Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions

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 == Hardware and option comparison of the dry etchers ==
+{{Template:Contentbydryetch}}
+<!--Checked for updates on 3/2-2023 - ok/jmli -->
 The table below compares the hardware and the options.
 {| border="2" cellspacing="0" cellpadding="0" align="left"
@@ Line 12: / Line 16: @@
 ! style="background:silver; color:black" colspan="4" align="center"| [[Specific Process Knowledge/Etch/DRIE-Pegasus| DRIE-Pegasi]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/ICP_Metal_Etcher| ICP Metal etch ]]
-! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/III-V RIE |III-V RIE ]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/III-V ICP|III-V ICP]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]]
 |- valign="top"
-! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|Pegasus 1]]
+! style="background:silver; color:black"  align="center"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|Pegasus 1]]
-! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2|Pegasus 2]]
+! style="background:silver; color:black"  align="center"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2|Pegasus 2]]
-! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|Pegasus 3]]
+! style="background:silver; color:black" align="center"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|Pegasus 3]]
-! style="background:silver; color:black"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4|Pegasus 4]]
+! style="background:silver; color:black" align="center"| [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4|Pegasus 4]]
 |- valign="top"
 ! rowspan="2" style="background:silver; color:black" |Purpose
@@ Line 26: / Line 29: @@
 | style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides on 4" wafers
 | style="background:WhiteSmoke; color:black"| Silicon etching of 4" wafers
-| style="background:WhiteSmoke; color:black"| Research tool into silicon etching
+| style="background:WhiteSmoke; color:black"| Research tool into silicon etching - only a few special recipes!
 | style="background:WhiteSmoke; color:black"| Silicon etching of 6" wafers on 6" wafers
-| style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides
+| style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides on 6" wafers
-| style="background:WhiteSmoke; color:black"| Standard recipes for etching of Al, Cr and Ti, now also etches of W, TiW and Mo
+| style="background:WhiteSmoke; color:black"| Standard recipes for etching of Al, Cr and Ti, now also etches of W, TiW and Mo. Please do not use this machine with F-chemistry unless the Dry Etch group has allowed it!
-| style="background:WhiteSmoke; color:black"| Etching of silicon oxide, resist, BCB, silicon nitride, InP, InGaAs and GaAs on III-V substrates
+| style="background:WhiteSmoke; color:black"| Etching of III-V materials such as GaN, InP/InGaAsP/InGaAs, AlGaAs, GaAs.
-| style="background:WhiteSmoke; color:black"| Etching of III-V materials such as GaN, InP/InGaAsP/InGaAs, AlGaAs, GaAs
+Etching of SiO2 and SiN on III-V materials
 | style="background:WhiteSmoke; color:black"| Physical Etching of all materials
 |- valign="top"
@@ Line 37: / Line 40: @@
 | style="background:lightgrey; color:black" | Backup silicon etcher
 | style="background:lightgrey; color:black" |
-| style="background:lightgrey; color:black" | Barc etch
+| style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" colspan="2"|
 | style="background:lightgrey; color:black" | Silicon etcher
-| style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
@@ Line 51: / Line 53: @@
 | style="background:WhiteSmoke; color:black" colspan="4" | Inductively coupled plasma chamber with two RF generators; the coil (with outer and inner coil) and platen generator
 | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator
-| style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes
 | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator
 | style="background:WhiteSmoke; color:black" | Ion beam etcher - sputter etches with argon ions
@@ Line 61: / Line 62: @@
 | style="background:lightgrey; color:black" colspan="4" | The electrode is oil cooled. Also, Helium backside cooling: -20<sup>o</sup>C to 30<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C
-| style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled with a special chiller. Also, Helium backside cooling: 20<sup>o</sup>C to 180<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled with a special chiller. Also, Helium backside cooling: 5<sup>o</sup>C to 60?<sup>o</sup>C
@@ Line 72: / Line 72: @@
 | style="background:WhiteSmoke; color:black" colspan="3" | Electrostatic clamping (TDESC)<br> Wafer size 6"
 | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 6"
-| style="background:WhiteSmoke; color:black" | No clamping<br> Sample size up to 4"
 | style="background:WhiteSmoke; color:black" | Mechanical clamping (weighted clamp with ceramic fingers)<br> Wafer size 4"
 | style="background:WhiteSmoke; color:black" | Mechanical clamping <br> Wafer sizes 2"/4"/6"/8"
@@ Line 99: / Line 98: @@
 | He
 |}
-|style="background:lightgrey; color:black" colspan="3" |
+|style="background:lightgrey; color:black" |
+{|
+| SF<sub>6</sub>
+| O<sub>2</sub>
+| C<sub>4</sub>F<sub>8</sub>
+|-
+| Ar
+|}
+|style="background:lightgrey; color:black" |
+{|
+| SF<sub>6</sub>
+| O<sub>2</sub>
+| N<sub>2</sub>
+|-
+| Ar
+| He
+|}
+|style="background:lightgrey; color:black" |
 {|
 | SF<sub>6</sub>
@@ Line 132: / Line 148: @@
 | HBr
-|}
-| style="background:lightgrey; color:black" |
-{|
-| O<sub>2</sub>
-| CHF<sub>3</sub>
-| CH<sub>4</sub>
-|-
-| Ar
-| H<sub>2</sub>
 |}
 | style="background:lightgrey; color:black" |
@@ Line 172: / Line 179: @@
 * Coil generator
 * Platen generator
-|  style="background:WhiteSmoke; color:black" colspan="4"|
+|  style="background:WhiteSmoke; color:black"|
+* Coil generator
+* Platen generator
+* Low frequency platen generator
+|  style="background:WhiteSmoke; color:black"|
+* Platen generator
+* Low frequency platen generator
+|  style="background:WhiteSmoke; color:black" colspan="2"|
 * Coil generator
 * Platen generator
@@ Line 179: / Line 193: @@
 * Coil generator
 * Platen generator
-|  style="background:WhiteSmoke; color:black" |
-* RF generator
 |  style="background:WhiteSmoke; color:black" |
 * Coil generator
@@ Line 196: / Line 208: @@
 | style="background:lightgrey; color:black" colspan="2"| Loading via two cassette loading stations pumped down at vacuum
 | style="background:lightgrey; color:black" | Loading via dedicated two-slot carousel load lock
-| style="background:lightgrey; color:black" | Manual loading directly into process chamber
 | style="background:lightgrey; color:black" | Loading via dedicated two-slot carousel load lock
 | style="background:lightgrey; color:black" | Automatic loading via load lock
@@ Line 227: / Line 238: @@
 * Parameter ramping
 * Optical endpoint detection
-|  style="background:WhiteSmoke; color:black" |
-* Laser endpoint detection
 |  style="background:WhiteSmoke; color:black" |
 * Parameter ramping
@@ Line 237: / Line 246: @@
 * SIMS endpoint detection
 |-valign="top"
-! style="background:silver; color:black"| Allowed materials
-| style="background:lightgrey; color:black" |
+! style="background:silver; color:black" rowspan="2"| Allowed materials
+! style="background:lightgrey; color:black" | Materials
 | style="background:lightgrey; color:black" |
 * Silicon, Silicon oxide, silicon nitride
@@ Line 267: / Line 277: @@
 * Al, Cr, Ti, W, Mo, Nb
 * Resists
-| style="background:lightgrey; color:black" |
-* Silicon, Silicon oxide, silicon nitride
-* Fused silica
-* Sapphire
-* SiC
-* GaAs, GaN, InP, with epitaxial layers
-* Resists (at low temperature processing)
 | style="background:lightgrey; color:black" |
 * Silicon, Silicon oxide, silicon nitride
@@ Line 283: / Line 286: @@
 * Resists (at low temperature processing)
 |style="background:lightgrey; color:black" |
-* Almost any material, see LabManager
+* Almost any material
+|-
+! style="background:WhiteSmoke; color:black" | Cross contamination sheet
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=105 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=115 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=265 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=398 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=455 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=456 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=266 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=268 Link]
+| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=267 Link]
 |-
 |}