Specific Process Knowledge/Etch: Difference between revisions
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{{Feedback link|Page_name=Specific_Process_Knowledge/Etch}} <br> | |||
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''' Dry etch Tool Package Training ''' | ''' Dry etch Tool Package Training ''' | ||
*[[LabAdviser/Courses | *[[LabAdviser/Courses/TPT_Dry_Etch|Dry etch TPT info]] | ||
== Choose material to be etched == | == Choose material to be etched == | ||
[ | [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=2&name=180612_III-V_exoticall_MH.xlsx Dry etching of III-V materials and exotic materials in some other European Cleanroom facility login required] | ||
{| {{table}} | {| {{table}} | ||
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*[[/Aluminum Oxide|Aluminum Oxide]] | *[[/Aluminum Oxide|Aluminum Oxide]] | ||
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | ||
*[[/Lithium niobate |Lithium niobate]] | |||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
*[[/Etching of Silicon|Silicon]] | *[[/Etching of Silicon|Silicon]] | ||
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*[[/Etching of Gold|Gold]] | *[[/Etching of Gold|Gold]] | ||
*[[/Etching of Platinum|Platinum]] | *[[/Etching of Platinum|Platinum]] | ||
*[[/Etching of Molybdenum|Molybdenum]] | |||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack]] - ''containing Ta/MnIr/NiFe'' | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
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*[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
*[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
*[[/DRIE-Pegasus| DRIE-Pegasus 1 | *[[/DRIE-Pegasus| DRIE-Pegasus systems:]] | ||
**[[/DRIE-Pegasus/Pegasus-1| DRIE-Pegasus 1 (Si etching on 4" wafers)]] | |||
**[[/DRIE-Pegasus/Pegasus-2| DRIE-Pegasus 2 (Dedicated for research applications)]] | |||
**[[/DRIE-Pegasus/Pegasus-3| DRIE-Pegasus 3 (Si etching on 150 mm wafers)]] | |||
**[[/DRIE-Pegasus/Pegasus-4| DRIE-Pegasus 4 (Etching of silicon based dielectrics on 150 mm wafers)]] | |||
*[[/ICP Metal Etcher|ICP Metal Etch]] | *[[/ICP Metal Etcher|ICP Metal Etch]] | ||
*[[/III-V ICP|III-V ICP]] | *[[/III-V ICP|III-V ICP]] | ||
*[[/III-V RIE|III-V RIE - Plassys]] | *[[/III-V RIE|III-V RIE - Plassys (Has been decommissioned!)]] | ||
*[[/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
*[[/Overview of chemicals|Overview of Chemicals]] | |||
*[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]] | *[[/Wet Silicon Nitride Etch|Wet Silicon Nitride Etch]] | ||
*[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]] | *[[/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide Etch (BHF)]] | ||