign="top"
|'''Wavelength range'''
|'''Recommended dice depth'''
|400-1000 nm
|We usually cut all way through the wafer with a blade height of 50µm (preferred).<br>
|300-950 nm
|ask!
|-valign="top"
|-valign="top"
|'''What kind of thin films can be measured'''
|'''Max. sample thickness'''
|Any film that is transparent to the light in the given wavelength range
|1.5 mm
ex:
|2.0 mm
*Silicon Oxide
*Silicon nitride
*PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|Any film that is transparent to the light in the given wavelength range
ex:
*Silicon Oxide
*Silicon nitride
*Very thin layers of PolySilicon
*Photoresists
*SU8
*Other polymers
*Very thin layers of metals (<20 nm)
*and many more
|-  
|-  
|}
|}


<!--
This is not a typical dice line!
===Images of diced samples===
[[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]]
-->
== Available blades ==
THIS CHAPTER IS WORK IN PROGRESS


[[Image:Dicetest_001.jpg|300x300px|thumb|test|left]]
DISCO provides a wide selection of dicing blades optimized for different materials. There catalogue can be accessed online [https://www.disco.co.jp/eg/products/tool.html?id=hub&hubless here]
DTU Nanolab provides 2 different blades for 2 main use-cases
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw"