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== Choose material to be etched ==
== Choose material to be etched ==
[[:File:Copy of 180612_ III-V_exoticall_MH (2).xlsx | Dry etching of III-V materials and exotic materials in some other European Cleanroom facility]]
[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=2&name=180612_III-V_exoticall_MH.xlsx Dry etching of III-V materials and exotic materials in some other European Cleanroom facility login required]  


{| {{table}}
{| {{table}}
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*[[/Aluminum Oxide|Aluminum Oxide]]
*[[/Aluminum Oxide|Aluminum Oxide]]
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)''
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)''
*[[/Lithium niobate |Lithium niobate]]
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
*[[/Etching of Silicon|Silicon]]
*[[/Etching of Silicon|Silicon]]
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*[[/Etching of Gold|Gold]]  
*[[/Etching of Gold|Gold]]  
*[[/Etching of Platinum|Platinum]]
*[[/Etching of Platinum|Platinum]]
*[[/Etching of Molybdenum|Molybdenum]]
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe''
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe''
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
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*[[/ICP Metal Etcher|ICP Metal Etch]]
*[[/ICP Metal Etcher|ICP Metal Etch]]
*[[/III-V ICP|III-V ICP]]
*[[/III-V ICP|III-V ICP]]
*[[/III-V RIE|III-V RIE - Plassys]]
*[[/III-V RIE|III-V RIE - Plassys (Has been decommissioned!)]]
*[[/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]]
*[[/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]]
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
*[[/Overview of chemicals|Overview of Chemicals]]
*[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]]
*[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]]
*[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]]
*[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]]