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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,867 edits
No edit summary
 
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=Developer: E-beam 02=
=Developer: E-beam 02=
[[Image:IMG 2464.JPG|400px|right|thumb|Developer: E-beam 02 is located in E-4.]]
[[File:Developer ebeam v1.jpg|400px|right|thumb|Developer: E-beam 02 is located in E-4.]]


Developer: E-beam 02 is a manually operated, single substrate puddle developer. It uses the ZED-N50 or AR 600-50 developers and IPA for rinsing. The substrates are loaded manually one by one into the developer. Developer dispense, puddle time, IPA rinse, and drying is then performed automatically by the equipment.
'''Tool description'''<br>
The Developer: E-beam 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm, 150 mm and 200 mm substrates. The development is done using ZED-N50 or AR 600-50 developers and IPA for rinsing.  


'''[https://www.youtube.com/watch?v=btinNzYnLnY Training video]''' (for Developer: TMAH Manual, but it is the same model)
Single substrates are loaded manually into the tool, but the developer dispense, puddle time, agitation, rinse and drying is controlled by the tool.


The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager] - '''requires login'''
{| class="wikitable"
! style="text-align:left" | Product:
| style="padding-left: 10px" | Laurell EDC-650Hz-8NPPB-IND
|-
! style="text-align:left" | Year of purchase:   
| style="padding-left: 10px" | 2024
|-
! style="text-align:left" | Location:
| style="padding-left: 10px" | Cleanroom E-4
|}
 
'''User manual'''<br>
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=527 LabManager] - '''requires login'''
 
'''Tool training'''<br>
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training.<br>
The tool training video is part of the online tool training, but can also be viewed [https://www.youtube.com/watch?v=btinNzYnLnY here] (the video is for Developer: TMAH Manual 02, but the two tools are almost identical).
<br clear="all" />
 
=Equipment performance and process related parameters=
{| class="wikitable"
|-
! scope=row style="text-align: left;" | Tool purpose
|
Development of:
*AR-P 6200.xx (CSAR)
*ZEP 520
*Other E-beam resists
|-
! scope=row style="text-align: left;" | Developer
|
*AR 600-50
*ZED N-50
|-
! scope=row style="text-align: left;" | Development method
| Puddle
|-
! scope=row style="text-align: left;" | Handling method
|
*Non-vacuum chuck for 200 mm wafers
*Non-vacuum chuck for 100 mm & 150 mm wafers
*Non-vacuum chuck for 50 mm wafers
*Non-vacuum chuck for chips
|-
! scope=row style="text-align: left;" | Process temperature
| Room temperature
|-
! scope=row style="text-align: left;" | Process agitaion
| 4 cycles per minute
|-
! scope=row style="text-align: left;" | Process rinse
| IPA
|-
! scope=row style="text-align: left;" | Substrate sizes
|
*Chips
*50 mm wafers
*100 mm wafers
*150 mm wafers
*200 mm wafers
|-
! scope=row style="text-align: left;" | Substrate materials
|
*All cleanroom allowed materials
*Film, or pattern, of all materials except Type IV
|-
! scope=row style="text-align: left;" | Substrate batch size
| 1
|}
<br clear="all" />


=Process information=
=Process information=
Line 12: Line 82:
#Pressurize the developer canister
#Pressurize the developer canister
#Dispense puddle while rotating substrate slowly
#Dispense puddle while rotating substrate slowly
#Puddle development while not rotating
#Puddle development with/without agitation of substrate
#Agitate substrate once per 15 seconds by rotating slowly for 1 second
#Spin off developer
#Spin off developer
#Clean substrate with IPA
#Clean substrate with IPA
#Dry substrate and chamber with nitrogen
#Dry substrate and chamber with nitrogen


Multi-puddle recipes repeat steps 2-5 for the given number of puddles.


'''Multi puddle'''<br>
Multi puddle recipes repeat steps 2-4 for the given number of puddles.
==Process recipes==
(Updated 2026-01-14, JEHEM)


'''Process recipes'''<br>
N50 recipes have the letter "N" in them. AR-600-50 recipes have the letter "A"  in them. The number is the development time in seconds:
N50 recipes have the letter "N" in them. AR-600-50 recipes have the letter "A"  in them. The number is the development time in seconds:
*01 Rinse
*01 Rinse
Line 44: Line 116:
*20 A 2x60
*20 A 2x60
*21 A 5x60
*21 A 5x60
*30 N 3x60s
*NILT AR
*NILT MOE
*NILT p30
*NILT p31
*NILT p32


=Equipment performance and process related parameters=
==Agitation==
 
4 cycles per minute, 30 rpm, 30 rpm/s.
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
 
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of:
*CSAR
*ZEP520A
 
|-
!style="background:silver; color:black;" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*AR 600-50
*ZED N-50
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
|style="background:LightGrey; color:black"|Development
|style="background:WhiteSmoke; color:black"|
Puddle
|-
|style="background:LightGrey; color:black"|Handling
|style="background:WhiteSmoke; color:black"|
*Chip chuck for chips
*Non-vacuum chuck for 2" wafers
*Non-vacuum chuck for 100 mm and 150 mm wafers
*Non-vacuum chuck for 200 mm wafers
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black"|
1 second rotational agitation at 30 rpm every 15 seconds
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black"|
IPA
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
*Chips
*2" wafers
*100 mm wafers
*150 mm wafers
*200 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom approved materials
*Film, or pattern, of all materials except Type IV
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
1
|-
|}
<br clear="all" />
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