Specific Process Knowledge/Etch: Difference between revisions
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{{ | {{cc-nanolab}} | ||
{{Feedback link|Page_name=Specific_Process_Knowledge/Etch}} <br> | |||
=Wet etch or dry etch= | =Wet etch or dry etch= | ||
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== Choose material to be etched == | == Choose material to be etched == | ||
[ | [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=2&name=180612_III-V_exoticall_MH.xlsx Dry etching of III-V materials and exotic materials in some other European Cleanroom facility login required] | ||
{| {{table}} | {| {{table}} | ||
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*[[/Aluminum Oxide|Aluminum Oxide]] | *[[/Aluminum Oxide|Aluminum Oxide]] | ||
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | ||
*[[/Lithium niobate |Lithium niobate]] | |||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
*[[/Etching of Silicon|Silicon]] | *[[/Etching of Silicon|Silicon]] | ||
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*[[/Etching of Gold|Gold]] | *[[/Etching of Gold|Gold]] | ||
*[[/Etching of Platinum|Platinum]] | *[[/Etching of Platinum|Platinum]] | ||
*[[/Etching of Molybdenum|Molybdenum]] | |||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
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*[[/ICP Metal Etcher|ICP Metal Etch]] | *[[/ICP Metal Etcher|ICP Metal Etch]] | ||
*[[/III-V ICP|III-V ICP]] | *[[/III-V ICP|III-V ICP]] | ||
*[[/III-V RIE|III-V RIE - Plassys]] | *[[/III-V RIE|III-V RIE - Plassys (Has been decommissioned!)]] | ||
*[[/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||