Specific Process Knowledge/Lithography/UVExposure/aligner MLA2: Difference between revisions
Created page with "==Aligner: Maskless 02== 400px|thumb|Aligner: Maskless 02 is located in E-5. MLA150 WMII maskless aligner from Heidelberg Instruments GmbH (installed 2019 as WMI (0.6µm resolution), rebuilt to WMII 2023). '''Special features''' *Optical Autofocus *Backside Alignment *Basic Gray Scale Exposure *Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate *High Aspect Ratio Mode for exposure of thick resists *200 x..." |
|||
| (One intermediate revision by the same user not shown) | |||
| Line 1: | Line 1: | ||
=Aligner: Maskless 02= | |||
[[File:Aligner MLA 2.jpg|400px|thumb|Aligner: Maskless 02 is located in E-5.]] | [[File:Aligner MLA 2.jpg|400px|thumb|Aligner: Maskless 02 is located in E-5.]] | ||
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH (installed 2019 as WMI (0.6µm resolution), rebuilt to WMII 2023). | MLA150 WMII maskless aligner from Heidelberg Instruments GmbH (installed 2019 as WMI (0.6µm resolution), rebuilt to WMII 2023). | ||
| Line 19: | Line 19: | ||
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=440 LabManager] - '''requires login''' | Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=440 LabManager] - '''requires login''' | ||
==Exposure dose and defocus== | |||
[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_02|Information on UV exposure dose]] | [[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners#Aligner:_Maskless_02|Information on UV exposure dose]] | ||
==[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing|Process information]]== | |||
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Exposure_technology|Exposure technology]] | *[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Exposure_technology|Exposure technology]] | ||
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]] | *[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]] | ||
| Line 108: | Line 108: | ||
<br/> | <br/> | ||
==Equipment performance and process related parameters== | |||
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
